Attaching heat sinks to integrated circuit packages
View Patent ↗This invention relates to arrangements for attaching a heat sink to an integrated circuit package. The heat sink comprises magnetic material, magnetized in one polarity, and the circuit package comprises magnetic material either unmagnetized or magnetized in the opposite polarity. When the heat sink and circuit package are placed in contact with one another, they are attracted magnetically. This forms a bond for attaching the heat sink to the integrated circuit package. Advantageously, this arrangement for attracting a heat sink avoids distorting or otherwise damaging the circuit package and speeds assembly time.
1. An integrated circuit package comprising:
a substrate interconnecting a plurality of devices; and
a heat sink;
wherein said heat sink comprises magnetic material;
wherein said substrate comprises magnetic material;
wherein, when said heat sink is brought into proximity with said substrate, a bond between said substrate and said heat sink is formed due to magnetic attraction between said substrate and said heat sink;
said substrate further comprising a block of high heat conductivity material surrounding and in close proximity to said plurality of devices to distribute heat of said plurality of devices;
said high heat conductivity material in proximity with said magnetic material of said substrate to conduct heat from said plurality of devices toward said heat sink.
2. The apparatus of claim 1 wherein said block of high heat conductivity material comprises a copper ring surrounding one of said plurality of devices.