SAW component with adhesive location and use thereof
View Patent ↗The invention is an adhesive, in particular, for components that operate with surface acoustic waves, including a polymer matrix filled with mineral filler particles. The filler is selected from non-conductive or semi-conductive materials and is contained in the adhesive in such a proportion that the total density of the adhesive when cured is greater than 2000 kg/m 3 .
1. A surface acoustic wave (SAW) component, comprising:
a film of an adhesive having:
a polymer matrix; and
a filler including one of non-conductive and semiconductive mineral particles in such a proportion that a total density of said adhesive when cured is greater than 2500 kg/m 3 .
2. The component according to claim 1 , wherein said mineral particles are selected from the group consisting of silicon carbide, titanium oxide, aluminum oxide, zinc sulfide, ZrO 2 , BaSO 4 , and WO 3 .
3. The component according to claim 1 , wherein said polymer matrix is a polymer matrix selected from the group consisting of epoxy resin, siloxane-caoutchouc, acrylate, polyurethane, and polyimide.
4. The component according to claim 1 , wherein:
said adhesive is a two-component reaction resin system with a resin component and a curing component; and
said filler is included in at least one of said components.
5. The component according to claim 2 , wherein:
said adhesive is a two-component reaction resin system with a resin component and a curing component; and
said filler is included in at least one of said components.
6. The component according to claim 3 , wherein:
said adhesive is a two-component reaction resin system with a resin component and a curing component; and
said filler is included in at least one of said components.
7. The component according to claim 1 , wherein:
said adhesive is a two-component reaction resin system with a resin component and a curing component; and
said filler is included in one or both of said components.
8. The component according to claim 1 , wherein said adhesive further comprises a photo-initiator.
9. The component according to claim 1 , further comprising:
a shaped body; and
a component body glued to said shaped body at an adhesive location by said adhesive.
10. The component according to claim 9 , further comprising
a mechanically stable support glued to said component body.
11. The component according to claim 9 , wherein:
said component body has a main top surface free of active component element structures; and
said component body is a chip of a piezo-electric material and said shaped body glued to said main top surface.
12. The component according to claim 1 , wherein said film of said adhesive dampens surface acoustic waves.
13. The component according to claim 1 , wherein said component is a SAW component used for a multimedia application.
14. A surface acoustic wave (SAW) component, comprising:
a film of an adhesive having:
a polymer matrix; and
a filler including one of non-conductive and semiconductive mineral particles in such a proportion that a total density of said adhesive when cured is between approximately 2,500 kg/m 3 and approximately 7,300 kg/m 3 .
15. The component according to claim 14 , wherein a total density of said adhesive when cured is between approximately 2,500 kg/m 3 and approximately 3,000 kg/m 3 .
16. The component according to claim 14 , wherein a total density of said adhesive when cured is between approximately 2,500 kg/m 3 and approximately 4,000 kg/m 3 .
17. The component according to claim 14 , wherein a total density of said adhesive when cured is between approximately 3,000 kg/m 3 and approximately 4,000 kg/m 3 .
18. The component according to claim 14 , wherein a total density of said adhesive when cured is between approximately 3,000 kg/m 3 and approximately 7,300 kg/m 3 .
19. The component according to claim 14 , wherein a total density of said adhesive when cured is between approximately 4,000 kg/m 3 and approximately 7,300 kg/m 3 .
20. The component according to claim 14 , wherein:
said mineral particles are selected from the group consisting of silicon carbide, titanium oxide, aluminum oxide, zinc sulfide, ZrO 2 , BaSO 4 , and WO 3 ; and
said polymer matrix is a polymer matrix selected from the group consisting of epoxy resin, siloxane-caoutchouc, acrylate, polyurethane, and polyimide.
21. The component according to claim 14 , wherein:
said adhesive is a two-component reaction resin system with a resin component and a curing component; and
said filler is included in at least one of said components.
22. The component according to claim 14 , wherein said adhesive further comprises a photo-initiator.
23. The component according to claim 14 , further comprising:
a shaped body; and
a component body glued to said shaped body at an adhesive location by said adhesive.
24. The component according to claim 23 , further comprising a mechanically stable support glued to said component body.
25. The component according to claim 23 , wherein:
said shaped body has a main top surface free of active component element structures; and
said component body is a chip of a piezo-electric material glued to said main top surface.
26. The component according to claim 14 , wherein said film of said adhesive dampens surface acoustic waves.
27. A surface acoustic wave (SAW) component, comprising:
a film of an adhesive having:
a polymer matrix; and
a filler including particles to have a total density of said adhesive when cured to be between approximately 2,500 kg/m 3 and approximately 7,300 kg/m 3 .
28. The component according to claim 27 , wherein said particles are non-conductive or semiconductive mineral particles.