IP Library Granted Patent US 7,568,961
Granted Patent B2
US 7,568,961 · App. 11/404,208 · Granted Aug 4, 2009

Module for manufacturing a display device, method of manufacturing the same, and method of manufacturing a display device using the same

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Quick Facts
Patent No.
US 7,568,961
App. No.
11/404,208
Granted
Aug 4, 2009
Kind
B2
Abstract

A module for manufacturing a display device, a method for manufacturing the module, and a method for manufacturing a display device using the module, are provided. The module includes a solid substrate, a first flexible substrate, a second flexible substrate, and a third flexible substrate in one embodiment. The solid substrate has an upper surface and a lower surface facing to the upper surface. The first flexible substrate is on the upper surface of the solid substrate, and the second flexible substrate is on the first flexible substrate and has an opening to receive a flexible display substrate that has a display element. The third flexible substrate is on the lower surface of the solid substrate to prevent a bending of the solid substrate. Advantageously, a malfunction of pixels of the display element is decreased, and the module for manufacturing the display device may be recycled to decrease a manufacturing cost of the display device.

Claims (31)

1. A module for manufacturing a display device comprising:

a solid substrate having an upper surface and a lower surface facing to the upper surface;

a first flexible substrate on the upper surface of the solid substrate;

a second flexible substrate on the first flexible substrate, the second flexible substrate having an opening to receive a flexible display substrate that has a display element; and

a third flexible substrate on the lower surface of the solid substrate to prevent a bending of the solid substrate.

2. The module of claim 1 , wherein the solid substrate has a first thermal expansion coefficient and the display substrate has a second thermal expansion coefficient that is greater than the first thermal expansion coefficient.

3. The module of claim 2 , wherein the first to third flexible substrates comprise a third thermal expansion coefficient that is greater than the first thermal expansion coefficient and smaller than the second thermal expansion coefficient.

4. The module of claim 1 , wherein the solid substrate is a glass substrate.

5. The module of claim 1 , wherein the first to third flexible substrates comprise polyetheretherketone (PEEK).

6. The module of claim 1 , further comprising an adhesive member between the solid substrate and the first flexible substrate, between the first and second flexible substrates, and between the solid substrate and the third flexible substrate.

7. The module of claim 1 , wherein a first thickness of the first flexible substrate is smaller than a second thickness of the second flexible substrate.

8. The module of claim 1 , wherein a pressure between the first and second flexible substrates and the display substrate is smaller than an atmospheric pressure.

9. The module of claim 1 , wherein the solid substrate is a metal substrate.

10. The module of claim 9 , wherein the solid substrate further comprises a protecting wall on side surfaces of the solid substrate.

11. A method of manufacturing a module for manufacturing a display device, the method comprising:

preparing a solid substrate having an upper surface and a lower surface facing to the upper surface;

attaching a first flexible substrate to the upper surface of the solid substrate;

attaching a second flexible substrate to the lower surface of the solid substrate; and

attaching a third flexible substrate having an opening to the first flexible substrate.

12. The method of claim 11 , wherein the solid substrate is a glass substrate.

13. The method of claim 11 , wherein the first to third flexible substrates comprise polyetheretherketone (PEEK).

14. The method of claim 11 , wherein the solid substrate is a metal substrate, and a protecting wall is formed on exposed side surfaces of the metal substrate to prevent erosion of the metal substrate.

15. A method of manufacturing a display device, the method comprising:

preparing a module including a solid substrate that has an upper surface and a lower surface facing to the upper surface, a first flexible substrate on the upper surface, a second flexible substrate on the lower surface to prevent a bending of the solid substrate, and a third flexible substrate on the first flexible substrate and having an opening;

arranging a flexible display substrate in the opening;

forming a sealing member on an interface between the display substrate and the third flexible substrate;

forming a display element on the display substrate; and

cutting the sealing member so that the display substrate is separated from the module.

16. The method of claim 15 , further comprising removing an air between the display substrate and the first and second flexible substrates after the arranging of the flexible display substrate in the opening.

17. The method of claim 16 , wherein the removing of air comprises compressing the display substrate by a roller.

18. The method of claim 16 , wherein the cutting of the sealing member comprises irradiating a laser beam.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 23, 2012
From: SAMSUNG ELECTRONICS CO., LTD.
To: SAMSUNG DISPLAY CO., LTD.
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