Semiconductor device
View Patent ↗A semiconductor device comprises a semiconductor chip having a rear surface provided with an uneven structure having a preselected pattern and comprised of concave and convex portions. The preselected pattern of the uneven structure is tilted so as to be in parallel to a crystal orientation of <110> of the semiconductor chip. An electrode is disposed on the concave and convex portions of the uneven structure.
1. A semiconductor device comprising:
a semiconductor chip having a rear surface and an uneven structure provided on the entire rear surface, the uneven structure having a preselected pattern and being comprised of concave and convex portions, the convex portions having surfaces forming outermost surface portions of the uneven structure, and the preselected pattern of the uneven structure being tilted so as to be parallel to a crystal orientation of <100> of the semiconductor chip;
an electrode disposed on the concave and convex portions of the uneven structure; and
a conductive paste disposed on the concave and convex portions of the uneven structure except for the surfaces of the convex portions forming the outermost surface portions of the uneven structure.
2. A semiconductor device according to claim 1 ; wherein the preselected pattern of the uneven structure is a stripe pattern.
3. A semiconductor device according to claim 1 ; wherein the preselected pattern of the uneven structure is a lattice pattern.
4. A semiconductor device according to claim 1 ; further comprising a lead frame disposed in direct contact with the surfaces of the convex portions forming the outermost surface portions of the uneven structure.
5. A semiconductor device comprising:
a semiconductor chip having a rear surface and an uneven structure provided on the entire rear surface, the uneven structure being comprised of concave and convex portions having a preselected pattern tilted so as to be parallel to a crystal orientation of <100> of the semiconductor chip the convex portions having surfaces forming outermost surface portions of the uneven structure; a conductive paste disposed on the concave and convex portions of the uneven structure except for the surfaces of the convex portions forming the outermost surface portions of the uneven structure;
an electrode disposed on the concave and convex portions of the uneven structure of the semiconductor chip; and
a lead frame disposed in direct contact with the electrode.
6. A semiconductor device according to claim 5 ; wherein the preselected pattern of the uneven structure is a stripe pattern.
7. A semiconductor device according to claim 5 ; wherein the preselected pattern of the uneven structure is a lattice pattern.
8. A semiconductor device according to claim 5 ; and wherein the concave and convex portions are formed from portions of the semiconductor chip.
9. A semiconductor device according to claim 8 ; wherein the convex portions extend into the surface of the semiconductor chip.
10. A semiconductor device according to claim 8 ; wherein the electrode is disposed directly on the concave and convex portions.
11. A semiconductor device comprising: a semiconductor chip having a rear surface and an uneven structure provided on the entire rear surface, the uneven structure having concave and convex portions, the convex portions having surfaces forming outermost surface portions of the uneven structure, and the uneven structure having a preselected pattern tilted so as to be parallel to both a crystal orientation of <100> of the semiconductor chip and a crystal orientation of <110> of the semiconductor chip; and an electrode disposed on the uneven structure of the semiconductor chip; and a conductive paste disposed on the concave and convex portions of the uneven structure except for the surfaces of the convex portions forming the outermost surface portions of the uneven structure.
12. A semiconductor device according to claim 11 ; wherein the preselected pattern of the uneven structure is a nonlinear pattern.
13. A semiconductor device according to claim 11 ; further comprising a lead frame disposed in direct contact with the electrode.
14. A semiconductor device according to claim 11 ; further comprising a lead frame disposed in direct contact with the surfaces of the convex portions forming the outermost surface portions of the uneven structure.
15. A semiconductor device according to claim 11 ; wherein the concave and convex portions are formed from portions of the semiconductor chip.
16. A semiconductor device according to claim 15 ; wherein the convex portions extend into the surface of the semiconductor chip.
17. A semiconductor device according to claim 15 ; wherein the electrode is disposed directly on the concave and convex portions.