Dynamic driver IC and display panel configuration
View Patent ↗A display device which can provide configuration information to the driver circuit and methods of manufacturing and operating the same are disclosed. In one embodiment, a display device comprises a display array and a collection of links configured to store information related to the display array.
1. A method of storing information related to a display array formed on a substrate, the method comprising:
forming a collection of links on the periphery of a display array on the substrate to store information related to said display array, wherein said information is encoded by forming each link as a broken or continuous metal line between a first end and a second end of the link so as to form either an open circuit or a closed circuit between the first and second end;
connecting an array driver to the display array and the collection of links, the array driver comprising at least one blowable fuse; and
setting the at least one blowable fuse to form either an open circuit or closed circuit between a first end and a second end of the blowable fuse based at least in part on information read from the collection of links, wherein the array driver drives the display array based at least in part on the setting of the blowable fuse.
2. The method of claim 1 , wherein the information is stored in the collection of links and is readable by detecting whether each link forms an open circuit or closed circuit between two ends of the link.
3. The method of claim 1 , wherein the information comprises the type of the display array.
4. The method of claim 1 , wherein the information comprises drive parameters for an array driver coupled to the display array.
5. The method of claim 1 , wherein each link comprises a highly conductive metal line.
6. The method of claim 1 , wherein the forming further comprises:
forming a collection of blowable fuses, each blowable fuse comprising a blowable fuse connecting the two ends of the link; and
selectively blowing the blowable fuse of a subset of blowable fuses.
7. The method of claim 1 , wherein the forming further comprises:
forming a collection of highly conductive metal lines; and
selectively breaking a subset of the collection of metal lines.
8. The method of claim 1 , wherein the collection of links is not a part of the array driver.