IP Library Granted Patent US 7,819,328
Granted Patent B2
US 7,819,328 · App. 11/413,878 · Granted Oct 26, 2010

Optical identification chips

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Quick Facts
Patent No.
US 7,819,328
App. No.
11/413,878
Granted
Oct 26, 2010
Kind
B2
Abstract

An optical identification element. The optical identification element is associated with an object and includes encoded or stored information associated with the object. The optical identification element includes an optical assembly that generates electrical power in response to incident light from a reader. The generated electrical power is used by the optical identification element to at least retrieve the data and then transmit the data back to the reader optically.

Claims (34)

1. An optical identification element, comprising:

a first chip that includes identification information and responds to signals that request the identification information; and

a second chip in communication with the first chip, the second chip including:

an optical receiver that receives incoming optical signals from an identification reader device; and

an optical transmitter that transmits outgoing optical signals containing the identification information provided by the first chip,

wherein the outgoing optical signals includes light in a region of the electromagnetic spectrum that is invisible to human observation.

2. The optical identification element of claim 1 , wherein the optical transmitter comprises a VCSEL.

3. The optical identification element of claim 1 , wherein the optical signals are in the infrared region of the electromagnetic spectrum.

4. The optical identification element of claim 3 , wherein the optical receiver and the optical transmitter are adapted to communicate with an infrared port of an identification reader device.

5. The optical identification element of claim 4 , wherein the identification reader device is one of a mobile telephone and a personal digital assistant that includes the infrared port.

6. The optical identification element of claim 1 , wherein the second chip:

provides electrical power to the first chip to permit the first chip to operate; and

provides an electrical signal to the first chip to request the identification information that is encoded on the first chip.

7. The optical identification element of claim 6 , further comprising a sensor that receives electrical power from the second chip.

8. A method of using the optical identification element of claim 1 , to provide the identification information to the identification reader device, comprising:

receiving an incoming optical signal from the identification reader device that includes a request for the identification information; and

transmitting an outgoing optical signal to the identification reader device that includes the requested identification information.

9. The optical identification element of claim 1 , wherein the first chip is a 45 nanometer CMOS chip.

10. In a system that tracks information associated with objects, an optical identification element for use in tracking the information, the optical identification element comprising:

a first chip including an optical assembly, the optical assembly generating electrical power in response to incident light, wherein the optical assembly further comprises a light emitting element; and

a second chip that provides data management for information stored in the second chip, wherein a reader collects the information from the second chip by generating the incident light,

wherein the light emitting element of the optical assembly is configured to emit light at an infrared frequency.

11. The optical identification element of claim 10 , wherein the optical assembly further comprises:

a semiconductor structure that includes a plurality of photodiodes that generate current in response to a first wavelength of the incident light and wherein the light emitting element is included in the semiconductor structure and comprises a laser that emits light at a second wavelength.

12. The optical identification element of claim 11 , wherein the first wavelength and the second wavelength are substantially the same wavelength.

13. The optical identification element of claim 11 , the semiconductor structure further comprising a transistor that enables the second chip to modulate light emitted by the laser.

14. The optical identification element of claim 11 , wherein the laser is a vertical cavity surface emitting laser and wherein the semiconductor structure is a monolithic structure.

15. The optical identification element of claim 11 , wherein the data management includes reader authentication.

16. The optical identification element of claim 15 , wherein the data provided to a reader is controlled by the data management by credentials of the reader that are modulated into the incident light.

17. The optical identification element of claim 11 , wherein the data management provides the data to the reader by modulating the laser.

18. The optical identification element of claim 11 , wherein the reader is one of a cellular telephone or a personal digital assistant.

19. The optical identification element of claim 18 , wherein the reader calls an authentication service and uses the collected data to verify an object associated with the optical identification element.

20. The optical identification element of claim 11 , wherein the plurality of photodiodes are arranged in a series connection.

21. The optical identification element of claim 10 , wherein the optical assembly includes at least one photodiode that is integrated with a transmitting light element on a single chip.

Assignments (5)
PATENT RELEASE AND REASSIGNMENT Recorded Jul 5, 2022
From: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
To: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.; KAILIGHT PHOTONICS, INC.; COADNA PHOTONICS, INC.; OPTIUM CORPORATION; FINISAR CORPORATION; II-VI OPTICAL SYSTEMS, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; II-VI DELAWARE, INC.; II-VI OPTOELECTRONIC DEVICES, INC.; PHOTOP TECHNOLOGIES, INC.
Reel/Frame 060574/0001 →
SECURITY INTEREST Recorded Jul 1, 2022
From: II-VI INCORPORATED; II-VI DELAWARE, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; PHOTOP TECHNOLOGIES, INC.; COHERENT, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 060562/0254 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 1, 2020
From: FINISAR CORPORATION
To: II-VI DELAWARE, INC.
Reel/Frame 052286/0001 →
NOTICE OF GRANT OF SECURITY INTEREST IN PATENTS Recorded Sep 25, 2019
From: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.; KAILIGHT PHOTONICS, INC.; COADNA PHOTONICS, INC.; OPTIUM CORPORATION; FINISAR CORPORATION; II-VI OPTICAL SYSTEMS, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; II-VI DELAWARE, INC.; II-VI OPTOELECTRONIC DEVICES, INC.; PHOTOP TECHNOLOGIES, INC.
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 050484/0204 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 27, 2006
From: LEVINSON, FRANK
To: FINISAR CORPORATION
Reel/Frame 017841/0519 →