Temperature probe and method of making the same
View Patent ↗A temperature probe assembly is provided. The temperature probe assembly may comprise a housing formed of a first thermally conductive material and having an inner diameter defined by an inner bore, an insert formed of a second thermally conductive material disposed in the inner bore and having an outer diameter that is substantially equal to the inner diameter of the housing at a first temperature and a temperature sensor mounted within the insert. The second thermally conductive material has a thermal coefficient of expansion that is greater than the first thermally conductive material, such that the insert is insertable into the inner bore at the first temperature and is tightly locked in the inner bore at a second temperature that is greater than the first temperature.
1. A temperature probe assembly comprising:
a housing formed of a first thermally conductive material and having an inner diameter defined by an inner bore;
a solid insert formed of a second thermally conductive material disposed in the inner bore and having an outer diameter that is substantially equal to the inner diameter of the housing at a first temperature;
a temperature sensor mounted within the insert; and
wherein the second thermally conductive material has a thermal coefficient of expansion that is greater than the first thermally conductive material, such that the solid insert is insertable into the inner bore at the first temperature and is tightly locked in the inner bore at a second temperature that is greater than the first temperature.
2. The probe assembly of claim 1 , wherein the solid insert is formed of substantially pure silver.
3. The probe assembly of claim 1 , wherein the solid insert is formed of one of annealed copper, gold, aluminum, tungsten, molybdenum and magnesium.
4. The probe assembly of claim 1 , wherein the housing is formed of one of any variation in alloys of inconel, stainless steel, hastelloy, copper, brass or other conductive alloy.
5. The probe assembly of claim 1 , wherein the first temperature is in a range of about −40° F. (−40° C.) to about −100° F. (−73.33° C.).
6. The probe assembly of claim 5 , wherein the first temperature is about 70° F. (−56.67° C.).
7. The probe assembly of claim 5 , wherein the second temperature is greater than or equal to about 32° F. (0° C.).
8. The probe assembly of claim 1 , wherein the housing and the solid insert have cylindrical shapes, the solid insert being disposed at one end of the housing and in thermal contact with the housing.
9. The probe assembly of claim 1 , wherein the temperature sensor is a resistive temperature device (RTD) element comprised of one of platinum, nickel, nickel-iron, copper or other suitable metals.
10. The probe assembly of claim 9 , wherein the RTD element is a precision thin film RTD element comprised of one of platinum, nickel, nickel-iron, copper or other suitable metals.