IP Library Patent Application 11421546
Patent Application
App. No. 11/421,546

Heat Dissipator

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Quick Facts
Patent No.
US None
App. No.
11/421,546
Abstract

A heat dissipator for mounting on a heat-generating element includes a heat-dissipating body, a fan assembly, a bottom stand and a top stand. The heat-dissipating body is formed into a spherical body and constituted of a plurality of heat-dissipating pieces. The heat-dissipating body is provided with a sealed accommodating space therein for accommodating the fan assembly. Further, the bottom stand and the top stand are provided at the upper and lower ends of the heat-dissipating body, respectively. Further, the bottom of the fan assembly has a connecting seat for connecting to the bottom stand to fix the fan assembly. Finally, the bottom stand is provided with a heat-conducting block for adhering to the heat-generating element, thereby to conduct the heat generated by the operation of the heat-generating element to the heat-dissipating body. In this way, the heat can be uniformly dissipated to each heat-dissipating piece. With the airflow generated by the fan assembly, the heat-dissipating effect can be satisfactorily achieved.

Claims (32)

1 . A heat dissipator for adhering on a heat-generating element, comprising:

a heat-dissipating body including a plurality of annular heat-dissipating pieces, the heat-dissipating body provided with a sealed accommodating space therein;

a bottom stand provided on a bottom of the heat-dissipating body and combined therewith, the bottom of the bottom stand adhering to the heat-generating element; and

a fan assembly provided within the sealed accommodating space of the heat-dissipating body, a bottom of the fan assembly having a connecting seat for connecting to the bottom stand to fix the fan assembly.

2 . The heat dissipator according to claim 1 , wherein the heat-dissipating body includes two corresponding semi-spherical bodies.

3 . The heat dissipator according to claim 2 , wherein the semi-spherical body includes a plurality of heat-dissipating pieces.

4 . The heat dissipator according to claim 1 , wherein an outer periphery of the heat-dissipating piece is formed into a curved shape.

5 . The heat dissipator according to claim 1 , wherein an outer periphery of the heat-dissipating piece is formed into a rectangular shape.

6 . The heat dissipator according to claim 1 , wherein an upper and a lower ends of the heat-dissipating body have a hollow connecting portion, respectively.

7 . The heat dissipator according to claim 1 , wherein a top of the heat-dissipating body is further provided with a top stand.

8 . The heat dissipator according to claim 7 , wherein the top stand is connected to the connecting portion.

9 . The heat dissipator according to claim 7 , wherein the top stand is further provided with a connecting pillar.

10 . The heat dissipator according to claim 9 , wherein the connecting pillar is connected to each heat-dissipating piece of the heat-dissipating body.

11 . The heat dissipator according to claim 7 , wherein the top stand includes two corresponding sub-stands.

12 . The heat dissipator according to claim 11 , wherein the two corresponding sub-stands are connected together by fastening elements.

13 . The heat dissipator according to claim 7 , wherein the top stand is integrally formed into one piece.

14 . The heat dissipator according to claim 7 , wherein the top stand has high heat conductivity.

15 . The heat dissipator according to claim 1 , wherein the bottom stand is further provided with a connecting pillar.

16 . The heat dissipator according to claim 15 , wherein the connecting pillar is connected to a connecting portion of the heat-dissipating body.

17 . The heat dissipator according to claim 1 , wherein the bottom stand includes two corresponding sub-stands.

18 . The heat dissipator according to claim 17 , wherein the two sub-stands are respectively provided with a plurality of protruding posts and holes with respective position corresponding to each other.

19 . The heat dissipator according to claim 1 , wherein the bottom stand is integrally formed into one piece.

20 . The heat dissipator according to claim 7 , wherein the bottom stand has high heat conductivity.

21 . The heat dissipator according to claim 1 , wherein a bottom of the bottom stand is further provided with a heat-conducting block.

22 . The heat dissipator according to claim 1 , wherein a direction of airflow generated by the fan assembly is downward.

23 . The heat dissipator according to claim 1 , wherein the connecting seat of the fan assembly is sandwiched in the bottom stand.

24 . The heat dissipator according to claim 1 , wherein the connecting seat of the fan assembly is provided with a plurality of positioning holes.

25 . The heat dissipator according to claim 24 , wherein the bottom stand has protruding posts penetrating through the positioning holes, respectively.

26 . The heat dissipator according to claim 1 , wherein the heat dissipator further comprises at least one heat pipe.

27 . The heat dissipator according to claim 26 , wherein the heat pipe is circumferentially provided on an outer periphery of the heat dissipator.

28 . The heat dissipator according to claim 26 , wherein heat-dissipating pieces adhered by the heat pipe are substantially smaller than heat-dissipating pieces on both sides.

29 . The heat dissipator according to claim 26 , wherein both ends of the heat pipe are provided within the bottom stand and the top stand, respectively.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 20, 2012
From: COOLER MASTER CO., LTD.
To: CHEMTRON RESEARCH LLC
Reel/Frame 027567/0332 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 1, 2006
From: HUANG, YI-HE
To: COOLER MASTER CO., LTD.
Reel/Frame 017708/0531 →