Conveyor type wet-processing apparatus and treatment of substrate
A wet-processing apparatus for processing substrates is provided. The wet-processing apparatus for processing substrates includes a conveyor type cleaning system and a spinner type wet-processing unit connected to the conveyor type cleaning system. In an embodiment of the present invention, the wet-processing apparatus further includes a cassette station for storing the substrates and a robot installed in the cassette station, wherein the substrate is delivered from the cassette station to the conveyor type cleaning system by the robot. The wet-processing apparatus mentioned above has excellent process uniformity, low consumption of the chemical, good cleaning ability, and low substrate broken frequency.
1 . A conveyor type wet-processing apparatus for processing substrates, comprising:
a conveyor type cleaning system; and
a spinner type wet-processing unit, connected to the conveyor type cleaning system.
2 . A conveyor type wet-processing apparatus of claim 1 , further comprising:
a cassette station for storing the substrates; and
a robot installed in the cassette station, wherein the substrate is delivered from the cassette station to the conveyor type cleaning system by the robot.
3 . A conveyor type wet-processing apparatus of claim 2 , wherein the conveyor type cleaning system comprises:
a pre-cleaning unit disposed between the cassette station and the spinner type wet-processing unit;
a post-cleaning unit connected to the spinner type wet-processing unit; and
a conveyor disposed in the pre-cleaning unit and the post-cleaning unit, wherein the substrates are conveyed from the pre-cleaning unit to the spinner type wet-processing unit and the post-cleaning unit sequentially by the conveyor.
4 . A conveyor type wet-processing apparatus of claim 3 , wherein the pre-cleaning unit comprises an excimer ultraviolet cleaning unit.
5 . A conveyor type wet-processing apparatus of claim 3 , wherein the post-cleaning unit comprises a brushing unit, a wet conveyor, a cavitation jet unit, a mega-sonic unit or the combinations thereof.
6 . A conveyor type wet-processing apparatus for processing substrates, comprising:
a cassette station for storing the substrates;
a spinner type wet-processing unit;
a conveyor type cleaning system, connected to the spinner type cleaning system, wherein the conveyor type cleaning system comprises:
a pre-cleaning unit disposed between the cassette station and the spinner type wet-processing unit;
a post-cleaning unit connected to the spinner type wet-processing unit;
a drying unit connected to the post-cleaning unit;
a conveyor disposed in the pre-cleaning unit, the post-cleaning unit and the drying unit, wherein the substrates are conveyed from the pre-cleaning unit to the spinner type wet-processing unit, the post-cleaning unit and the drying unit sequentially by the conveyor; and
a robot installed in the cassette station, wherein the substrate is delivered from the cassette station to the conveyor type cleaning system by the robot.
7 . A conveyor type wet-processing apparatus of claim 6 , wherein the pre-cleaning unit comprises an excimer ultraviolet cleaning unit.
8 . A conveyor type wet-processing apparatus of claim 6 , wherein the post-cleaning unit comprises a brushing unit, a wet conveyor, a cavitation jet unit, a mega-sonic unit or the combinations thereof.
9 . A conveyor type wet-processing apparatus of claim 6 , wherein the drying unit comprises an air knife.
10 . A conveyor type wet-processing apparatus of claim 1 , wherein the spinner type wet-processing unit comprises an etcher, a stripper or a developer.
11 . A treatment of substrates, comprising:
performing a cleaning process on the substrates by a conveyor type cleaning system;
performing a wet-process on the substrates by a spinner type wet-processing unit connected to the conveyor type cleaning system.
12 . A treatment of substrates of claim 11 , wherein the cleaning process comprises:
performing a pre-cleaning process on the substrates by a pre-cleaning unit;
performing a post-cleaning process on the substrates by a post-cleaning unit after performing the wet-processing; and
performing a drying process on the substrates by a drying unit connected to the post-cleaning unit.
13 . A treatment of substrates of claim 11 , wherein the wet-process comprises a slice etch process, a wet etch process, a stripper, or a developer.