IP Library Granted Patent US 7,467,022
Granted Patent B2
US 7,467,022 · App. 11/398,785 · Granted Dec 16, 2008

Method for fabricating a hearing aid shell and mold incorporating test fitting by the user

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Quick Facts
Patent No.
US 7,467,022
App. No.
11/398,785
Granted
Dec 16, 2008
Kind
B2
Abstract

In a method for fabricating a hearing aid device, a patient visits an audiologist at a dispenser location, and is examined to determine electronic settings for a hearing aid to correct the patient's hearing impairment. At the same visit, an ear mold of the patient is obtained, which is scanned to produce a three-dimensional data set, from which a prototype is produced from the hearing aid data set, that does not contain any electronic components, and the prototype is test fitted with the patient. By interaction between the patient and the audiologist, the prototype is modified as needed. When the prototype is acknowledged by the patient as being a comfortable fit, the three-dimensional data that were used to create the acceptable prototype are electronically transmitted to a fabrication site, at which the hearing device is manufactured therefrom. The hearing device is then sent to a location at which it is available to the patient.

Claims (12)

1. A method for fabricating a hearing aid comprising the steps of:

by interaction between a patient having a hearing impairment and an audiologist at a dispenser location, determining electronic component and programming specifications for a circuit for a hearing aid to correct said hearing impairment, producing an ear mold of the patient, scanning said ear mold to generate an electronic 3D data set representing a shape and size of said ear mold, creating a test prototype consisting only of an otoplastic or shell for a hearing aid device from said 3D data set, conducting a test fit with the patient of said prototype and, if necessary, modifying said mold to produce a modified mold and re-scanning said modified mold and creating a modified prototype and test fitting the modified prototype with the patient until an acceptable fit is acknowledged by the patient;

only after said acceptable fit is acknowledged by the patient, electronically transmitting the 3D data set for the prototype that was acceptable to the patient, and said electronic specifications to a fabrication site;

at the fabrication site, manufacturing a hearing aid device having an otoplastic or shell conforming to the 3D data set electronically transmitted to the fabrication site with said circuit embodied in said otoplastic or shell; and

sending the hearing aid to a location for pick-up by the patient.

2. A method as claimed in claim 1 wherein the step of sending the hearing aid device to a location for pick-up by the patient comprises sending the hearing aid device to the audiologist at the dispenser location for pick-up by the patient in a follow-up visit.

3. A method as claimed in claim 1 wherein the step of sending the hearing aid device to a location for pick-up by the patient comprises sending the hearing aid device to the patient directly.

4. A method as claimed in claim 1 wherein the step of testing said prototype comprises transmitting simulated audio signals to the patient through an opening in the prototype and, if necessary, additionally modifying the prototype to obtain a sound transmission that is acknowledged as acceptable by the patient.

5. A method as claimed in claim 1 wherein the step of producing said prototype comprises producing a prototype shell from said 3D data set.

6. A method as claimed in claim 1 wherein the step of producing a prototype comprises producing a solid prototype from said 3D set.

7. A method as claimed in claim 1 comprising detailing said 3D data set using a software algorithm before creating said prototype therefrom.

8. A method as claimed in claim 1 comprising employing a computerized algorithm to determine feasibility placement of electronic components, conforming to said electronic specification, in said prototype before creating said prototype.

Assignments (2)
CHANGE OF NAME Recorded Jul 10, 2015
From: SIEMENS AUDIOLOGISCHE TECHNIK GMBH
To: SIVANTOS GMBH
Reel/Frame 036090/0688 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 6, 2006
From: BHAGWAT, VIJAYKIRAN; OWENS, STEVEN
To: SIEMENS AKTIENGESELLSCHAFT
Reel/Frame 017770/0499 →