Digital camera module with small sized image sensor chip package
A digital camera module ( 200 ) includes a lens holder ( 20 ), a lens module ( 30 ) received in the lens holder, and an image sensor chip package ( 40 ) mounted to the lens holder. The lens module includes a lens barrel ( 301 ) movably engaged in the lens holder and at least one lens ( 302 ) received in the lens barrel. The image sensor chip package includes a base ( 401 ), an image sensor chip ( 402 ) mounted on the base, a transparent cover ( 405 ), and an adhesive ( 50 ) positioning the transparent cover with respect to the image sensor chip. The adhesive and the transparent cover cooperatively seal the image sensor chip therein.
1. A digital camera module, comprising:
a lens holder having a stepped shaped rear end comprising a first step surface and a second step a lens module received in the lens holder, the lens module comprising a lens barrel movably engaged in the lens holder and at least one lens received in the lens barrel; and
an image sensor chip package mounted to the lens holder, the image sensor chip package comprising a base, an image sensor chip mounted on the base, a transparent cover, and an adhesive positioning the transparent cover with respect to the image sensor chip, the adhesive and the transparent cover cooperatively sealing the image sensor chip therein, an inner periphery of the first step surface having a dimension larger than that of the outer periphery of the transparent cover and an inner periphery of the second step surface having a dimension slightly smaller than that of the outer periphery of the cover, wherein the second step surface of the lens holder connects with a periphery of a top side of the cover via the adhesive means.
2. A digital camera module, comprising:
a lens holder in a shape of a hollow cylinder, the lens holder having a stepped shaped rear end comprising a first step surface and a second step surface;
a lens module received in the lens holder, comprising a lens barrel and at least one lens received in the lens barrel; and
an image sensor chip package mounted to the lens holder, comprising:
a base comprising a top surface and a plurality of top pads arranged on the top surface;
an image sensor chip mounted on the top surface of the base, the image sensor chip comprising a photosensitive area configured for receiving light transmitted through the lens module, and a plurality of chip pads around the photosensitive area;
a plurality of wires each electrically connecting one of the chip pads of the image sensor chip with a corresponding one of the top pads of the base;
an adhesive means applied on peripheral edge of the image sensor chip, over the wires, the adhesive means covering areas where the wires connect with the chip pads; and
a transparent cover mounted to the image sensor chip via the adhesive means, the cover together with the adhesive means sealing the photosensitive area of the image sensor chip, an inner periphery of the first step surface having a dimension larger than that of the outer periphery of the cover, and an inner periphery of the second step surface having a dimension slightly smaller than that of the outer periphery of the cover, wherein the second step surface of the lens holder connects with a periphery of a top side of the cover via the adhesive means.
3. A digital camera module, comprising:
a lens holder in a shape of a hollow cylinder, the lens holder having a stepped shaped rear end comprising a first step surface and a second step surface;
a lens module received in the lens holder, comprising a lens barrel and at least one lens received in the lens barrel; and
an image sensor chip package mounted to the lens holder, comprising:
a base comprising a top surface and a plurality of top pads arranged on the top surface;
an image sensor chip mounted on the top surface of the base, the image sensor chip comprising a photosensitive area configured for receiving light transmitted through the lens module, and a plurality of chip pads around the photosensitive area;
a plurality of wires each electrically connecting one of the chip pads of the image sensor chip with a corresponding one of the top pads of the base;
an adhesive means applied on peripheral edge of the image sensor chip, over the wires, the adhesive means covering areas where the wires connect with the chip pads; and
a transparent cover mounted to the image sensor chip via the adhesive means, the cover together with the adhesive means sealing the photosensitive area of the image sensor chip, an inner periphery of the first step surface having a dimension larger than that of the outer periphery of the cover, and an inner periphery of the second step surface having a dimension slightly smaller than that of the outer periphery of the cover, wherein, the cover comprises a bottom surface touching the top of each wire.