Security tag and system for fabricating a tag including an integrated surface processing system
View Patent ↗A method of fabricating a tag includes the steps of applying a first patterned adhesive to the surface of the substrate and applying a first electrically conductive foil to the first patterned adhesive. A portion of the first electrically conductive foil not adhered to the first patterned adhesive is removed and a second patterned adhesive is applied to a portion of a surface area of the tag. A preformed second electrically conductive foil is applied to the second patterned adhesive to adhere the second electrically conductive foil to the surface of the substrate and portions of the first and second electrically conductive foils are electrically coupled to each other to form a tag circuit. A second patterned adhesive can be disposed between the first and second electrically conductive foils.
1. A method of fabricating a tag for reflecting electromagnetic energy for the purpose of indicating the presence of said tag, said tag comprising a substrate having a surface, said method comprising:
a. applying a first patterned adhesive on said surface of said substrate;
b. applying a first electrically conductive foil to said first patterned adhesive to adhere said first electrically conductive foil thereto;
c. removing a portion of said first electrically conductive foil not adhered to said first patterned adhesive to form a first electrically conductive trace secured to said surface of said substrate by said first patterned adhesive;
d. applying a second adhesive layer on a portion of a surface area of said tag, said surface area comprising said surface and said first electrically conductive trace;
e. after applying said second adhesive layer on said portion of said surface area of said tag, applying a preformed second electrically conductive trace to said applied second patterned adhesive to adhere said second electrically conductive trace to said surface area; and
f. electrically coupling portions of said first and second electrically conductive traces to each other to form a tag circuit.
2. The method of claim 1 , wherein said second adhesive comprises a dielectric.
3. The method of claim 2 , before step e, comprising the further step of scratching a surface of said dielectric to provide a preferred deactivation point between said first and second electrically conductive traces.
4. The method of claim 2 , wherein said second adhesive is disposed between said first and second electrically conductive traces.
5. The method of claim 1 , wherein one of said first and second electrically conductive traces forms a portion of an inductor and a plate of a capacitor and the other of said first and second electrically conductive traces forms another plate of said capacitor.
6. The method of claim 1 , wherein said tag circuit comprises an antenna.
7. The method of claim 6 , wherein said tag circuit comprises an integrated circuit.
8. The method of claim 7 , wherein said integrated circuit comprises a fuse.
9. The method of claim 7 , wherein said integrated circuit comprises a diode.
10. The method of claim 6 , wherein said tag circuit comprises a dipole antenna circuit.
11. The method of claim 1 , comprising the further step of removing said portion of said first electrically conductive foil by die cutting.
12. The method of claim 1 , comprising the further step of applying a plurality of preformed second electrically conductive traces having at least two differing forms using a windowing machine.
13. The method of claim 1 , comprising the further step of dimpling said tag to provide a preferred deactivation point where said first and second electrically conductive traces are disposed relatively closer to each other.
14. A method of fabricating a tag for reflecting electromagnetic energy for the purpose of indicating the presence of said tag, said tag comprising a substrate having a surface, said method comprising:
a. applying a first patterned adhesive on said surface of said substrate;
b. applying a first electrically conductive foil to said first patterned adhesive to adhere said first electrically conductive foil thereto;
c. removing a portion of said first electrically conductive foil not adhered to said first patterned adhesive to form a first electrically conductive trace secured to said surface of said substrate by said first patterned adhesive;
d. applying a second adhesive on a portion of a surface area of said tag, said surface area comprising said surface and said first electrically conductive trace;
e. after applying said second adhesive layer on said portion of said surface area of said tag, applying a preformed second electrically conductive trace to said applied second adhesive layer to adhere said second electrically conductive trace to said surface area;
f. electrically coupling portions of said first and second electrically conductive traces to each other to form a tag circuit; and
g. applying an image to said substrate with a printing system.
15. The method of claim 14 , wherein said image and said tag circuit are applied to opposite sides of said substrate.