IP Library › Patent Application 11429706
Patent Application
App. No. 11/429,706

Overmolded substrate

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Quick Facts
Patent No.
US None
App. No.
11/429,706
Abstract

An overmolded substrate having a generally planar substrate with a plurality of support feet on the first side of the substrate. A molding material is molded around the substrate enveloping the substrate of both the first side and the second side of the substrate. The substrate may have a coil positioned on the second side of the magnetic substrate.

Claims (26)

1 . An overmolded substrate having a first side and a second side, comprising:

a generally planar substrate;

a plurality of support feet on said first side of said substrate; and

a molding material molded around said substrate enveloping said substrate of both said first side and said second side of said substrate.

2 . An overmolded substrate as in claim 1 wherein said support feet are molded in a first molding step and said molding material is molded around said substrate in a second molding step.

3 . An overmolded substrate as in claim 2 wherein molding material is substantially evenly distributed on said first side and said second side during molding;

4 . An overmolded substrate as in claim 1 wherein said substrate is overmolded only from said first side of said substrate.

5 . An overmolded substrate as in claim 1 wherein said substrate has a central hub opening.

6 . An overmolded substrate as in claim 5 wherein said molding material is distributed to said second side of said substrate through said central hub opening.

7 . An overmolded substrate as in claim 1 wherein said feet have a circular cross-section.

8 . An overmolded substrate as in claim 7 wherein molding material forms around each of said plurality of feet.

9 . An overmolded substrate as in claim 8 wherein said central hub opening has a circular post around which said molding material is allowed to form.

10 . An overmolded substrate having a first side and a second side, comprising:

a generally planar magnetic substrate;

a coil positioned on said second side of said magnetic substrate;

a plurality of support feet on said first side of said magnetic substrate; and

a molding material molded around said substrate enveloping said magnetic substrate on both said first side and said second side of said magnetic substrate.

11 . An overmolded substrate as in claim 10 wherein said support feet are molded in a first molding step and said molding material is molded around said magnetic substrate in a second molding step.

12 . An overmolded substrate as in claim 11 wherein molding material is substantially evenly distributed on said first side and said second side of said magnetic substrate during molding;

13 . An overmolded substrate as in claim 11 wherein said second side of said molding material is concave.

14 . An overmolded substrate as in claim 10 wherein said magnetic substrate is overmolded only from said first side of said magnetic substrate.

15 . An overmolded substrate as in claim 10 wherein said magnetic substrate has a central hub opening.

16 . An overmolded substrate as in claim 15 wherein said molding material is distributed to said second side of said magnetic substrate through said central hub opening.

17 . An overmolded substrate as in claim 10 wherein said feet have a circular cross-section.

18 . An overmolded substrate as in claim 17 wherein molding material forms around each of said plurality of feet.

19 . An overmolded substrate as in claim 18 wherein said central hub opening has a circular post around which said molding material is allowed to form.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 27, 2006
From: DEININGER, STEVE T.; KAST, JOHN E.; PETERS, CHARLES E.
To: MEDTRONIC, INC.
Reel/Frame 018330/0578 →