IP Library Patent Application 11403949
Patent Application Utility
App. No. 11/403,949 · Confirmation No. 9096

Heat dissipating assembly using liquid as a heat dissipating medium

Inventor: Chia-Chun Cheng
Abandoned -- Failure to Respond to an Office Action View Publication ↗
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Code Description Pages PDF
2012-02-03 N570 Communication - Re: Power of Attorney (PTOL-308) 1 View
2012-02-03 N570 Communication - Re: Power of Attorney (PTOL-308) 1 View
2012-01-26 PA.. Power of Attorney 2 View
2012-01-26 N417 Electronic Filing System Acknowledgment Receipt 2 View
2012-01-26 R3.73 Assignee showing of ownership per 37 CFR 3.73 2 View
2008-07-09 ABN Abandonment 2 View
2007-12-27 CTNF Non-Final Rejection 8 View
2007-12-27 892 List of references cited by examiner 1 View
2007-12-27 FWCLM Index of Claims 1 View
2007-12-27 SRFW Search information including classification, databases and other search related notes 1 View
2007-12-27 BIB Bibliographic Data Sheet 1 View
2007-12-27 SRNT Examiner's search strategy and results 3 View
2006-04-14 TRNA Transmittal of New Application 1 View
2006-04-14 SPEC Specification 8 View
2006-04-14 CLM Claims 2 View
2006-04-14 ABST Abstract 1 View
2006-04-14 DRW Drawings-only black and white line drawings 8 View
2006-04-14 OATH Oath or Declaration filed 1 View
2006-04-14 WFEE Fee Worksheet (SB06) 1 View
2006-04-14 WFEE Fee Worksheet (SB06) 1 View
2006-04-14 FRPR Certified Copy of Foreign Priority Application 27 View
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Quick Facts
App. No.
11/403,949
Filed
2006-04-14
Pub. No.
US20060238985A1
Art Unit
3744