IP Library Granted Patent US 7,646,304
Granted Patent B2
US 7,646,304 · App. 11/400,932 · Granted Jan 12, 2010

Transfer tape strap process

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Quick Facts
Patent No.
US 7,646,304
App. No.
11/400,932
Granted
Jan 12, 2010
Kind
B2
Abstract

A method for efficiently producing a plurality of EAS or RFID tags or inlays that form a label ready for use. The process utilizes a first web of RFID chip straps or capacitor straps that are releasably secured to a liner using only a low tack adhesive and utilizes a second web of coils or antennas which are secured to a second liner. After indexing these two webs, selective heat and pressure are applied to the chips straps or to the capacitor straps to transfer them and electrically couple them to a corresponding coil or antenna. Where both chip straps and capacitor straps are applied to a common antenna, a third web of the additional strap is used in the process.

Claims (5)

1. A web of strap components for forming an EAS or RFID inlay, said web comprising:

a plurality of strap components that are releasably secured to a web liner portion but are separated from adjacent strap components;

wherein each of said strap components comprises a thin, generally planar member comprising a first electrically conductive planar element, a second planar electrically conductive element and a planar dielectric layer disposed between at least portions of said first and second electrically conductive planar elements, whereupon said strap component exhibits a desired capacitance, said first electrically conductive planar element and said second planar electrically conductive element being secured to a first side of a non-conductive layer and wherein a second side of said non-conductive layer is releasably secured to said web liner portion; and

wherein said first electrically conductive planar element comprises an exposed side having an adhesive disposed thereon and wherein said planar dielectric layer comprises an exposed side having an adhesive disposed thereon, said adhesive being used to secure said strap component to an antenna or coil to form said EAS or RFID inlay.

2. The web of claim 1 wherein said second side of said non-conductive layer is releasably secured to said liner using a low tack adhesive.

Assignments (8)
RELEASE OF SECURITY INTEREST Recorded Dec 16, 2013
From: WELLS FARGO BANK, NATIONAL ASSOCIATION
To: CHECKPOINT SYSTEMS, INC.
Reel/Frame 031825/0545 →
SECURITY AGREEMENT Recorded Dec 12, 2013
From: CHECKPOINT SYSTEMS, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 031805/0001 →
SECURITY AGREEMENT Recorded Aug 2, 2012
From: CHECKPOINT SYSTEMS, INC.
To: WELLS FARGO BANK
Reel/Frame 028714/0552 →
TERMINATION OF SECURITY INTEREST IN PATENTS Recorded Jul 22, 2010
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, SUCCESSOR-BY-MERGER TO WACHOVIA BANK, NATIONAL ASSOCIATION, AS ADMINISTRATIVE AGENT
To: CHECKPOINT SYSTEMS, INC.
Reel/Frame 024723/0187 →
NOTICE OF GRANT OF SECURITY INTEREST IN PATENTS Recorded May 6, 2009
From: CHECKPOINT SYSTEMS, INC.
To: WACHOVIA BANK, NATIONAL ASSOCIATION, AS ADMINISTRATIVE AGENT
Reel/Frame 022634/0888 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 17, 2007
From: DUSCHEK, DETLEF
To: CHECKPOINT SYSTEMS INTERNATIONAL GMBH
Reel/Frame 019309/0763 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 17, 2007
From: CHECKPOINT SYSTEMS INTERNATIONAL GMBH
To: CHECKPOINT SYSTEMS, INC.
Reel/Frame 019309/0799 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 1, 2007
From: COTE, ANDRE
To: CHECKPOINT SYSTEMS, INC.
Reel/Frame 019229/0908 →