IP Library Granted Patent US 7,898,079
Granted Patent B2
US 7,898,079 · App. 11/413,512 · Granted Mar 1, 2011

Nanotube materials for thermal management of electronic components

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Quick Facts
Patent No.
US 7,898,079
App. No.
11/413,512
Granted
Mar 1, 2011
Kind
B2
Abstract

A heat-conducting medium for placement between a heat source and heat sink to facilitate transfer of heat from the source to the sink is provided. The heat-conducting medium can include a flexible member made from an array of interweaving carbon nanotubes. The heat-conducting medium may also include an upper surface against which a heat source may be placed, an opposing lower surface and edges about the member designed for coupling to a heat sink toward which heat from the heat source can be directed. The heat-conducting medium may also include a pad placed on the upper surface to provide structural support to the member. A method for manufacturing the heat-conducting medium is also provided.

Claims (38)

1. A heat-conducting medium for thermal management, the medium comprising:

a flexible member made from carbon nanotubes, the member having:

an upper surface adjacent to a heat source;

an opposing lower surface; and

edges about the periphery of the member designed for placement against a heat sink toward which heat from the heat source can be directed;

a heat spreader positioned on the upper surface of the member for placement against the heat source, so as to facilitate radial transfer of heat from the heat source to a wider area on the flexible member; and

a pad placed on the upper surface of the member, and extending in parallel to the upper surface of the member from the heat spreader towards the heat sink, to provide structural support to the member.

2. The medium as set forth in claim 1 , wherein the flexible member includes a polymeric material dispersed therethroughout.

3. The medium as set forth in claim 2 , wherein the polymeric material includes one of polyamide, epoxy or a combination thereof.

4. The medium as set forth in claim 1 , wherein the pad further provides support for the heat spreader.

5. The medium as set forth in claim 1 , further including a second pad placed against the lower surface of the member to provide additional structural support to the member.

6. The medium as set forth in claim 1 , wherein the heat spreader is positioned between the heat source and the upper surface of the member.

7. The medium as set forth in claim 1 , further including a second heat spreader positioned against the lower surface of the member to enhance spreading of heat from the heat source radially along the flexible member.

8. The medium as set forth in claim 7 , wherein the second heat spreader is positioned against the lower surface directly below the heat spreader on the upper surface of the member.

9. A heat-conducting medium for thermal management, the medium comprising:

a flexible member made from carbon nanotubes;

a pad placed on an upper surface of the member to provide structural support to the member, and extending in parallel to the upper surface of the member;

a heat spreader, independent of the pad, positioned on the surface of the member for placement against a heat source, so as to facilitate radial transfer of heat from the heat source to a wider area on the flexible member.

10. The medium as set forth in claim 9 , wherein the flexible member includes a polymeric material dispersed therethroughout.

11. The medium as set forth in claim 10 , wherein the polymeric material includes one of polyamide, epoxy or a combination thereof.

12. The medium as set forth in claim 9 , further including a second pad placed against an opposing surface of the member to provide additional structural support to the member.

13. The medium as set forth in claim 9 , wherein the heat spreader is positioned between the heat source and the surface of the member.

14. The medium as set forth in claim 9 , further including a second heat spreader positioned against an opposing surface of the member to enhance spreading of heat from the heat source radially along the flexible member.

15. The medium as set forth in claim 14 , wherein the second heat spreader is positioned against the opposing surface directly below the heat spreader on the surface of the member.

16. A heat-conducting medium for thermal management, the medium comprising:

a flexible member made from carbon nanotubes, the member having:

an upper surface adjacent to a heat source;

an opposing lower surface; and

edges about the periphery of the member designed for coupling to a heat sink toward which heat from the heat source can be directed;

a heat spreader positioned adjacent the heat source and upper surface of the member to facilitate radial transfer of heat from the heat source to a wider area on the flexible member; and

a pad placed in a plane within which the heat spreader is situated, and on the upper surface of the member while extending from the heat spreader towards the heat sink, to provide structural support to the member.

17. The medium as set forth in claim 16 , wherein the flexible member includes a polymeric material dispersed therethroughout.

18. The medium as set forth in claim 17 , wherein the polymeric material includes one of polyamide, epoxy or a combination thereof.

19. The medium as set forth in claim 16 , wherein the pad further provides support for the heat spreader.

20. The medium as set forth in claim 16 , further including a second pad placed against the lower surface of the member to provide additional structural support to the member.

21. The medium as set forth in claim 16 , wherein the heat spreader is positioned between the heat source and the upper surface of the member.

22. The medium as set forth in claim 16 , further including a second heat spreader positioned against the lower surface of the member to enhance spreading of heat from the heat source radially along the flexible member.

23. The medium as set forth in claim 22 , wherein the second heat spreader is positioned against the lower surface directly below the heat spreader on the upper surface of the member.

Assignments (9)
RELEASE OF SECURITY INTEREST Recorded Jul 28, 2026
From: SECTOR CAPITAL GROUP, LLC
To: HUNTSMAN NANOCOMP LLC
Reel/Frame 075425/0284 →
RELEASE OF SECURITY INTEREST Recorded Jul 28, 2026
From: PIVOTAL CAPITAL FUND, LP
To: HUNTSMAN NANOCOMP LLC
Reel/Frame 075425/0272 →
SECURITY INTEREST Recorded May 4, 2026
From: HUNTSMAN INTERNATIONAL LLC; HUNTSMAN ADVANCED MATERIALS AMERICAS LLC; HUNTSMAN NANOCOMP LLC; HUNTSMAN PETROCHEMICAL LLC
To: CITIBANK N.A.
Reel/Frame 075498/0663 →
PATENT SECURITY AGREEMENT Recorded Mar 10, 2026
From: HUNTSMAN INTERNATIONAL LLC; HUNTSMAN ADVANCED MATERIALS AMERICAS LLC; HUNTSMAN NANOCAMP LLC; HUNTSMAN PETROCHEMICAL LLC
To: CITIBANK, N.A.
Reel/Frame 075106/0238 →
SECURITY INTEREST Recorded Jan 21, 2018
From: NANOCOMP TECHNOLOGIES, INC.
To: SECTOR CAPITAL GROUP, LLC
Reel/Frame 044683/0242 →
RELEASE OF SECURITY INTEREST Recorded May 12, 2017
From: HORIZON TECHNOLOGY FINANCE CORPORATION
To: NANOCOMP TECHNOLOGIES, INC.
Reel/Frame 042364/0414 →
SECURITY INTEREST Recorded May 12, 2017
From: NANOCOMP TECHNOLOGIES, INC.
To: PIVOTAL CAPITAL FUND, LP
Reel/Frame 042364/0279 →
SECURITY INTEREST Recorded Apr 8, 2016
From: NANOCOMP TECHNOLGIES, INC.
To: HORIZON TECHNOLOGY FINANCE CORPORATION
Reel/Frame 038231/0494 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 9, 2006
From: LASHMORE, DAVID S.; BROWN, JOSEPH J.
To: NANCOMP TECHNOLOGIES, INC.
Reel/Frame 018158/0725 →