Semiconductor device
View Patent ↗In a semiconductor device adapted to be mounted on a board and to be electrically connected to the board, comprising, at least two semiconductor electric chips, and a substrate on which the semiconductor electric chips are mounted and to which the semiconductor electric chips are electrically connected, in such a manner that the semiconductor electric chips are mounted on and electrically connected to the board through the substrate, according to the present invention, a thickness of each of the semiconductor electric chips in a direction in which the each of the semiconductor electric chips and the substrate are stacked is smaller than a thickness of the substrate in the direction.
1. A semiconductor device adapted to be mounted on a board and to be electrically connected to the board, comprising,
at least two semiconductor chips, and
a substrate on which the semiconductor chips are mounted and to which the semiconductor chips are electrically connected, in such a manner that the semiconductor chips are mounted and electrically connected to the board through the substrate,
wherein a thickness of one of the semiconductor chips in a direction in which each of the semiconductor chips and the substrate are stacked is smaller than a thickness of the substrate in the direction, and Young's modulus of the one of the semiconductor chips is greater than Young's modulus of the substrate.
2. A semiconductor device according to claim 1 , wherein the thickness of the one of the semiconductor chips is greater than a thickness of the other one of the semiconductor chips.
3. A semiconductor device according to claim 1 , wherein a linear expansion coefficient of the substrate is different from a linear expansion coefficient of the board.
4. A semiconductor device according to claim 1 , wherein a linear expansion coefficient of the substrate is smaller than a linear expansion coefficient of the board.
5. A semiconductor device according to claim 1 , further comprising electrically conductive bumps through which at least two semiconductor chips are connected to the substrate.
6. A semiconductor device according to claim 5 , further comprising additional electrically conductive bumps through which the substrate is connected to the board.
7. A semiconductor device adapted to be mounted on a board and to be electrically connected to the board, comprising,
at least two semiconductor chips, and
a substrate on which the semiconductor chips are mounted and to which the semiconductor chips are electrically connected, in such a manner that the semiconductor chips are mounted and electrically connected to the board through the substrate,
wherein a thickness of one of the semiconductor chips in a direction in which each of the semiconductor chips and the substrate are stacked is smaller than a thickness of the substrate in the direction, and a linear expansion coefficient of one of the semiconductor chips is smaller than a linear expansion coefficient of the substrate.
8. A semiconductor device according to claim 7 , wherein the thickness of one of the semiconductor chips is greater than a thickness of the other one of the semiconductor chips.
9. A semiconductor device according to claim 7 , wherein a linear expansion coefficient of the substrate is different from a linear expansion coefficient of the board.
10. A semiconductor device according to claim 7 , wherein a linear expansion coefficient of the substrate is smaller than a linear expansion coefficient of the board.
11. A semiconductor device according to claim 7 , further comprising electrically conductive bumps through which at least two semiconductor chips are connected to the substrate.
12. A semiconductor device according to claim 11 , further comprising additional electrically conductive bumps through which the substrate is connected to the board.
13. A semiconductor device adapted to be mounted on a board and to be electrically connected to the board, comprising,
at least two semiconductor chips,
a substrate on which the semiconductor chips are mounted and to which the semiconductor chips are electrically connected, in such a manner that the semiconductor chips are mounted and electrically connected to the board through the substrate, and
a synthetic resin layer connected to each of the semiconductor chips and the substrate so that each of the semiconductor chips is connected to the substrate through the synthetic resin layer
wherein a thickness of one of the semiconductor chips in a direction in which each of the semiconductor chips in a direction in which each of the semiconductor chips and the substrate are stacked is smaller than a thickness of the substrate in the direction, and Young's modulus of one of the semiconductor chips is greater than Young's modulus of the synthetic resin layer.
14. A semiconductor device according to claim 13 , wherein the thickness of one of the semiconductor chips is greater than a thickness of the other one of the semiconductor chips.
15. A semiconductor device according to claim 13 , wherein a linear expansion coefficient of the substrate is different from a linear expansion coefficient of the board.
16. A semiconductor device according to claim 13 , where a linear expansion coefficient of the substrate is smaller than a linear expansion coefficient of the board.
17. A semiconductor device according to claim 13 , further comprising electrically conductive bumps through which at least two semiconductor chips are connected to the substrate.
18. A semiconductor device according to claim 17 , further comprising additional electrically conductive bumps through which the substrate is connected to the board.
19. A semiconductor device adapted to be mounted on a board and to be electrically connected to the board, comprising,
at least two semiconductor chips, and
a substrate on which the semiconductor chips are mounted and to which the semiconductor chips are electrically connected, in such a manner that the semiconductor chips are mounted and electrically connected to the board through the substrate,
wherein a thickness of one of the semiconductor chips in a direction in which each of the semiconductor chips and the substrate are stacked is smaller than 50% of the thickness of the substrate in the direction.
20. A semiconductor device according to claim 19 , wherein the thickness of one of the semiconductor chips is greater than a thickness of the other one of the semiconductor chips.
21. A semiconductor device according to claim 19 , wherein a linear expansion coefficient of the substrate is different from a linear expansion coefficient of the board.
22. A semiconductor device according to claim 19 , wherein a linear expansion coefficient of the substrate is smaller than a linear expansion coefficient of the board.
23. A semiconductor device according to claim 19 , further comprising electrically conductive bumps through which at least two semiconductor chips are connected to the substrate.
24. A semiconductor device according to claim 23 , further comprising additional electrically conductive bumps through which the substrate is connected to the board.