System and method for routing signals between side-by-side die in lead frame type system in a package (SIP) devices

1. An integrated circuit comprising:

a first die and a second die positioned on a lead frame of a package, the lead frame including a plurality of used bond fingers and a plurality of unused bond fingers; and

a first bond pad on the first die that is electrically interconnected to a corresponding second bond pad on the second die through a first unused bond finger and a second unused bond finger of the lead frame,

wherein the plurality of used bond fingers are used to provide signals external to the integrated circuit, and the plurality of unused bond fingers are not used to provide signals external to the integrated circuit.

2. The integrated circuit of claim 1 , wherein the first bond pad is electrically interconnected through a respective bonding wire to the first unused bond finger; wherein the second bond pad is electrically interconnected through a respective bonding wire to the second unused bond finger; and wherein the first unused bond finger and the second unused bond finger are electrically interconnected through bonding wires contained within a package of the integrated circuit.

3. The integrated circuit of claim 1 , further comprising a printed circuit board including a plurality of conductive traces, wherein the first bond pad is electrically interconnected through a respective bonding wire to the first unused bond finger; wherein the second bond pad is electrically interconnected through a respective bonding wire to the second unused bond finger; and wherein the first unused bond finger and the second bond finger are electrically interconnected through a conductive trace of the printed circuit board.

4. The integrated circuit of claim 1 wherein a plurality of bond pads on the first die are electrically interconnected to a corresponding plurality of bond pads on the second die, each such bond pad on the first die being electrically interconnected to a respective bond pad on the second die through corresponding first and second bond fingers.

5. The integrated circuit of claim 1 wherein the first die comprises a memory die and the second die comprises a memory controller die.

6. The integrated circuit of claim 1 wherein the lead frame includes a die paddle and wherein the first and second dies are mounted to the die paddle.

7. The integrated circuit of claim 1 wherein electrical signals are coupled to bond pads on at least one of the first and second dies through bond fingers of the lead frame and through corresponding bonding wires.

8. The integrated circuit of claim 1 , further comprising an additional die, the additional die including a bond pad that is electrically interconnected to a corresponding bond pad on a separate die through first and second bond fingers.

9. The integrated circuit of claim 1 wherein the package comprises a QFP package.

10. The integrated circuit of claim 1 wherein the first and second die have respective inner edges that are adjacent one another, and wherein the first bond pad is positioned along one of an upper, lower, and outer edge of the first die and the second bond pad is positioned along one of an upper, lower, and outer edge of the second die.

11. The integrated circuit of claim 10 wherein the first bond pad is positioned along one of the upper, lower, and outer edge of the first die and the second bond pad is positioned along a different one of the upper, lower, and outer edges of the second die, and wherein the first bond finger is electrically connected to the second bond finger through a conductive trace external to the package.

12. An electronic system, comprising:

an input device;

an output device;

a storage device; and

circuitry coupled to the input device, the output, and the storage device, the circuitry including an integrated circuit comprising:

a first die and a second die positioned on a lead frame of a package, the lead frame including a plurality of used bond fingers and a plurality of unused bond fingers; and

a first bond pad on the first die that is electrically interconnected to a corresponding second bond pad on the second die through unused a first unused bond finger and a second unused bond finger of the lead frame,

wherein the plurality of used bond fingers are used to provide signals external to the integrated circuit, and the plurality of unused bond fingers are not used to provide signals external to the integrated circuit.

13. The electronic system of claim 12 wherein the package comprises a QFP package.

14. The electronic system of claim 12 , wherein the electronic system comprises one of a personal computer system or a server computer system.

15. The electronic system of claim 12 , wherein the first and second die have respective inner edges that are adjacent one another, and wherein the first bond pad is positioned along one of an upper, lower, and outer edge of the first die and the second bond pad is positioned along one of an upper, lower, and outer edge of the second die.