Surface treatment method, manufacturing method of color filter substrate, and manufacturing method of electro-optical device
View Patent ↗A surface treatment method using a plasma treatment apparatus which has an electric discharge generation portion facing a surface of a substrate with a gap therebetween, the substrate being placed on a supporting body, and a construction in which the gap is supplied with a treatment gas, the method includes: applying different voltages between the electric discharge generation portion and the supporting body such that plasma is obtained from the treatment gas supplied to the gap; moving one of the electric discharge generation portion and the substrate relative to the other in a first direction, while the surface of the substrate being exposed to the plasma; and moving, after the relative movement in the first direction and the exposure above referenced, one of the electric discharge generation portion and the substrate relative to the other in a second direction opposite to the first direction, while the surface of the substrate being exposed to the plasma.
1. A surface treatment method using a plasma treatment apparatus which has an electric discharge generation portion facing a surface of a substrate with a gap therebetween, the substrate being placed on a supporting body, and a construction in which the gap is supplied with a treatment gas that contains oxygen, the method comprising:
applying different voltages between the electric discharge generation portion and the supporting body such that plasma is obtained from the treatment gas supplied to the gap;
moving one of the electric discharge generation portion and the substrate relative to the other in a first direction, while the surface of the substrate is being exposed to the plasma;
moving, after the relative movement in the first direction and the exposure above-referenced, one of the electric discharge generation portion and the substrate relative to the other in a second direction opposite to the first direction, while the surface of the substrate is being exposed to the plasma; and
exposing the substrate to atmospheric air between the process of the relative movement in the first direction and the exposure and the process of the relative movement in the second direction and the exposure.
2. The method of claim 1 wherein the relative movement in the first and second directions is continued from when the surface of the substrate enters a shadow area obtained by projecting the plasma treatment apparatus on the supporting body along the X axis direction until the surface of the substrate exits from the shadow area completely.