IP Library Granted Patent US 7,229,317
Granted Patent B2
US 7,229,317 · App. 11/405,950 · Granted Jun 12, 2007

Shielding tabs for reduction of electromagnetic interference

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Quick Facts
Patent No.
US 7,229,317
App. No.
11/405,950
Granted
Jun 12, 2007
Kind
B2
Abstract

An EMI shielding mechanism for use with an electronic module, such as an opto-electronic transceiver module, is disclosed. The EMI shielding mechanism includes a plurality of shielding tabs disposed on an outside face of the module. When the module is fully disposed in a port of a host device, the shielding tabs contact an edge of the port, thus reducing the amount of EMI radiation emitted form that edge. The shielding tabs are angled so that when the module is fully disposed in the port, a portion of the shielding tabs is inside the port and a portion is outside of the port. The angled shielding tabs provide a spring force which assists a user to extract the module from the port.

Claims (37)

1. An electronic module housing configured to be received within a port of a host, the housing comprising:

an opening configured to allow electrical connection between a printed circuit board within the housing and a host connector when the electronic module is received within the port; and

at least one shielding tab formed on a face of the housing, the at least one shielding tab depending from the face of the housing at an angle to the housing, the at least one shielding tab being sized and configured to apply a spring force to a first edge of the port when the electronic module is received within the port such that the spring force assists in extraction of the module from the port when the module is removed from the port.

2. The housing as recited in claim 1 , wherein at least a portion of the at least one shielding tab remains outside the opening of the port when the electronic module is received within the port.

3. The housing as recited in claim 1 , wherein the housing is substantially rectangular in cross-sectional shape defining four faces, wherein the housing encloses at least a portion of the printed circuit board.

4. The housing as recited in claim 1 , wherein a plurality of shielding tabs are formed on edges located on three faces of the housing and a latching mechanism is located upon a fourth face of the housing.

5. The housing as recited in claim 1 , wherein the angle of the at least one shielding tab with respect to the housing is between about 20 degrees and about 45 degrees.

6. The housing as recited in claim 1 , wherein the at least one shielding tab is at least partially curved outward away from the housing along substantially the entire length of the at least one shielding tab.

7. The housing as recited in claim 1 , wherein a second edge of the port is opposite to the first edge of the port, the spring force urging the module away from the first edge of the port and toward the second edge of the port to reduce EMI radiation through the opening of the port.

8. The housing as recited in claim 7 , wherein the spring force reduces space between a face of the housing and the second edge of the port to reduce EMI radiation through the opening of the port.

9. The housing as recited in claim 1 , wherein a top face of the housing includes a locking recess that is sized and shaped to expose a locking pin of a latching mechanism to secure the housing within the port.

10. An electronic module comprising:

a printed circuit board including an interface configured to electrically connect the printed circuit board with a host device when the module is received within a port of the host device;

a housing including:

an opening;

an interior portion that at least partially encloses the printed circuit board; and

at least one shielding tab disposed on a face of the housing, the at least one shielding tab depending outwardly from the housing at an angle to the housing such that at least a portion of the at least one shielding tab remains outside the opening of the port when the housing is received within the port.

11. The module as recited in claim 10 , wherein the at least one shielding tab contacts a first edge of the port thereby applying a spring force against the first edge of the port.

12. The module as recited in claim 10 , wherein the at least one shielding tab is formed of a resilient material and the angling and resiliency of the at least one shielding tab assists in extracting the module from the port.

13. The module as recited in claim 10 , wherein the housing has a substantially rectangular cross-sectional shape and encloses the printed circuit board on at least four sides.

14. The module as recited in claim 10 , wherein a plurality of shielding tabs are formed on edges located along three sides of the housing and a latching mechanism is located upon a fourth side of the housing.

15. The module as recited in claim 10 , wherein a top face of the housing includes a locking recess that is sized and shaped to expose a locking pin to secure the module within the port.

16. The module as recited in claim 10 , wherein the angle of the at least one shielding tab with respect to the housing is between about 20 degrees and 45 degrees.

17. The module as recited in claim 10 , wherein the at least one shielding tab is at least partially curved outward in a direction away from the module along substantially an entire length of the at least one shielding tab.

18. The module as recited in claim 10 , wherein at least a portion of the at least one shielding tab resiliently flexes so as to be disposed within a perimeter of the port when the module is received within the port.

19. The module as recited in claim 10 , wherein a second edge of the port engages a portion of a latching mechanism coupled to the module to provide EMI shielding.

20. The module as recited in claim 19 , wherein the latching mechanism further comprises:

a locking pin; and

a bail that is operatively attached to the module so as to be selectively moveable between at least a first and a second position.

21. The module as recited in claim 10 , wherein the second edge of the port is opposite to the first edge of the port, the spring force urging the module away from the first edge of the port and toward the second edge of the port to reduce EMI radiation through the opening of the port.

22. An electronic module comprising:

a printed circuit board including an interface configured to electrically connect the printed circuit board with a host device when the module is received within a port of the host device;

a housing including:

an opening;

an interior portion that at least partially encloses the printed circuit board; and

at least one shielding tab disposed on a face of the housing, the at least one shielding tab depending outwardly at an angle from the housing such that at least a portion of the at least one shielding tab contacts an edge of the port when the housing is received within the port, wherein the housing is secured to a wall of the port and at least partially enclosed within the port when it is received within the port.

23. The module as recited in claim 22 , wherein the housing has a substantially rectangular cross-sectional shape and encloses the printed circuit board on at least four sides and wherein the port has a substantially rectangular cross-sectional shape and encloses the module on at least four sides when then module is received by the port.

Assignments (5)
PATENT RELEASE AND REASSIGNMENT Recorded Jul 5, 2022
From: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
To: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.; KAILIGHT PHOTONICS, INC.; COADNA PHOTONICS, INC.; OPTIUM CORPORATION; FINISAR CORPORATION; II-VI OPTICAL SYSTEMS, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; II-VI DELAWARE, INC.; II-VI OPTOELECTRONIC DEVICES, INC.; PHOTOP TECHNOLOGIES, INC.
Reel/Frame 060574/0001 →
SECURITY INTEREST Recorded Jul 1, 2022
From: II-VI INCORPORATED; II-VI DELAWARE, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; PHOTOP TECHNOLOGIES, INC.; COHERENT, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 060562/0254 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 1, 2020
From: FINISAR CORPORATION
To: II-VI DELAWARE, INC.
Reel/Frame 052286/0001 →
NOTICE OF GRANT OF SECURITY INTEREST IN PATENTS Recorded Sep 25, 2019
From: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.; KAILIGHT PHOTONICS, INC.; COADNA PHOTONICS, INC.; OPTIUM CORPORATION; FINISAR CORPORATION; II-VI OPTICAL SYSTEMS, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; II-VI DELAWARE, INC.; II-VI OPTOELECTRONIC DEVICES, INC.; PHOTOP TECHNOLOGIES, INC.
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 050484/0204 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 1, 2006
From: TOGAMI, CHRIS; SASSER, GARY; WEBER, ANDREAS
To: FINISAR CORPORATION
Reel/Frame 018041/0466 →