Multilayer PCB antenna
View Patent ↗An inverted F-antenna may include an element formed from conductor patterns on a plurality of layers including at least one buried layer of a multilayer PCB, wherein (a) the conductor patterns are in stacked relation and interconnected through the PCB, (b) the conductor patterns comprise an F-shaped conductor pattern on one layer of the PCB and an I-, L- or F-shaped conductor pattern on the or each other layer, and (c) the or each I-, L- or F-shaped conductor pattern comprises an upright substantially coextensive with an upright of the F-shaped conductor pattern. A mobile phone may include such an antenna.
1. An inverted F-antenna comprising:
an element, and wherein
the element is formed from conductor patterns on a plurality of layers including at least one buried layer of a multilayer PCB, the PCB is apertured adjacent to the element, the conductor patterns are in stacked relation and interconnected through the PCB, and the conductor patterns comprise an F-shaped conductor pattern on one layer of the PCB and an I-, L- or F-shaped conductor pattern on the or each other layer, wherein the or each I-, L- or F-shaped conductor pattern comprises an upright substantially coextensive with an upright of the F-shaped conductor pattern.
2. An antenna according to claim 1 , wherein the element is located at an edge of the PCB.
3. An antenna according to claim 1 , wherein the or each I-, L- or F-shaped conductor pattern extends along an edge of the PCB.
4. An antenna according to claim 3 , wherein the PCB is apertured between the upright of at least one F-shaped conductor pattern and a ground plane area.
5. An antenna according to claim 4 , wherein the PCB has a slot between the upright of the at least one F-shaped conductor pattern and a ground plane area.
6. An antenna according to claim 1 , including an antenna ground plane comprising a plurality of vias connecting ground plane regions on respective PCB layers.
7. An antenna according to claim 6 , wherein the conductor patterns are elongated and each longitudinally extends at an edge of the PCB.
8. An antenna in accordance with claim 1 , wherein interconnection of the conductor patterns is from the conductor patterns through the at least one buried layer.
9. An antenna in accordance with claim 8 , wherein the interconnection is by vias extending through the at least one buried layer of the PCB.
10. An antenna according to claim 1 , wherein the PCB is apertured in a dielectric layer.
11. A mobile communications device including an inverted F-antenna disposed therein, the antenna comprising an element formed from conductor patterns on a plurality of layers including at least one buried layer of a multilayer PCB, wherein the PCB is apertured adjacent to the element, and wherein the conductor patterns are in stacked relation and interconnected through the PCB, and comprise an F-shaped conductor pattern on one layer of the PCB and an I-, L- or F-shaped conductor pattern on the or each other layer, wherein the or each I-, L- or F-shaped conductor pattern comprises an upright substantially coextensive with the upright of the F-shaped conductor pattern.
12. A mobile communications device according to claim 11 , wherein the conductor patterns are elongated and each longitudinally extends at an edge of the PCB.
13. A mobile communications device according to claim 11 , wherein the or each I-, L- or F-shaped conductor pattern extends along an edge of the PCB.
14. A mobile communications device according to claim 13 , wherein the PCB is apertured between the upright of at least one F-shaped conductor pattern and a ground plane area.
15. A mobile communications device according to claim 14 , wherein the PCB has a slot between the upright of the at least one F-shaped conductor pattern and a ground plane area.
16. A mobile communications device according to claim 11 , including an antenna ground plane comprising a plurality of vias connecting ground plane regions on respective PCB layers.
17. A mobile communications device in accordance with claim 11 , wherein interconnection of the conductor patterns is from the conductor patterns through the at least one buried layer.
18. A mobile communications device in accordance with claim 17 , wherein the interconnection is by vias extending through the at least one buried layer of the PCB.
19. A mobile communications device in accordance with claim 11 , wherein the mobile communications device is a mobile phone.
20. A mobile phone in accordance with claim 19 , wherein the conductor patterns are elongated and each longitudinally extends at an edge of the PCB.
21. A mobile phone in accordance with claim 19 , wherein the or each I-, L- or F-shaped conductor pattern extends along an edge of the PCB.
22. A mobile phone in accordance with claim 21 , wherein the PCB is apertured between the upright of at least one F-shaped conductor pattern and a ground plane area.
23. A mobile phone in accordance with claim 22 , wherein the PCB has a slot between the upright of the at least one F-shaped conductor pattern and a ground plane area.
24. A mobile phone in accordance with claim 19 , including an antenna ground plane comprising a plurality of vias connecting ground plane regions on respective PCB layers.
25. A mobile phone in accordance with claim 19 , wherein interconnection of the conductor patterns is from the conductor patterns through the at least one buried layer.
26. A mobile phone in accordance with claim 25 , wherein the interconnection is by vias extending through the at least one buried layer of the PCB.
27. A mobile phone according to claim 11 , wherein the PCB is apertured in a dielectric layer.
28. An inverted F-antenna comprising:
an element, wherein the element is formed from conductor patterns on a plurality of layers including at least one buried layer of a multilayer PCB, the conductor patterns are in stacked relation and interconnected through the PCB, and the conductor patterns comprise an F-shaped conductor pattern on one layer of the PCB and an I-, L- or F-shaped conductor pattern on the or each other layer, wherein the or each I-, L- or F-shaped conductor pattern comprises an upright substantially coextensive with an upright of the F-shaped conductor pattern; and
an antenna ground plane comprising a plurality of vias connecting ground plane regions on respective PCB layers.
29. An antenna according to claim 28 , wherein the element is located at an edge of the PCB.
30. An antenna according to claim 28 , wherein the or each I-, L- or F-shaped conductor pattern extends along an edge of the PCB.
31. An antenna according to claim 30 , wherein the PCB is apertured between the upright of at least one F-shaped conductor pattern and a ground plane area.
32. An antenna according to claim 31 , wherein the PCB has a slot between the upright of the at least one F-shaped conductor pattern and a ground plane area.
33. An antenna according to claim 28 , wherein the conductor patterns are elongated and each longitudinally extends at an edge of the PCB.
34. An antenna in accordance with claim 28 , wherein interconnection of the conductor patterns is from the conductor patterns through the at least one buried layer.
35. An antenna in accordance with claim 34 , wherein the interconnection is by vias extending through the at least one buried layer of the PCB.