Thermal mass transfer substrate films, donor elements, and methods of making and using same
View Patent ↗Substrate films, thermal mass transfer donor elements, and methods of making and using the same are provided. In some embodiments, such substrate films and donor elements include at least two dyads, wherein each dyad includes an absorbing first layer and an essentially non-absorbing second layer. Also provided are methods of making a donor element that includes an essentially non-absorbing substrate, an absorbing first layer, and a non-absorbing second layer, wherein the composition of the essentially non-absorbing substrate is essentially the same as the composition of the essentially non-absorbing second layer.
1. A thermal transfer donor element comprising:
an essentially non-absorbing substrate;
a light-to-heat conversion layer on at least a portion of the substrate; and
a thermal transfer layer on at least a portion of the light-to-heat conversion layer,
wherein the light-to-heat conversion layer comprises at least a first stack of layers comprising at least two dyads, wherein each of the at least two dyads of the first stack of layers comprises:
an absorbing first layer; and
an essentially non-absorbing second layer,
wherein each absorbing first layer of the at least two dyads has essentially the same optical absorption rate.
2. The thermal transfer donor element of claim 1 further comprising an underlayer disposed between the substrate and the light-to-heat conversion layer.
3. A thermal transfer donor element comprising:
an essentially non-absorbing substrate;
a light-to-heat conversion layer on at least a portion of the substrate;
an interlayer on at least a portion of the light-to-heat conversion layer; and
a thermal transfer layer on at least a portion of the interlayer,
wherein the light-to-heat conversion layer comprises at least a first stack of layers comprising at least two dyads, wherein each of the at least two dyads of the first stack of layers comprises:
an absorbing first layer; and
an essentially non-absorbing second layer,
wherein each absorbing first layer of the at least two dyads has essentially the same optical absorption rate.
4. The thermal transfer donor element of claim 1 wherein the at least two dyads of the first stack of layers form a stack of layers having alternating absorbing layers and essentially non-absorbing layers.
5. The thermal transfer donor element of claim 1 wherein the total thickness of each dyad in the first stack of layers is essentially the same.
6. The thermal transfer donor element of claim 5 wherein the thickness of the first layer and the thickness of the second layer for each dyad are selected such that the total power absorbed for each dyad in the first stack of layers is essentially the same.
7. The thermal transfer donor element of claim 5 wherein the fraction of absorbing material is essentially the same for each dyad in the first stack of layers.
8. A thermal transfer donor element comprising:
an essentially non-absorbing substrate; and
a light-to-heat conversion layer on at least a portion of the substrate, wherein the light-to-heat conversion layer comprises at least a first stack of layers comprising at least two dyads,
wherein each of the at least two dyads of the first stack of layers comprises:
an absorbing first layer; and
an essentially non-absorbing second layer,
wherein each absorbing first layer of the at least two dyads has essentially the same optical absorption rate; wherein the fraction of absorbing material is essentially the same for each dyad in the first stack of layers; and wherein the thickness of each dyad in the first stack of layers is selected to provide essentially the same total power absorbed for each dyad in the first stack of layers.
9. The thermal transfer donor element of claim 1 further comprising a second stack of layers comprising at least two dyads; wherein the fraction of absorbing material is essentially the same for each dyad in the second stack of layers; and further wherein the fraction of absorbing material is essentially the same for each dyad in the first stack of layers.
10. A thermal transfer donor element comprising:
an essentially non-absorbing substrate; and
a light-to-heat conversion layer on at least a portion of the substrate, wherein the light-to-heat conversion layer comprises:
a first stack of layers comprising at least two dyads, wherein each of the at least two dyads of the first stack of layers comprises:
an absorbing first layer; and
an essentially non-absorbing second layer, wherein the fraction of absorbing material is essentially the same for each dyad in the first stack of layers, wherein each absorbing first layer of the at least two dyads has essentially the same optical absorption rate; and
wherein the total thickness of each dyad in the first stack of layers is essentially the same; and
a second stack of layers comprising at least two dyads, wherein the fraction of absorbing material is essentially the same for each dyad in the second stack of layers, and
wherein the total thickness of each dyad in the second stack of layers is essentially the same;
wherein the total thickness of each dyad in the first stack of layers is different than the total thickness of each dyad in the second stack of layers.
11. A method of preparing a thermal transfer donor element, the method comprising:
providing an essentially non-absorbing substrate;
forming a stack of layers comprising at least two dyads on at least a portion of the substrate; and
forming a thermal transfer layer on at least a portion of the light-to-heat conversion layer,
wherein each of the at least two dyads comprises:
an absorbing first layer; and
an essentially non-absorbing second layer,
wherein each absorbing first layer of the at least two dyads has essentially the same optical absorption rate.
12. The method of claim 11 wherein forming comprises extruding the first layer and the second layer of at least one dyad.
13. The method of claim 12 wherein extruding comprises coextruding the first layer and the second layer of the at least one dyad.
14. The method of claim 11 wherein forming comprises coextruding each layer of the at least two dyads onto the substrate.
15. A method of preparing a thermal transfer donor element, the method comprising:
providing an essentially non-absorbing substrate;
forming an absorbing first layer on at least a portion of the substrate;
forming an essentially non-absorbing second layer on at least a portion of the absorbing first layer; and
forming a thermal transfer layer on at least a portion of the second layer,
wherein the composition of the essentially non-absorbing substrate is essentially the same as the composition of the essentially non-absorbing second layer, and wherein forming the first layer comprises extruding the first layer.
16. The method of claim 15 wherein forming the second layer comprises extruding the second layer.
17. The method of claim 15 wherein forming the first layer and forming the second layer comprises coextruding the first layer and the second layer.
18. The method of claim 15 wherein forming the first layer and forming the second layer comprises coextruding the first layer and the second layer onto the substrate.
19. The method of claim 15 wherein forming the first layer and forming the second layer comprises coextruding the first layer, the second layer, and the substrate.
20. A method for selective thermal mass transfer, the method comprising:
providing a thermal transfer donor element according to claim 1 ;
placing the thermal transfer layer of the donor element adjacent to a receptor substrate; and
thermally transferring portions of the thermal transfer layer from the donor element to the receptor substrate by selectively irradiating the donor element with imaging radiation that can be absorbed and converted into heat by the light-to-heat conversion layer.