High frequency power amplifier
A high frequency power amplifier includes: a multi-finger transistor including transistor cells electrically connected in parallel; an input side matching circuit connected to gate electrodes of the transistor cells; and resonant circuits, each resonant circuit being connected between a gate electrode of a respective one of the transistor cells and the input side matching circuit. The resonant circuits resonate at a second harmonic of the operational frequency of the transistor or at a frequency within a predetermined range centered at the second harmonic and act as a short circuit or exhibit low impedance as seen from the gate electrode.
1. A high frequency power amplifier comprising:
a multi-finger transistor including a plurality of transistor cells electrically connected in parallel;
an input side matching circuit connected to gate electrodes of the plurality of transistor cells; and
resonant circuits, each resonant circuit being connected between a gate electrode of a respective one of the plurality of transistor cells and the input side matching circuit, wherein the resonant circuits resonate at a second harmonic frequency of operational frequency of the transistor or at a frequency within a predetermined range centered at the second harmonic frequency and act as a short circuit or exhibit low impedance as seen from the gate electrode.
2. The high frequency power amplifier as claimed in claim 1 , wherein the predetermined range centered at the second harmonic frequency ranges from 92% to 116% of the second harmonic frequency.
3. The high frequency power amplifier as claimed in claim 1 , wherein:
each resonant circuit includes a capacitance on a different chip from the transistor; and
a first end of each capacitance is connected to a gate electrode of a corresponding one of the plurality of transistor cells by a bonding wire.
4. The frequency power amplifier as claimed in claim 2 , wherein:
each resonant circuit includes a capacitance on a different chip from the transistor; and
a first end of each capacitance is connected to a gate electrode of a corresponding one of the plurality of transistor cells by a bonding wire.
5. The high frequency power amplifier as claimed in claim 3 , wherein a second end of each capacitance is connected to a throughhole by a bonding wire and grounded through the throughhole, the throughhole being in a chip including the transistor.
6. The high frequency power amplifier as claimed in claim 4 , wherein a second end of each capacitance is connected to a throughhole by a bonding wire and grounded through the throughhole, the throughhole being in a chip including the transistor.
7. The high frequency power amplifier as claimed in claim 3 , wherein a second end of each capacitance is grounded through a throughhole in a chip including the capacitance.
8. The high frequency power amplifier as claimed in claim 4 , wherein a second end of each capacitance is grounded through a throughhole in a chip including the capacitance.
9. The high frequency power amplifier as claimed in claim 1 , wherein:
each resonant circuit includes an MIM capacitor on a chip including the transistor;
a first end of each MIM capacitor is connected to a gate electrode of a corresponding one of the plurality of transistor cells by a bonding wire; and
a second end of the MIM capacitor is grounded through a throughhole in the chip including the transistor.
10. The high frequency power amplifier as claimed in claim 2 , wherein:
each resonant circuit includes an MIM capacitor formed on a chip including the transistor;
a first end of each MIM capacitor is connected to a gate electrode of a corresponding one of the plurality of transistor cells by a bonding wire; and
a second end of each MIM capacitor is grounded through a throughhole formed in the chip including the transistor.
11. The high frequency power amplifier as claimed in claim 1 , wherein:
each resonant circuit includes an MIM capacitor, a throughhole, and a spiral inductor on a chip including the transistor;
a first end of each MIM capacitor is connected to a gate electrode of a corresponding one of the plurality of transistor cells through a corresponding spiral inductor; and
a second end of each MIM capacitor is grounded through the throughhole.
12. The high frequency power amplifier as claimed in claim 2 , wherein:
each resonant circuit includes an MIM capacitor, a throughhole, and a spiral inductor that are on a chip including the transistor;
a first end of the MIM capacitor is connected to a gate electrode of a corresponding one of the plurality of transistor cells through a corresponding spiral inductor; and
a second end of each MIM capacitor is grounded through the throughhole.
13. The high frequency power amplifier as claimed in claim 1 , wherein:
each resonant circuit includes an MIM capacitor on a different chip from the transistor; and
a first end of each MIM capacitor is connected to a pad by a bonding wire, the pads extending from the gate electrodes of the plurality of transistor cells in a direction perpendicular to a gate-to-drain direction.
14. The high frequency power amplifier as claimed in claim 2 , wherein:
each resonant circuit includes an MIM capacitor on a different chip from the transistor; and
a first end of each MIM capacitor is connected to a pad by a bonding wire, the pads extending from the gate electrodes of the plurality of transistor cells in a direction perpendicular to a gate-to-drain direction.
15. The high frequency power amplifier as claimed in claim 1 , wherein:
each resonant circuit includes an MIM capacitor, a throughhole, and a spiral inductor that are on a chip including the transistor and disposed on regions adjacent to sides of the transistor, parallel to a gate-to-drain direction;
a first end of each MIM capacitor is connected to a gate electrode of a corresponding one of the plurality of transistor cells through a corresponding spiral inductor; and
a second end of each MIM capacitor is grounded through the throughhole.
16. The high frequency power amplifier as claimed in claim 2 , wherein:
each resonant circuit includes an MIM capacitor, a throughhole, and a spiral inductor that are on a chip including the transistor and disposed on regions adjacent to sides of the transistor, parallel to a gate-to-drain direction;
a first end of each MIM capacitor is connected to a gate electrode of a corresponding one of the plurality of transistor cells through a corresponding spiral inductor; and
a second end of each MIM capacitor is grounded through the throughhole.
17. The high frequency power amplifier as claimed in claim 1 , further comprising a second resonant circuit spaced from the resonant circuits by a distance corresponding to an electrical length of a quarter wavelength at the operational frequency of the transistor.
18. The high frequency power amplifier as claimed in claim 2 , further comprising a second resonant circuit spaced from the resonant circuits by a distance corresponding to an electrical length of a quarter wavelength at the operational frequency of the transistor.
19. A high frequency power amplifier comprising:
a multi-finger transistor including a plurality of transistor cells electrically connected in parallel;
an output side matching circuit connected to drain electrodes of the plurality of transistor cells; and
resonant circuits, each resonant circuit being connected between a drain electrode of a respective one of the plurality of transistor cells and the output side matching circuit, wherein the resonant circuits resonate at a second harmonic frequency of operational frequency of the transistor or at a frequency within a predetermined range centered at the second harmonic frequency and act as a short circuit or exhibit low impedance as seen from the gate electrode.