Method for fabricating printing plate with fine pattern using electric field
View Patent ↗A fabricating method of a printing plate includes forming a first conductive layer on an upper surface of a printing plate, forming a second conductive layer on a lower surface of the printing plate, forming an etch-resist pattern by etching a portion of the first conductive layer, submerging the printing plate, the second conductive layer and the etch-resist pattern into an electrolytic solution, and applying an electrical field between the etch-resist pattern and the second conductive layer so that the electrolytic solution is dissociated to form an anisotropically etched fine pattern in the printing plate.
1. A fabricating method of a printing plate, comprising:
forming a first conductive layer on an upper surface of a printing plate;
forming a second conductive layer on a lower surface of the printing plate;
forming a first photo-resist layer on the first conductive layer;
forming a second photo-resist layer on the second conductive layer;
forming a first photo-resist pattern by etching a portion of the first photo-resist layer to form an opening in the first photo-resist layer exposing a first portion of the first conductive layer;
etching the first portion of the first conductive layer using the first photo-resist pattern as a mask so as to form a metal pattern exposing a portion of the printing plate;
forming a first contact hole in the first photo-resist pattern exposing a second portion of the metal pattern and forming a second contact hole in the second photo-resist layer exposing the second conductive layer to supply power to the metal pattern and the second conductive layer through the first and second contact holes;
submerging the printing plate having the second conductive layer, the metal pattern, the first photo-resist pattern and the second photo-resist layer into an electrolytic solution;
applying an electrical field between the metal pattern and the second conductive layer so that the electrolytic solution is dissociated to act to etch the printing plate in a vertical direction commensurate with the electric field so as to form an anisotropically etched pattern in the printing plate in which a width of the pattern is less than a depth of the pattern; and
removing the metal pattern, the first photo-resist pattern, the second conductive layer and the second photo-resist layer.
2. The fabricating method according to claim 1 , wherein the applying the electrical field between the metal pattern and the second conductive layer includes:
applying a negative potential to the metal pattern; and
applying a positive potential to the second conductive layer.
3. The fabricating method according to claim 1 , wherein the first and second conductive layers includes one of Cr, Mo, Cu and ITO.
4. The fabricating method according to claim 1 , wherein the electrolytic solution includes fluoric (F) ions capable of etching glass.
5. The fabricating method according to claim 1 , wherein the electrolytic solution includes one of HF, NH 4 F and KF.
6. The fabricating method according to claim 1 , wherein the printing plate is a glass.