IP Library Patent Application 11405084
Patent Application
App. No. 11/405,084

Process for forming a multilayer film and the film formed therefrom

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Quick Facts
Patent No.
US None
App. No.
11/405,084
Abstract

In one embodiment, the process for forming a multilayer film comprises disposing a supportive layer adjacent to an imprinting layer to form a multilayer film and imprinting microstructures in the imprinting layer as the multilayer film passes between a heated roller and a compression roller. The multilayer film is free of a removable carrier layer. The supportive layer has a supportive layer glass transition temperature that is greater than or equal to about 15° C. higher than the imprinting layer glass transition temperature and/or the supportive layer has a supportive layer melting temperature that is greater than or equal to about 15° C. higher than an imprinting layer melting temperature. The imprinting temperature is lower than the supportive layer melting temperature.

Claims (31)

1 . A process for forming a multilayer film, comprising:

disposing a supportive layer adjacent to an imprinting layer to form a multilayer film;

imprinting microstructures in the imprinting layer at an imprinting temperature as the multilayer film passes between a heated roller and a compression roller, wherein the multilayer film is free of a removable carrier layer; and

wherein the supportive layer has a supportive layer glass transition temperature that is greater than or equal to about 15° C. higher than the imprinting layer glass transition temperature and/or the supportive layer has a supportive layer melting temperature that is greater than or equal to about 15° C. higher than an imprinting layer melting temperature; and

wherein the imprinting temperature is lower than both the supportive layer melting temperature and the supportive layer glass transition temperature.

2 . The process of claim 1 , wherein disposing the supportive layer adjacent to the imprinting layer further comprises co-extruding the imprinting layer and the supportive layer to form the multilayer film.

3 . The process of claim 2 , further comprising

passing the co-extruded imprinting layer and supportive layer through a nip between calendering rolls;

cooling the co-extruded imprinting layer and supportive layer; and

disposing a texture on a second side of the supportive layer opposite the imprinting layer.

4 . The process of claim 1 , wherein disposing the supportive layer adjacent to the imprinting layer further comprises

forming the supportive layer with a desired surface texture on a second side;

forming the imprinting layer; and

disposing the imprinting layer adjacent to a first side of the supportive layer.

5 . The process of claim 4 , further comprising disposing a third layer between the imprinting layer and the supportive layer.

6 . The process of claim 1 , wherein the supportive layer glass transition temperature is greater than or equal to about 30° C. higher than the imprinting layer glass transition temperature.

7 . The process of claim 6 , wherein the supportive layer glass transition temperature is greater than or equal to about 45° C. higher than the imprinting layer glass transition temperature.

8 . The process of claim 1 , wherein the imprinting layer glass transition temperature is less than or equal to about 115° C. and the supportive layer glass transition temperature is about 135° C.

9 . The process of claim 8 , wherein the imprinting layer glass transition temperature is about 90° C. to about 105° C. and the supportive layer glass transition temperature is about 140° C. to about 150° C.

10 . The process of claim 9 , wherein the imprinting layer comprises polycarbonate-polyester copolymer, and wherein the supportive layer comprises polycarbonate.

11 . The process of claim 1 , wherein the supportive layer melting temperature is greater than or equal to about 30° C. higher than the imprinting layer melting temperature.

12 . The process of claim 6 , wherein the supportive layer melting temperature is greater than or equal to about 45° C. higher than the imprinting layer melting temperature.

13 . The process of claim 1 , wherein the supportive layer physically contacts the compression roller.

14 . The process of claim 1 , wherein the imprinting temperature is greater than or equal to 10° C. lower than both the supportive layer melting temperature and the supportive layer glass transition temperature.

15 . The process of claim 14 , wherein the imprinting temperature is greater than or equal to 20° C. lower than both the supportive layer melting temperature and the supportive layer glass transition temperature.

16 . A process for forming a multilayer film, comprising:

heating an imprinting layer to an imprinting layer temperature; and

imprinting microstructures in the imprinting layer to form a multilayer film comprising the imprinting layer and a supportive layer;

wherein a supportive layer physically contacts the compression roller during processing and has a supportive layer glass transition temperature that is greater than or equal to about 15° C. higher than the imprinting layer glass transition temperature and/or the supportive layer has a supportive layer melting temperature that is greater than or equal to about 15° C. higher than an imprinting layer melting temperature.

17 . The process of claim 16 , wherein the imprinting temperature is greater than or equal to 20 ° C. lower than both the supportive layer melting temperature and the supportive layer glass transition temperature.

18 . The process of claim 16 , wherein during imprinting, the multilayer film consists of the imprinting layer, the supportive layer, and optionally a layer therebetween.

Assignments (3)
SECURITY AGREEMENT Recorded Aug 18, 2008
From: SABIC INNOVATIVE PLASTICS IP B.V.
To: CITIBANK, N.A., AS COLLATERAL AGENT
Reel/Frame 021423/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 1, 2008
From: GENERAL ELECTRIC COMPANY
To: SABIC INNOVATIVE PLASTICS IP B.V.
Reel/Frame 020985/0551 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 17, 2006
From: HU, YU; VAISH, NITIN; CAPALDO, KEVIN PATRICK; YEUNG, CHUNGHEI
To: GENERAL ELECTRIC COMPANY
Reel/Frame 017796/0928 →