On-chip/off-chip magnetic shielding loop
Magnetic coupling of noise sources can have a negative impact on the net performance of sensitive circuits. A magnetic shielding loop can advantageously minimize magnetic coupling associated with a circuit on an integrated circuit (IC) by including on-chip components, off-chip components, and interface components connecting the on-chip and off-chip components. The components can include conductive paths and contact pads on a die, package, and printed circuit board. The magnetic shielding loop magnetically isolates at least one of input terminals and noise-generating elements of the circuit.
1. A structure minimizing magnetic coupling associated with a circuit on an integrated circuit, the structure comprising:
on-chip components;
off-chip components; and
interface components connecting the on-chip components and the off-chip components to form a magnetic shielding loop, wherein the magnetic shielding loop magnetically isolates at least one of input terminals and noise-generating elements of the circuit.
2. A structure minimizing magnetic coupling associated with a circuit on an integrated circuit (IC), the structure comprising:
a first conductive path formed in a die of the IC;
a second conductive path formed in a package of the IC;
conductive interface components to connect the first and second conductive paths and form a magnetic shielding loop, wherein the magnetic shielding loop magnetically isolates at least one of input terminals and noise-generating elements of the circuit.
3. The structure of claim 2 , wherein the conductive interface components include:
chip contacts connected to the first conductive path;
package contacts connected to the second conductive path; and
bonding wires connecting the chip contacts and the package contacts.
4. A structure minimizing magnetic coupling associated with a circuit on an integrated circuit (IC), the structure comprising:
a first conductive path formed in a die of the IC;
second conductive paths formed in a package housing the IC;
a third conductive path formed in a printed circuit board for mounting the IC; and
conductive interface components to connect the first, second, and third conductive paths and form a magnetic shielding loop, wherein the magnetic shielding loop magnetically isolates at least one of input terminals and noise-generating elements of the circuit.
5. The structure of claim 4 , wherein the conductive interface components include:
chip contacts connected to the first conductive path;
package contacts connected to the second conductive path;
bonding wires connecting the chip contacts and the package contacts;
package solder bumps/contacts connected to the third conductive path; and
conductors connecting the package contacts and the package solder bumps/contacts.
6. A structure minimizing magnetic coupling associated with a circuit on an integrated circuit (IC), the structure comprising:
first conductive components in a first substrate;
second conductive components in a second substrate; and
third conductive components for connecting the first and second conductive components to create a magnetic shielding loop for at least one of input terminals and noise-generating elements of the circuit.
7. The structure of claim 6 , further including:
fourth conductive components in a third substrate; and
fifth conductive components for connecting the second and fourth conductive components.
8. A method of minimizing magnetic coupling associated with a circuit on an integrated circuit (IC), the method comprising:
creating a magnetic shielding loop spanning a plurality of substrates, wherein the plurality of substrates include at least a die substrate and a package substrate.
9. The method of claim 8 , wherein the plurality of substrates include the die substrate, the package substrate, and a printed circuit board substrate.