Detecting plasmons using a metallurgical junction
View Patent ↗A sensor device includes a substrate having first and second regions of first and second conductivity types, respectively. A junction having a band-gap is formed between the first and second regions. A plasmon source generates plasmons having fields. At least a portion of the plasmon source is formed near the junction, and the fields reduce the band-gap to enable a current to flow through the device.
1. A device for detecting the presence of plasmons in response to electromagnetic radiation, comprising:
a substrate having first and second regions of first and second conductivity types, respectively;
a voltage source establishing a voltage difference between the first and second regions;
a junction region between the first and second regions having a band-gap that in an undetecting state limits current flow between the first and second regions and creates an inherent field;
a plasmon source near the junction to receive the electromagnetic radiation and thereby be stimulated by the electromagnetic radiation to generate plasmons having second fields that oppose the inherent field to reduce the band-gap to enable a current to flow between the first and second regions as a detection of the presence of the plasmons, the plasmon source including a plurality of microstructures of metallic material; and
a first dielectric layer formed on the first region of the substrate, the plurality of microstructures being formed into both the first region of the substrate and the first dielectric layer.
2. The device of claim 1 , further including a first dielectric layer formed on the first region of the substrate.
3. The device of claim 2 , further including a second dielectric layer formed on the first dielectric layer to sandwich the first dielectric layer between the second dielectric layer and the first region of the substrate, the second dielectric layer having an index of refraction greater than the first dielectric layer.
4. The device of claim 3 , further including a third dielectric layer formed on the second dielectric layer to sandwich the second dielectric layer between the first dielectric layer and the third dielectric layer, the third dielectric layer having an index of refraction less than the second dielectric layer.
5. The device of claim 4 , wherein portions of the first, second and third dielectric layers respectively form first and second openings, the device further including first and second metallization fillings, respectively in the first and second openings.
6. The device of claim 5 , wherein the first metallization filling is electrically coupled to the first region of the substrate and the second metallization filling is electrically coupled to the second region of the substrate.
7. The device of claim 6 , further including first and second electrodes electrically connected to, respectively, the first and second metallization fillings, the voltage difference being established between, respectively the first and second electrodes.
8. The device of claim 7 , wherein the plasmon source includes a plurality of microstructures of metallic material.
9. The device of claim 8 , wherein the microstructures are formed into both the first region of the substrate and the first dielectric layer.
10. The device of claim 9 further including a core region sandwiched between the first and third dielectric layers to channel the electromagnetic wave near the microstructures.