ELECTROMAGNETIC RESONANT CIRCUIT SLEEVE FOR IMPLANTABLE MEDICAL DEVICE
A medical device enables effective magnetic resonance imaging inside a lumen of a medical device. The medical device includes a plurality of conductive traces formed on a substrate. The conductive traces form an inductive-capacitance circuit or a resistive-inductive-capacitance circuit. The inductive-capacitance circuit or resistive-inductive-capacitance circuit is tuned to a frequency associated with magnetic resonance imaging, an operating frequency associated with a magnetic resonance imaging scanner, a harmonic of an operating frequency associated with a magnetic resonance imaging scanner, or a sub-harmonic of an operating frequency associated with a magnetic resonance imaging scanner.
1 . An implantable medical device, comprising:
a stent;
a substrate surrounding a portion of said stent; and
a plurality of conductive traces formed on said substrate, said conductive traces forming an inductive-capacitance circuit, said inductive-capacitance circuit being tuned to a frequency such that an effective resonance frequency of said stent, inductive-capacitance circuit, and surrounding in vitro conditions is substantially equal to a frequency associated with magnetic resonance imaging.
2 . The device as claimed in claim 1 , wherein said conductive traces form a resistive inductive-capacitance circuit, said resistive-inductive-capacitance circuit being tuned to a frequency such that an effective resonance frequency of said stent, resistive-inductive-capacitance circuit, and surrounding in vitro conditions is substantially equal to a frequency associated with magnetic resonance imaging.
3 . The device as claimed in claim 1 , wherein said inductive-capacitance circuit is tuned to a frequency such that an effective resonance frequency of said stent, inductive-capacitance circuit, and surrounding in vitro conditions is substantially equal to an operating frequency of a magnetic resonance imaging scanner.
4 . The device as claimed in claim 2 , wherein said resistive-inductive-capacitance circuit is tuned to a frequency such that an effective resonance frequency of said stent, resistive-inductive-capacitance circuit and surrounding in vitro conditions is substantially equal to an operating frequency of a magnetic resonance imaging scanner.
5 . The device as claimed in claim 1 , wherein said inductive-capacitance circuit is tuned to a frequency such that an effective resonance frequency of said stent, inductive-capacitance circuit, and surrounding in vitro conditions is substantially equal to a harmonic frequency of an operating frequency associated with a magnetic resonance imaging scanner.
6 . The device as claimed in claim 2 , wherein said resistive-inductive-capacitance circuit is tuned to a frequency such that an effective resonance frequency of said stent, resistive-inductive-capacitance circuit and surrounding in vitro conditions is substantially equal to a harmonic frequency of an operating frequency associated with a magnetic resonance imaging scanner.
7 . The device as claimed in claim 1 , wherein said inductive-capacitance circuit is tuned to a frequency such that an effective resonance frequency of said stent, inductive-capacitance circuit, and surrounding in vitro conditions is substantially equal to a sub-harmonic frequency of an operating frequency associated with a magnetic resonance imaging scanner.
8 . The device as claimed in claim 2 , wherein said resistive-inductive-capacitance circuit is tuned to a frequency such that an effective resonance frequency of said stent, resistive-inductive-capacitance circuit and surrounding in vitro conditions is substantially equal to a sub-harmonic frequency of an operating frequency associated with a magnetic resonance imaging scanner.
9 . The device as claimed in claim 1 , further comprising a discrete capacitor operatively connected to said traces and attached to said substrate.
10 . The device as claimed in claim 1 , wherein said substrate is biodegradable.
11 . The device as claimed in claim 1 , wherein said substrate is thermally degradable.
12 . The device as claimed in claim 1 , wherein said substrate is chemically degradable.
13 . The device as claimed in claim 1 , wherein said substrate is optically degradable.
14 . The device as claimed in claim 1 , wherein said substrate is degradable.
15 . The device as claimed in claim 1 , wherein said conductive traces are expandable.
16 . The device as claimed in claim 1 , wherein said conductive traces are expandable without damage thereto.
17 . The device as claimed in claim 1 , wherein said conductive traces form a pattern.
18 . The device as claimed in claim 16 , wherein said pattern of conductive traces is expandable.
19 . The device as claimed in claim 16 , wherein said pattern of conductive traces is expandable without damage thereto.
20 . The device as claimed in claim 1 , wherein said conductive traces form a plurality of coils, each coil forming an inductive-capacitance circuit, said inductive-capacitance circuit being tuned to a distinct frequency.
21 . The device as claimed in claim 1 , wherein said conductive traces form a plurality of coils, each coil forming a resistive-inductive-capacitance circuit, said resistive-inductive-capacitance circuit being tuned to a distinct frequency.
22 . The device as claimed in claim 1 , wherein said conductive traces form a stack of coils, said stack of coils having an axis normal to a surface of said substrate.
23 . The device as claimed in claim 1 , wherein said conductive traces form a plurality of stacked coils, each stacked coil having an axis normal to a surface of said substrate, each stacked coil forming an inductive-capacitance circuit, said inductive-capacitance circuit.
24 . The device as claimed in claim 1 , wherein said conductive traces form a plurality of stacked coils, each stacked coil having an axis normal to a surface of said substrate, each stacked coil forming a resistive-inductive-capacitance circuit, said resistive-inductive-capacitance circuit.
25 . The device as claimed in claim 1 , wherein said conductive traces form a plurality of multi-loop coils, each multi-loop coil having an axis normal to a surface of said substrate, each multi-loop coil forming an inductive-capacitance circuit, said inductive-capacitance circuit.
26 . The device as claimed in claim 1 , wherein said conductive traces form a plurality of multi-loop coils, each multi-loop coil having an axis normal to a surface of said substrate, each multi-loop coil forming a resistive-inductive-capacitance circuit, said resistive-inductive-capacitance circuit.