ELECTROMAGNETIC RESONANT CIRCUIT SLEEVE FOR IMPLANTABLE MEDICAL DEVICE
A medical device enables effective magnetic resonance imaging inside a lumen of a medical device. The medical device includes a plurality of conductive traces formed on a substrate. The conductive traces form an inductive-capacitance circuit or a resistive-inductive-capacitance circuit. The inductive-capacitance circuit or resistive-inductive-capacitance circuit is tuned to a frequency associated with magnetic resonance imaging, an operating frequency associated with a magnetic resonance imaging scanner, a harmonic of an operating frequency associated with a magnetic resonance imaging scanner, or a sub-harmonic of an operating frequency associated with a magnetic resonance imaging scanner.
1 . A device for enabling effective magnetic resonance imaging inside a lumen of a medical device, comprising:
a substrate; and
a plurality of conductive traces formed on said substrate, a first portion of said conductive traces forming an inductive coil, a second portion of said conductive traces overlapping a third portion of said conductive traces with a dielectric material formed at the overlapping of and between the second portion of said conductive traces with the third portion of said conductive traces, the dielectric material and overlapped portions of said conductive traces forming a capacitor;
said inductive coil and said capacitor being tuned to a frequency associated with magnetic resonance imaging.
2 . The device as claimed in claim 1 , wherein said inductive coil and said capacitor are tuned to an operating frequency associated with a magnetic resonance imaging scanner.
3 . The device as claimed in claim 1 , wherein said inductive coil and said capacitor are tuned to a harmonic of an operating frequency associated with a magnetic resonance imaging scanner.
4 . The device as claimed in claim 1 , wherein said inductive coil and said capacitor are tuned to a sub-harmonic of an operating frequency associated with a magnetic resonance imaging scanner.
5 . The device as claimed in claim 1 , wherein said substrate is biodegradable.
6 . The device as claimed in claim 1 , wherein said substrate is thermally degradable.
7 . The device as claimed in claim 1 , wherein said substrate is chemically degradable.
8 . The device as claimed in claim 1 , wherein said substrate is optically degradable.
9 . The device as claimed in claim 1 , wherein said substrate is degradable.
10 . The device as claimed in claim 1 , wherein said conductive traces are expandable.
11 . The device as claimed in claim 1 , wherein said conductive traces are expandable without damage thereto.
12 . The device as claimed in claim 1 , wherein said conductive traces form a pattern.
13 . The device as claimed in claim 12 , wherein said pattern of conductive traces is expandable.
14 . The device as claimed in claim 12 , wherein said pattern of conductive traces is expandable without damage thereto.
15 . The device as claimed in claim 1 , wherein said conductive traces form a plurality of coils, each coil forming an inductive-capacitance circuit, said inductive-capacitance circuit being tuned to a distinct frequency.
16 . The device as claimed in claim 1 , wherein said conductive traces form a plurality of coils, each coil forming a resistive-inductive-capacitance circuit, said resistive-inductive-capacitance circuit being tuned to a distinct frequency.
17 . The device as claimed in claim 1 , wherein said conductive traces form a stack of coils, said stack of coils having an axis normal to a surface of said substrate.
18 . The device as claimed in claim 1 , wherein said conductive traces form a plurality of stacked coils, each stacked coil having an axis normal to a surface of said substrate, each stacked coil forming an inductive-capacitance circuit, said inductive-capacitance circuit.
19 . The device as claimed in claim 1 , wherein said conductive traces form a plurality of stacked coils, each stacked coil having an axis normal to a surface of said substrate, each stacked coil forming a resistive-inductive-capacitance circuit, said resistive-inductive-capacitance circuit.
20 . The device as claimed in claim 1 , wherein said conductive traces form a plurality of multi-loop coils, each multi-loop coil having an axis normal to a surface of said substrate, each multi-loop coil forming an inductive-capacitance circuit, said inductive-capacitance circuit.
21 . The device as claimed in claim 1 , wherein said conductive traces form a plurality of multi-loop coils, each multi-loop coil having an axis normal to a surface of said substrate, each multi-loop coil forming a resistive-inductive-capacitance circuit, said resistive-inductive-capacitance circuit.