IP Library Granted Patent US 7,498,392
Granted Patent B2
US 7,498,392 · App. 11/404,044 · Granted Mar 3, 2009

Methods and compositions for dielectric materials

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Quick Facts
Patent No.
US 7,498,392
App. No.
11/404,044
Granted
Mar 3, 2009
Kind
B2
Abstract

The present invention comprises methods and compositions of dielectric materials. The dielectric materials of the present invention comprise materials having a dielectric constant of more than 1.0 and less than 1.9 and/or a dissipation factor of less than 0.0009. Other characteristics include the ability to withstand a wide range of temperatures, from both high temperatures of approximately +260° C. to low temperatures of approximately −200° C., operate in wide range of atmospheric conditions and pressures (e.g., a high atmosphere, low vacuum condition such as that found in the outer-space as well as conditions similar to those found at sea level or below sea level). The dielectric materials of the present invention may be used in the manufacture of composite structures that can be used alone or in combination with other materials, and can be used in electronic components or devices such as RF interconnects.

Claims (18)

1. A polytetrafluoroethylene (PTFE) material, comprising a mixture of at least sintered PTFE resin, which is sintered prior to mixing, and un-sintered PTFE resin, wherein the material comprises at least one of a dielectric constant of more than about 1.0 and less than about 1.9, and a loss tangent of less than about 0.0009.

2. The PTFE material of claim 1 , wherein the PTFE material operates at a temperature from about −200° C. to about +260° C.

3. The PTFE material of claim 1 , wherein the PTFE material operates at a condition, wherein the condition is an under-water condition, an under-ground condition, an atmospheric condition, an outer-space condition, or a condition wherein the low dielectric constant PTFE material is subject to ultraviolet light exposure.

4. The PTFE material of claim 1 , wherein the PTFE material operates at a pressure from a near vacuum pressure to a high pressure, wherein the near vacuum pressure is a pressure found in an outer-space condition, and wherein the high pressure is a pressure found in an under-water or an under-ground condition.

5. The PTFE material of claim 1 , wherein the PTFE material operates after at least one of a physical treatment and a chemical treatment.

6. The PTFE material of claim 5 , wherein one of the at least one of a physical treatment and a chemical treatment is a mechanical treatment, hole-drilling, a heat treatment, lamination, bonding, plating, hot-air-solder-leveling, an acidic aqueous media treatment, a basic aqueous media treatment, or an organic media treatment.

7. The PTFE material of claim 1 , wherein the PTFE material is comprised in an assembly, a laminate, a combination of multiple laminate structures, an electronic device, a circuit, a microstrip circuit, a multilayer circuit, a space saving circuitry, a stripline circuit, a millimeter wave system, a radar system, a ground based radar system, an airborne radar system, a missile guidance system, an antenna, a patch antenna, a point to point digital radio antenna, a phase array antenna, a cellular device, a cellular base station, a wireless device, a mobile communications system, a LAN system, an automotive electronic article, a satellite TV receiver, a computer, a telephone, a microwave, a microwave test equipment, a RF component, a RF interconnect, a power backplate, a commercial airline collision avoidance system, a beam forming network, an airborne identification system, a “friend or foe” identification system, a global positioning antenna, a global positioning receiver, a filter, a coupler, a low noise amplifier, a power divider, a combiner, a power amplifier, an automobile, a space craft, a marine craft, a medical equipment, a pipeline, a transmission device, or a monitoring device.

8. A PTFE material, comprising a mixture of at least sintered PTFE resin and un-sintered PTFE resin having at least one of a dielectric constant of more than about 1.0 and less than about 1.9, and a loss tangent of less than about 0.0009, wherein the PTFE material is obtained in accordance with a method comprising,

a) sintering a plurality of micron sized PTFE resins, thereby obtaining a sintered PTFE resin;

b) mixing a plurality of un-sintered micron sized PTFE resins with the sintered PTFE resin at a predetermined ratio, thereby obtaining a PTFE mixture; and

c) molding the PTFE mixture, thereby obtaining the PTFE material.

9. The PTFE material of claim 8 , further comprising a step of skiving the PTFE material of step c), a step of sintering the PTFE material of step c), or the combination Thereof.

10. The PTFE material of claim 8 , wherein at least one of the plurality of micron sized PTFE resins and the plurality of un-sintered micron sized PTFE resins comprises a filler or a filled PTFE resin.

11. The PTFE material of claim 8 , wherein the PTFE material operates at a temperature from about −200° C. to about +260° C.

12. The PTFE material of claim 8 , wherein the PTFE material operates at a condition, wherein the condition is an under-water condition, an under-ground condition, an atmospheric condition, an outer-space condition, or a condition wherein the PTFE material is subject to ultraviolet light exposure.

13. The PTFE material of claim 8 , wherein the PTFE material operates at a pressure from a near vacuum pressure to a high pressure, wherein the near vacuum pressure is a pressure found in an outer-space condition, and wherein the high pressure is a pressure found in an under-water or an under-ground condition.

14. The PTFE material of claim 8 , wherein the PTFE material operates after at least one of a physical treatment and a chemical treatment.

15. The PTFE material of claim 7 , wherein the PTFE material is comprised in an assembly, a laminate, a combination of multiple laminate structures, an electronic device, a circuit, a microstrip circuit, a multilayer circuit, a space saving circuitry, a stripline circuit, a millimeter wave system, a radar system, a ground based radar system, an airborne radar system, a missile guidance system, an antenna, a patch antenna, a point to point digital radio antenna, a phase array antenna, a cellular device, a cellular base station, a wireless device, a mobile communications system, a LAN system, an automotive electronic article, a satellite TV receiver, a computer, a telephone, a microwave, a microwave test equipment, a RF component, a RF interconnect, a power backplate, a commercial airline collision avoidance system, a beam forming network, an airborne identification system, a “friend or foe” identification system, a global positioning antenna, a global positioning receiver, a filter, a coupler, a low noise amplifier, a power divider, a combiner, a power amplifier, an automobile, a space craft, a marine craft, a medical equipment, a pipeline, a transmission device, or a monitoring device.

Assignments (3)
SECURITY INTEREST Recorded Feb 20, 2017
From: WORLD PROPERTIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 041757/0778 →
SECURITY INTEREST Recorded Jun 26, 2015
From: WORLD PROPERTIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 036021/0047 →
SECURITY AGREEMENT Recorded Dec 2, 2010
From: WORLD PROPERTIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 025438/0024 →