Diamond Composite Heat Spreader
A composite heat spreader is disclosed in one embodiment of the invention as including an input interface to conduct heat from a heat source, such as an integrated circuit, and an output interface to transfer heat to a heat sink. A support material having a first thickness is provided between the input interface and the output interface. One or more diamond monocrystals are embedded in the support material and have a second thickness which is at least 20% of the first thickness. In some embodiments, the diamond monocrystals extend from the input interface to the output interface. These one or more diamond monocrystals may be either rough or finished diamonds.
1 . A composite heat spreader comprising:
an input interface to conduct heat from a heat source:
an output interface to transfer heat to a heat sink;
a support material comprising a first thickness between the input interface and the output interface; and
a diamond monocrystal embedded in the support material, the diamond monocrystal comprising a second thickness which is at least 20% the first thickness.
2 . The composite heat spreader of claim 1 , wherein the diamond monocrystal extends from the input interface to the output interface.
2 . The composite heat spreader of claim 1 , wherein the diamond monocrystal is positioned within the support material to align with at least one of a hot spot, a via, and a conductor of the heat source.
3 . The composite heat spreader of claim 1 , wherein the support material comprises diamond grains.
4 . The composite heat spreader of claim 3 , wherein the diamond grains are compacted and sintered together to form polycrystalline compact diamond.
5 . The composite heat spreader of claim 4 , wherein at least a portion of the diamond grains are intergrown with each other and with the diamond monocrystal.
6 . The composite heat spreader of claim 1 , wherein the support material comprises a material selected from the group consisting of silicon, a metal, cubic boron nitride, a ceramic, a carbide, polycrystalline silicon, and combinations thereof.
7 . The composite heat spreader of claim 1 , wherein at least one of the input interface and the output interface are polished.
8 . The composite heat spreader of claim 1 , wherein the diamond monocrystal is one of a rough and finished diamond.
9 . The composite heat spreader of claim 1 , wherein at least a portion of the support material is metalized.
10 . The composite heat spreader of claim 1 , wherein the heat source is an integrated circuit.
11 . The composite heat spreader of claim 1 , wherein the second thickness is at least 25%, 35%, 50% or 70% the first thickness.
12 . A method for spreading heat generated by a heat source, the method comprising:
conducting, at an input interface, heat from a heat source:
transferring, at an output interface, heat to a heat sink;
providing a support material comprising a first thickness between the input interface to the output interface; and
embedding a diamond monocrystal in the support material, the diamond monocrystal comprising a second thickness which is at least 20% of the first thickness.
The method of claim 1 , wherein the diamond monocrystal extends from the input interface to the output interface.
13 . The method of claim 12 , further comprising positioning the diamond monocrystal within the support material to align with at least one of a hot spot, a via, and a conductor of the heat source.
14 . The method of claim 12 , wherein providing a support material comprises embedding diamond grains in the support material.
15 . The method of claim 14 , further comprising compacting and sintering the diamond grains to form polycrystalline compact diamond.
16 . The method of claim 15 , further comprising intergrowing at least a portion of the diamond grains with each other and with the diamond monocrystat
17 . The method of claim 12 , wherein providing a support material comprises providing a material selected from the group consisting of silicon, a metal, cubic boron nitride, a ceramic, a carbide, polycrystalline silicon, and combinations thereof.
18 . The method of claim 12 , further comprising polishing at least one of the input interface and the output interface.
19 . The method of claim 12 , wherein the diamond monocrystal is one of a rough and finished diamond.
20 . The method of claim 12 , further comprising metalizing at least a portion of the support material.
21 . A heat spreading assembly comprising:
an integrated circuit;
a heat sink;
a composite heat spreader inserted between the integrated circuit and the heat sink, the composite heat spreader comprising:
an input interface to conduct heat from the integrated circuit:
an output interface to transfer heat to the heat sink;
a support material comprising a first thickness between the input interface and the output interface; and
a diamond monocrystal embedded in the support material, the diamond monocrystal comprising a second thickness which is at least 20% of the first thickness.