Method and apparatus for laser processing
View Patent ↗A method and an apparatus for processing workpieces with a laser beam include first and second stages for holding the workpieces and first and second laser beam paths. The first workpiece is loaded upon the first stage, aligned with the first laser beam path, and processing begun. While the first workpiece is aligned in relation to the first laser beam path, the second workpiece is prepared in relation to the second laser beam path. Processing of the second workpiece is begun as soon as the laser beam is available for processing.
1. A method for processing first and second workpieces with a laser processing system, said laser processing system including a controller, a laser emitting a laser beam that propagates along a laser beam path and having laser optics, first and second motion stages for holding said first and second workpieces, a video assembly, and a gantry, said controller being operatively connected to said laser, laser optics, video assembly, gantry, and first and second motion stages, comprising:
loading said first workpiece upon said first motion stage;
aligning using said video assembly in cooperation with said controller to align said first workpiece in relation to said laser beam path;
processing said first workpiece with said laser beam;
loading said second workpiece upon said second motion stage; and
while said first workpiece is aligned in relation to said laser beam path, using said video assembly in cooperation with said controller to align said second workpiece in relation to said laser beam path;
wherein said operative connection of said controller with said laser, laser optics, video assembly, and first and second motion stages permits said controller, in cooperation with said gantry, to acquire and maintain said alignment between said second workpiece and said laser beam path during said processing of said first workpiece.
2. The method of claim 1 wherein said video assembly constitutes a first video assembly and said laser processing system further includes a second video assembly that is operatively connected to said controller, and wherein the step of aligning said second workpiece in relation to said laser beam path further comprises aligning said second workpiece in relation to said laser beam path with said second video assembly in cooperation with said controller to permit said controller to acquire and maintain, in cooperation with said gantry, said alignment between said second workpiece and said laser beam path during said processing of said first workpiece.
3. The method of claim 1 further comprising providing a datum in relation to said laser beam path, and wherein said aligning of said second workpiece includes indexing said second workpiece or laser beam in relation to said datum.
4. The method of claim 1 wherein said step of processing comprises forming a via or vias.
5. The method of claim 1 wherein said step of processing comprises removing semiconductor links.
6. The method of claim 1 wherein said step of processing comprises trimming a passive electronic component.
7. The method of claim 1 wherein said step of processing comprises scribing or singulating a substrate.
8. A method for processing first and second workpieces with a laser processing system, said laser processing system including a controller, a laser emitting a laser beam that propagates along a laser beam path and having laser optics, first and second motion stages for holding said first and second workpieces, a video assembly, and a gantry, said controller being operatively connected to said gantry, laser, laser optics, camera, camera optics, and first and second motion stages, comprising:
loading a first workpiece upon said first motion stage;
using said video assembly in cooperation with said controller to align said first workpiece in relation to said laser beam path;
processing said first workpiece with said laser beam;
loading a second workpiece upon motion stage second stage;
while said first workpiece is aligned in relation to said laser beam path, aligning said second workpiece in relation to said laser beam path with said video assembly in cooperation with said controller;
wherein said operative connection of said controller with said laser, laser optics, video assembly, and first and second motion stages permits said controller, in cooperation with said gantry, to acquire and maintain said alignment between said second workpiece and said laser beam path during said processing of said first workpiece; and
performing an additional processing step on said first workpiece while said second workpiece is aligned to said laser beam path.
9. The method of claim 8 wherein the additional processing step comprises inspecting said first workpiece.
10. A laser processing apparatus for processing first and second workpieces comprising:
a gantry;
a laser having a laser beam path and laser optics;
a video assembly; and
a first stage and a second stage for holding said first and second workpieces;
wherein said gantry, laser, laser optics, video assembly, and first and second stages are operatively connected to said controller to permit said controller to acquire and maintain, in cooperation with said gantry, said alignment between said second workpiece and said laser beam path during said processing of said first workpiece.
11. The apparatus of claim 10 in which said apparatus is configured for forming a via or vias.
12. The apparatus of claim 10 in which said apparatus is configured for removing semiconductor links.
13. The apparatus of claim 10 in which said apparatus is configured for trimming a passive electronic component.
14. The apparatus of claim 10 in which said apparatus is configured for scribing or singulating a substrate.