IP Library Granted Patent US 8,120,023
Granted Patent B2
US 8,120,023 · App. 11/422,246 · Granted Feb 21, 2012

Low crosstalk, front-side illuminated, back-side contact photodiode array

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Quick Facts
Patent No.
US 8,120,023
App. No.
11/422,246
Granted
Feb 21, 2012
Kind
B2
Abstract

The present invention is directed to novel front side illuminated, back side contact photodiodes and arrays thereof. In one embodiment, the photodiode has a substrate with at least a first and a second side and a plurality of electrical contacts physically confined to the second side. The electrical contacts are in electrical communication with the first side through a doped region of a first type and a doped region of a second type, each of the regions substantially extending from the first side through to the second side. In another embodiment, the photodiode comprises a wafer with at least a first and a second side; and a plurality of electrical contacts physically confined to the second side, where the electrical contacts are in electrical communication with the first side through a diffusion of a p+ region through the wafer and a diffusion of an n+ region through the wafer.

Claims (32)

1. A photodiode comprising:

a substrate having at least a first side, wherein said first side has an active area located therein, and a second side, wherein said second side comprises a plurality of electrical contacts;

each of the plurality of electrical contacts is electrically isolated from each other;

within said substrate, a shallow diffused region of a first conductivity type directly under said active area;

within said substrate, a deep diffused region of the first conductivity type extending from said shallow area to said second side;

within said substrate, at least two deep diffused regions of a second conductivity type extending from said first side to said second side, wherein said deep diffused region of the first conductivity type lies between the two deep diffused regions of the second conductivity type; and wherein each of said deep diffused region of the first conductivity type and the two deep diffused regions of the second conductivity type are in physical contact with said a plurality of electrical contacts.

2. The photodiode of claim 1 wherein said shallow diffused region and said deep diffused region of the first conductivity type is an n+ doped region.

3. The photodiode of claim 2 wherein said deep diffused region of the first conductivity type is in electrical communication with at least one of said plurality of electrical contacts comprising n+ metal.

4. The photodiode of claim 1 wherein said at least two deep diffused regions of the second conductivity type is a p+ doped region.

5. The photodiode of claim 4 wherein said at least two deep diffused regions of the second conductivity type is in electrical communication with at least one of said plurality of electrical contacts comprising p+ metal.

6. The photodiode of claim 1 wherein the active area comprises a region for receiving incident light on said first side.

7. The photodiode of claim 1 , wherein the substrate comprises silicon.

8. The photodiode of claim 1 , wherein the first side forms the front side of a wafer containing said substrate and the second sides forms the back side of the wafer containing said substrate respectively.

9. The photodiode of claim 1 , wherein the photodiode is part of a front side illuminated backside contact photodetector array.

10. The photodiode of claim 1 wherein said shallow diffused region and said deep diffused region of the first conductivity type is a p+ doped region.

11. The photodiode of claim 10 wherein said deep diffused region of the first conductivity type is in electrical communication with at least one of said plurality of electrical contacts comprising n+ metal.

12. The photodiode of claim 1 wherein said at least two deep diffused regions of the second conductivity type is a p+ doped region.

13. The photodiode of claim 12 wherein said at least two deep diffused regions of the second conductivity type is in electrical communication with at least one of said plurality of electrical contacts comprising p+ metal.

14. The photodiode of claim 1 wherein said substrate has a thickness of approximately 150 μm.

15. The photodiode of claim 1 wherein said active area has a width of approximately 1 mm.

16. A photodiode comprising:

a substrate having at least a first side, wherein said first side has an active area located therein, and a second side, wherein said second side comprises a plurality of electrical contacts;

each of the plurality of electrical contacts is electrically isolated from each other;

within said substrate, a shallow diffused region of a p+ conductivity type directly under said active area;

within said substrate, a deep diffused region of the p+ conductivity type extending from said shallow area to said second side;

within said substrate, at least two deep diffused regions of a n+ conductivity type extending from said first side to said second side, wherein said deep diffused region of the p+ conductivity type lies between the two deep diffused regions of the n+ conductivity type; and wherein each of said deep diffused region of the p+ conductivity type and the two deep diffused regions of the n+ conductivity type are in physical contact with said electrical contacts.

17. A photodiode comprising:

a substrate having at least a first side, wherein said first side has an active area located therein, and a second side, wherein said second side comprises a plurality of electrical contacts;

each of the plurality of electrical contacts is electrically isolated from each other;

within said substrate, a shallow diffused region of an n+ conductivity type directly under said active area;

within said substrate, a deep diffused region of the n+ conductivity type extending from said shallow area to said second side;

within said substrate, at least two deep diffused regions of a p+ conductivity type extending from said first side to said second side, wherein said deep diffused region of the n+ conductivity type lies between the two deep diffused regions of the p+ conductivity type; and wherein each of said deep diffused region of the n+ conductivity type and the two deep diffused regions of the p+ conductivity type are in physical contact with said electrical contacts.

Assignments (6)
RELEASE OF SECURITY INTEREST Recorded Jul 1, 2025
From: WELLS FARGO BANK, NATIONAL ASSOCIATION
To: OSI OPTOELECTRONICS, INC.
Reel/Frame 071581/0725 →
TERMINATION OF SECURITY INTEREST IN PATENTS Recorded Oct 21, 2010
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, SUCCESSOR-BY-MERGER TO WACHOVIA BANK, NATIONAL ASSOCIATION, AS ADMINISTRATIVE AGENT
To: OSI OPTOELECTRONICS, INC.
Reel/Frame 025169/0282 →
NOTICE OF GRANT OF SECURITY INTEREST IN PATENTS Recorded Oct 19, 2010
From: OSI OPTOELECTRONICS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS ADMINISTRATIVE AGENT
Reel/Frame 025150/0964 →
NUNC PRO TUNC ASSIGNMENT Recorded Nov 28, 2007
From: TANEJA, NARAYAN DASS
To: OSI OPTOELECTRONICS, INC.
Reel/Frame 020169/0481 →
NUNC PRO TUNC ASSIGNMENT Recorded Nov 27, 2007
From: BUI, PETER STEVEN
To: OSI OPTOELECTRONICS, INC.
Reel/Frame 020159/0664 →
NOTICE OF GRANT OF SECURITY INTEREST Recorded Aug 13, 2007
From: OSI OPTOELECTRONICS, INC.
To: WACHOVIA BANK, NATIONAL ASSOCIATION, AS ADMINISTRATIVE AGENT
Reel/Frame 019679/0364 →