IP Library Granted Patent US 7,949,022
Granted Patent B2
US 7,949,022 · App. 11/411,901 · Granted May 24, 2011

Diode pumping of a laser gain medium

Assignee: Lockheed Martin Corporation
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 7,949,022
App. No.
11/411,901
Granted
May 24, 2011
Kind
B2
Abstract

An integrated, low profile, high power laser light emission device is disclosed. The integrated laser light emission device provides uniform heat dissipation, as well as uniform pumping of the laser gain medium without the need for a pumping cavity. The laser system includes a pump diode array that can be mounted directly to a laser gain medium without intervening correcting optics hardware. Heat generated by the laser light emission device is cooled by a single cooling system. In the laser device, a pump diode array is preferably a Vertical-Cavity Surface-Emitting Laser (VCSEL) array. VCSEL arrays are mounted on the laser gain crystal by a metal cavity frame or metal stilts. The slightly elevated mounting of the VCSEL's enables increased cooling and maximizing the quantity of VCSEL's on the laser gain medium in order to achieve highly efficient and high power laser light output.

Claims (23)

1. An integrated laser light emission system, comprising:

a laser gain medium having at least one surface including an exposed region; and

a plurality of vertical-cavity surface-emitting laser diode arrays, each said laser diode array having a mount for mounting said respective laser diode array to the at least one surface of the laser gain medium and aligned with a respective said exposed region,

wherein no intervening lens elements are contained between light sources of the vertical-cavity surface-emitting laser diode arrays and the laser gain medium, and

wherein an area of the exposed surface of the laser gain medium is greater than the cross section dimension of the light beam emitted by each respective vertical-cavity surface-emitting laser diode array,

wherein said mount mounts the vertical-cavity surface-emitting laser diode arrays in a junction-down position to the laser gain medium such that electrodes of respective vertical-cavity surface-emitting laser diodes face a surface of the laser gain medium,

wherein said mount elevates the electrodes of respective vertical-cavity surface-emitting laser diode arrays over the laser gain medium providing a gap between the respective vertical-cavity surface-emitting laser diode array and laser gain medium sufficient for coolant to flow, and

wherein low-loss diffuser plates seal the electrodes and the surface of each respective vertical-cavity surface-emitting laser diode array having the electrodes in order to protect the surface of each laser diode array from exposure to coolant.

2. The integrated laser light emission system of claim 1 , wherein the laser gain medium is a rectangular slab having parallel top and bottom surfaces, the respective exposed region being in one of the top or bottom surface; and

wherein an output laser light is output from a side surface, different from the top or bottom surface of the laser gain medium.

3. The integrated laser light emission system of claim 1 , further comprising a single type of cooling system for cooling both the laser gain medium and the plurality of vertical-cavity surface-emitting laser diode arrays.

4. The integrated laser light emission system of claim 1 , wherein the laser gain medium and plurality of vertical-cavity surface-emitting laser diode arrays are a single semiconductor chip for outputting laser light.

5. The integrated laser light emission system of claim 1 , wherein the laser gain medium is a rectangular slab having parallel top and bottom surfaces, wherein the vertical-cavity surface-emitting laser diode arrays are mounted on each of the top and bottom surfaces of the laser gain medium in a staggered arrangement, the staggered arrangement is such that the space between each adjacent pair of vertical-cavity surface-emitting laser diode arrays on the top surface is substantially covered by a vertical-cavity surface-emitting laser diode array on the bottom surface of the laser gain medium.

6. The integrated laser light emission system of claim 1 , wherein the vertical-cavity surface-emitting laser diode arrays are junction-down mounted to the laser gain medium via a conductive adhesive.

7. The integrated laser light emission system of claim 1 , wherein the laser gain medium is without a pump cavity such that the mount of each respective vertical-cavity surface-emitting laser diode is directly mounted to the surface of the laser gain medium without the pump cavity.

8. The integrated laser light emission system of claim 1 , wherein a single cooling system produces a flow of coolant in the gaps between the respective vertical-cavity surface-emitting laser diode arrays and laser gain medium, as well as over a surface of the vertical-cavity surface-emitting diode arrays on an opposite side from said gaps facing away from the laser gain medium.

9. An integrated laser light emission system, comprising:

a laser gain medium having a cavity including an exposed region and a reflective region;

a plurality of semiconductor laser diode arrays mounted to the laser gain medium and aligned with said exposed region; and

a single cooling system, wherein said single cooling system produces a flow of a coolant,

wherein no intervening lens elements are contained between the semiconductor laser diode arrays and the laser gain medium, and

wherein an area of the exposed region of the laser gain medium is greater than the cross section dimension of the light beam emitted by a semiconductor laser diode array,

wherein the single cooling system provides the flow of coolant to the reflective region of said cavity of the laser gain medium and to a rear surface of the semiconductor laser diode arrays opposite to the surface that emits light, and does not provide the flow of coolant to the exposed region and to the surface of the semiconductor laser diode arrays that emits light.

Assignments (4)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 19, 2024
From: PRINCETON OPTOTRONICS, INC.
To: AMS-OSRAM INTERNATIONAL GMBH
Reel/Frame 068035/0435 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 5, 2015
From: LOCKHEED MARTIN CORPORATION
To: PRINCETON OPTRONICS
Reel/Frame 036725/0102 →
CORRECTIVE ASSIGNMENT TO CORRECT THE CONVEYANCE PREVIOUSLY RECORDED ON REEL 018030 FRAME 0859. ASSIGNOR(S) HEREBY CONFIRMS THE EDWARD J. MIESAK 6/19/2006) AND PAUL E. JACKSON (6/19/2006. Recorded Aug 10, 2015
From: MIESAK, EDWARD J.; JACKSON, PAUL E.; LI, PEI LUEN
To: LOCKHEED MARTIN CORPORATION
Reel/Frame 036315/0086 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 26, 2006
From: MIESAK, EDWARD J.; JACKSON, PAUL E.
To: LOCKHEED MARTIN CORPORATION
Reel/Frame 018030/0859 →
Continuity (1)
Related Publication 20070253458A1 · Nov 1, 2007