Reliable piezo-resistive pressure sensor
View Patent ↗A pressure sensor system for measuring the pressure of a corrosive media includes a silicon plate forming a diaphragm and a glass plate or ring bonded to said silicon plate with an opening over the diaphragm. The diaphragm has resistive areas of different orientations to provide first resistive areas which have increased resistance with diaphragm deflection, and other areas which have decreased or little change in resistance with diaphragm deflection. The resistive areas may be formed by doping the silicon plate. The resistive areas have broad doped connectors extending outward to areas beyond the seal between the glass plate or ring, to wire bond areas on the silicon plate. Accordingly, the wire bond pads are not exposed to the corrosive media.
1. A pressure transducer system comprising:
a silicon plate having a reduced thickness area forming a diaphragm;
a glass plate or ring overlying and bonded to the silicon plate and having an opening over the diaphragm, the silicon plate having an exposed extent beyond the glass plate or ring;
resistive areas formed on the surface of the diaphragm, wherein radially extending resistive areas formed on the diaphragm increase resistance with deflection of the diaphragm, and resistive areas formed on the diaphragm perpendicular to the radially extending resistive areas reduce resistance or have little change in resistance with deflection of the diaphragm;
conductive paths coupling wire bond pads on the exposed extent of the silicon plate and the resistive areas; and
circuitry coupled to the wire bond pads for providing an output signal that varies with the pressure applied to the diaphragm.
2. A pressure transducer system as defined in claim 1 , further comprising a very thin passivation layer extending over the surface of the diaphragm.
3. A pressure transducer system as defined in claim 1 , further comprising an input pressure port coupled to the glass plate and being bonded thereto by adhesive that is impervious to the media being sensed by the system.
4. A pressure transducer system as defined in claim 1 wherein the circuitry includes a Wheatstone bridge.
5. A pressure transducer system as defined in claim 1 , wherein the glass plate and the silicon plate are anodically bonded to one another.
6. A pressure transducer system as defined in claim 1 wherein the surface of the silicon plate facing the glass plate or ring is substantially flat and the other side of the silicon plate has an etched recess forming the diaphragm.
7. A pressure transducer system comprising:
a semiconductor plate having a reduced thickness area forming a diaphragm;
a glass plate or ring overlying and bonded to the semiconductor plate and having an opening over the diaphragm, the semiconductor plate having an exposed extent beyond the glass plate or ring;
resistive areas formed on the surface of the diaphragm, wherein radially extending resistive areas formed on the diaphragm to increase resistance with deflection of the diaphragm, and resistive areas formed on the diaphragm perpendicular to the radially extending resistive areas reduce resistance or have little change in resistance with deflection of the diaphragm;
conductive paths coupling wire bond pads on the exposed extent of the semiconductor plate and the resistive areas; and
circuitry coupled to the wire bond pads for providing an output signal that varies with the pressure applied to the diaphragm.
8. A pressure transducer system as defined in claim 7 , further comprising a very thin passivation layer extending over the surface of the diaphragm.
9. A pressure transducer system as defined in claim 7 , further comprising an input pressure port coupled to the glass plate and being bonded thereto by adhesive that is impervious to the media being sensed by the system.
10. A pressure transducer system as defined in claim 7 , wherein the circuitry includes a Wheatstone bridge.
11. A pressure transducer system as defined in claim 7 , wherein the glass plate and the semiconductor plate are anodically bonded to one another.
12. A pressure transducer system as defined in claim 7 , wherein the surface of the semiconductor plate facing the glass plate or ring is substantially flat and the other side of the silicon plate has an etched recess forming the diaphragm.
13. A pressure transducer system comprising:
a semiconductor plate having a reduced thickness area forming a diaphragm;
a glass plate or ring overlying and bonded to the semiconductor plate and having an opening over the diaphragm, the semiconductor plate having an exposed extent beyond the glass plate or ring;
sensors coupled to the diaphragm and that vary in electrical properties with deflection of the diaphragm, wherein at least two of the sensors are perpendicular to each other;
conductive paths coupling wire bond pads on the exposed extent of the semiconductor plate and the sensors; and
circuitry coupled to the wire bond pads for providing an output signal that varies with the pressure applied to the diaphragm.
14. A pressure transducer system as defined in claim 13 , further comprising a very thin passivation layer extending over the surface of the diaphragm.
15. A pressure transducer system as defined in claim 13 , further comprising an input pressure port coupled to the glass plate and being bonded thereto by adhesive that is impervious to the media being sensed by the system.
16. A pressure transducer system as defined in claim 13 , wherein the circuitry includes a Wheatstone bridge.
17. A pressure transducer system as defined in claim 13 , wherein the glass plate and the semiconductor plate are anodically bonded to one another.
18. A pressure transducer system as defined in claim 13 , wherein the surface of the semiconductor plate facing the glass plate or ring is substantially flat and the other side of the silicon plate has an etched recess forming the diaphragm.