Voltage-clipping device with high breakdown voltage
View Patent ↗The present invention proposes a voltage-clipping device utilizing a pinch-off mechanism formed by two depletion boundaries. A clipping voltage of the voltage-clipping device can be adjusted in response to a gate voltage; a gap of a quasi-linked well; and a doping concentration and a depth of the quasi-linked well and a well with complementary doping polarity to the quasi-linked well. The voltage-clipping device can be integrated within a semiconductor device as a voltage stepping down device in a tiny size, compared to traditional transformers.
1. A semiconductor device, comprising:
a substrate of a first conductive type;
a quasi-linked well of a second conductive type having the a first depletion boundary disposed in the substrate, wherein the quasi-linked well is formed by two adjacent wells having a gap with a width therebetween;
a first well of the first conductive type having the a second depletion boundary disposed in the quasi-linked well;
a first heavily doped region of the first conductive type disposed in the first well;
a second heavily doped region of the second conductive type disposed in the quasi-linked well outside a first side of the first well;
a third heavily doped region of the second conductive type disposed in the quasi-linked well outside a second side of the first well; and
an isolation layer disposed over the quasi-linked well and the first well, and between the first heavily doped region and the second heavily doped region and between the first heavily doped region and the third heavily doped region;
wherein the first depletion boundary of the quasi-linked well and the depletion boundary of the first well is modulated according to voltage variations, and a maximum output-voltage potential at an output terminal of said semiconductor device is controlled by a control-voltage potential.
2. The semiconductor device as claimed in claim 1 , wherein said quasi-linked well comprises a discontinuous ion-doping region parallel to a surface of said semiconductor device, and said discontinuous ion-doping region contains said gap.
3. The semiconductor device as claimed in claim 2 , wherein said maximum output-voltage potential is correlated with a width of said gap in said discontinuous doping region of said well.
4. The semiconductor device as claimed in claim 1 , wherein said maximum output-voltage potential is correlated with a doping concentration of said well.
5. The semiconductor device as claimed in claim 1 , wherein said maximum output-voltage potential is correlated to a complementary doping region with a complementary doping polarity to said well.
6. A voltage-clipping device, comprising an input terminal, an output terminal, and a control terminal, wherein said input terminal is connected to said out put terminal via a quasi-linked well which is formed by two adjacent wells having a gap with a width therebetween, said control terminal being connected to a control well with complementary doping polarity to said quasi-link well, a region under said quasi-linked well having complementary doping polarity to said quasi-linked well, wherein a voltage potential at said control terminal controls a depletion boundary between said control well and said quasi-linked well for generating a clipping voltage.
7. The voltage-clipping device as claimed in claim 6 , wherein a doping concentration of said control well is correlated to said clipping voltage.
8. The voltage-clipping device as claimed in claim 6 , wherein said quasi-linked well has a discontinuous ion-doping region in parallel to said control well, and said discontinuous ion-doping region contains said gap.
9. The voltage-clipping device as claimed in claim 8 , wherein a size of said discontinuous ion-doping region is correlated to said clipping voltage.
10. The voltage-clipping device as claimed in claim 6 , wherein a fringe well with complementary doping polarity to said quasi-linked well encloses said quasi-linked well, wherein said fringe well and said quasi-linked well are not directly connected to each other.
11. The voltage-clipping device as claimed in claim 6 , wherein an output-voltage potential at said output terminal varies in response to an input-voltage potential at said input terminal, said voltage potential at said control terminal controls said output-voltage potential at said output terminal to be clipped at a saturated region.
12. The voltage-clipping device as claimed in claim 6 , wherein a doping concentration of said control well ranges from 3.3E17/cm 3 to 1E19/cm 3 .
13. The voltage-clipping device as claimed in claim 6 , wherein a doping concentration of said quasi-linked well ranges from 1.7E17/cm 3 to 8.3E18/cm 3 .
14. The voltage-clipping device as claimed in claim 6 , wherein a depth of said quasi-linked well ranges from 2 μm to 10 μm.
15. The voltage-clipping device as claimed in claim 6 , wherein a depth of said control well ranges from 1 μm to 5 μm.
16. The voltage-clipping device as claimed in claim 8 , wherein a width of said gap in said discontinuous ion-doping region parallel to said control well ranges between 0 μm and 20 μm.
17. The voltage-clipping device as claimed in claim 10 , wherein a doping concentration of said fringe well ranges from 3.3E17/cm 3 to 1E19/cm 3 .
18. The voltage-clipping device as claimed in claim 10 , wherein a depth of said fringe well ranges from 1 μm to 5 μm.