IP Library › Patent Application 11416086
Patent Application
App. No. 11/416,086

Method and device for manufacturing microstructured metal foils for heat transfer reactors

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Quick Facts
Patent No.
US None
App. No.
11/416,086
Abstract

A method and a device for manufacturing microstructured metal foils for heat transfer reactors. The microstructures in the metal foils are produced using an ECM/PECM dipping process.

Claims (4)

1 . A method for manufacturing microstructured metal foils for heat transfer reactors comprising:

producing microstructures in a metal foil using an ECM/PECM dipping process.

2 . A device for carrying out the method as recited in claim I wherein the working electrode has a negative surface with regard to the microstructures to be produced is provided, microstructures having dimensions of 100 μm to 500 μm being produced in the negative surface.

3 . The device as recited in claim 2 further comprising an electrolyte recirculated between the metal foils to be structured and the working electrode.

Assignments (2)
CHANGE OF NAME Recorded Jan 31, 2008
From: DAIMLERCHRYSLER AG
To: DAIMLER AG
Reel/Frame 020442/0893 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 2, 2006
From: BAYER, ERWIN; BUSSMANN, MARTIN; STEINWANDEL, JUERGEN; WAGNER, BURKHARD
To: DAIMLERCHRYSLER AG
Reel/Frame 018140/0744 →