IP Library Granted Patent US 7,477,509
Granted Patent B2
US 7,477,509 · App. 11/417,743 · Granted Jan 13, 2009

Quick eject mechanism with cable detection device

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Quick Facts
Patent No.
US 7,477,509
App. No.
11/417,743
Granted
Jan 13, 2009
Kind
B2
Abstract

An eject mechanism for a module includes a module casing; a module engaged in the module casing; the module including a cable port; and an eject button for allowing disengagement of the module from the module casing. The eject button prevents the module from disengagement when a cable is plugged into the cable port. A method of ejecting a module from a module casing includes disengaging the module from the module casing upon the pressing of an eject button, and preventing the module from disengagement when a cable is plugged into a cable port of the module.

Claims (26)

1. An eject mechanism for a module comprising:

a module casing;

a module engaged in the module casing, the module comprising an optical disc drive and a cable port;

an eject button for allowing disengagement of the module from the module casing; and

a cable interference tab disposed on the eject button,

wherein the eject button prevents the module from disengagement when a cable is plugged into the cable port,

wherein the cable interference tab moves co-axially with the eject button when the eject button is pressed, and

wherein the cable interference tab is positioned such that when the cable is plugged into the cable port, the cable interference tab contacts the cable, and the eject button is prevented from allowing disengagement of the module.

2. The eject mechanism of claim 1 , wherein the module further comprises a housing.

3. The eject mechanism of claim 1 , wherein the cable is an integrated device electronics cable.

4. The eject mechanism of claim 1 , wherein the cable is a USB cable.

5. The eject mechanism of claim 1 , wherein the cable is an optical disk drive cable.

6. The eject mechanism of claim 1 , further comprising a tension spring, the tension spring being disposed in an opening in the eject button, ends of the tension spring being respectively attached to the module casing and the eject button such that after the eject button is pressed, the tension spring returns the eject button to a pre-pressed position.

7. The eject mechanism of claim 1 , wherein the eject button further comprises a guided portion, which is guided by a guiding protrusion on the module casing.

8. A computer system having an eject mechanism comprising:

a module casing;

a module engaged in the module casing, the module comprising and an optical disc drive and a cable port; and

an eject button for allowing disengagement of the module from the module casing; and

a cable interference tab disposed on the eject button,

wherein the eject button prevents the module from disengagement when a cable is plugged into the cable port,

wherein the cable interference tab moves co-axially with the eject button when the eject button is pressed, and

wherein the cable interference tab is positioned such that when the cable is plugged into the cable port, the cable interference tab contacts the cable, and the eject button is prevented from allowing disengagement of the module.

9. The computer system of claim 8 , wherein the eject mechanism further comprises a tension spring, the tension spring being disposed in an opening in the eject button, ends of the tension spring being respectively attached to the module casing and the eject button such that after the eject button is pressed, the tension spring returns the eject button to a pre-pressed position.

10. The computer system of claim 8 , wherein the eject button further comprises a guided portion, which is guided by a guiding protrusion on the module casing.

11. The computer system of claim 8 , wherein the cable is one of an integrated device electronics cable, a USB cable, or an optical disk drive cable.

12. The computer system of claim 8 , further comprising a computer tower, the computer tower comprising a computer tower case in which the module case is disposed.

Assignments (3)
MERGER AND CHANGE OF NAME Recorded Dec 16, 2015
From: ORACLE USA, INC.; SUN MICROSYSTEMS, INC.; ORACLE AMERICA, INC.
To: ORACLE AMERICA, INC.
Reel/Frame 037303/0926 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 8, 2008
From: ONG, BRETT C.; KELLER, LESLIE N.; DE MEULENAERE, WILLIAM A.
To: SUN MICROSYSTEMS, INC.
Reel/Frame 021941/0133 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 4, 2006
From: ONG, BRETT C.; KELLER, LESLIE N.; DE MEULENAERE, WILLIAM A.
To: SUN MICROSYSTEMS, INC.
Reel/Frame 017880/0020 →