Chip-scale package
View Patent ↗A method for manufacturing a semiconductor package that includes forming a frame inside a conductive can, the frame being unwettable by liquid solder.
1. A process for manufacturing a semiconductor package, comprising:
forming a frame comprised of solder resist inside a conductive can to define a receiving area inside said can for receiving a semiconductor device, said frame being unwettable by solder in liquid phase;
providing a semiconductor device having a first power electrode on one surface thereof;
interposing a solder paste mass between said surface area and said first power electrode;
reflowing said solder mass; and
solidifying said solder mass, wherein said conductive can includes a web portion,and a wall surrounding said web portion , and wherein said frame is formed on said web portion between said wall and said receiving area, wherein said frame surrounds said receiving area.
2. The process of claim 1 , wherein said semiconductor device is a power semiconductor device.
3. The process of claim 1 , wherein said semiconductor device is a power MOSFET.
4. The process of claim 1 , wherein said semiconductor device is an IGBT.
5. The process of claim 1 , wherein said semiconductor device is a diode.
6. The process of claim 1 , wherein said frame is drop-on-demand deposited.
7. The process of claim 1 , wherein said frame is stencil printed.
8. The process of claim 1 , wherein said conductive can is comprised of copper.
9. The process of claim 1 , wherein said conductive can is plated with silver or gold.
10. The process of claim 1 , wherein said conductive can includes an exterior surface coated with a high thermal absorption dielectric.
11. The process of claim 10 , wherein said dielectric is a polymer.
12. The process of claim 10 , wherein said dielectric is a pigmented polymer.
13. The process of claim 1 , wherein said frame is comprised of a passivation material.
14. The process of claim 13 , wherein said passivation material is an oxide.
15. The process of claim 1 , further comprising drop-on-demand depositing a high thermal absorption dielectric on the exterior surface of said conductive can.
16. The process of claim 15 , wherein said thermal absorption dielectric is a high thermal conductivity polymer.