Light emitting device using a thermally activated coating and method of manufacturing
View Patent ↗An improved method for encapsulating LEDs in a polymer coat is described. A substrate houses an LED, and a polymer layer is brought into proximity with the substrate and LED. The polymer layer is melted over the substrate, encapsulating the LED onto the substrate.
1. A method for manufacturing a plurality of light emitting devices, comprising:
providing a substrate having a plurality of LEDs attached thereon;
positioning a solid thermally activated polymer layer over the substrate and the plurality of LEDs;
melting the thermally activated polymer layer such that the thermally activated polymer layer encapsulates the LEDs; and
separating the plurality of encapsulated LEDs into segments of one or more LEDs.
2. The method of claim 1 wherein said positioning comprises resting the thermally activated polymer layer on the substrate.
3. The method of claim 1 wherein melting the thermally activated polymer layer further comprises allowing to flow by gravity.