Encoder having angled die placement
An optical encoder including a leadframe substrate, an emitter, and a detector is disclosed. The leadframe substrate bent to include a base portion, an emitter portion and a detector portion. The emitter, for emitting light, is mounted on the emitter portion. The detector, for detecting light, is mounted on the detector portion. The emitter portion lies at an emitter angle relative to the base portion such that light emitted by the emitter is generally directed at a desired direction. The detector portion lies at a detector angle relative to the base portion such that reflected light is captured by the detector. Due to the angles at which the emitter and the detector are mounted, lenses are not necessary; however, even if lenses are used, the encoder is more robust towards manufacturing tolerances of the lenses.
1 . An optical encoder comprising:
a leadframe substrate having a base portion, an emitter portion and a detector portion;
an emitter operable to emit light, said emitter mounted on the emitter portion of said leadframe substrate;
a detector operable to detect light, said detector mounted on the detector portion of said leadframe substrate;
wherein the emitter portion of said leadframe substrate lies at an emitter angle relative to the base portion such that light emitted by said emitter is generally directed at a desired direction.
2 . The optical encoder recited in claim 1 wherein the detector portion of said leadframe substrate lies at a detector angle relative to the base portion such that light reflected from a code scale is generally directed toward said detector.
3 . The optical encoder recited in claim 2 wherein the emitter angle and the detector angle have same absolute value.
4 . The optical encoder recited in claim 1 further comprising encapsulant encapsulating said emitter and said detector.
5 . The optical encoder recited in claim 4 wherein the encapsulant defines an emitter lens adapted to direct light from said emitter toward a desired direction.
6 . The optical encoder recited in claim 4 wherein the encapsulant defines a detector lens adapted to direct reflected light toward said detector.
7 . The optical encoder recited in claim 1 further comprising an emitter lens adapted to direct light from said emitter toward a desired direction.
8 . The optical encoder recited in claim 1 further comprising a detector lens adapted to direct reflected light toward said detector.
9 . An optical encoder comprising:
a substrate defining a cavity having surfaces;
an emitter operable to emit light, said emitter mounted on a first surface of the cavity; and
a detector operable to detect light, said detector mounted on a second surface of the cavity.
10 . The optical encoder package recited in claim 9 wherein said substrate is Silicon substrate.
11 . The optical encoder package recited in claim 9 wherein said emitter is positioned such that emitted light is generally directed up and toward the center of the cavity.
12 . The optical encoder package recited in claim 9 wherein said detector is positioned generally facing up and center of the cavity.
13 . A method of manufacturing an apparatus, said method comprising:
providing a leadframe substrate;
mounting an emitter on the leadframe substrate;
mounting a detector on the leadframe substrate; and
bending the leadframe such that a base portion and an emitter portion are formed, said emitter portion being at an emitter angle relative to the base portion.
14 . The method recited in claim 13 further comprising a step of bending the leadframe such that a detector portion is formed, said detector portion resulting at a detector angle relative to the base portion.
15 . The method recited in claim 14 wherein the emitter angle and the detector angle have same absolute value.
16 . The method recited in claim 13 further comprising a step of encapsulating said emitter and said detector.
17 . The method recited in claim 16 wherein the encapsulant defines an emitter lens adapted to direct light from said emitter toward a desired direction.
18 . The method recited in claim 16 wherein the encapsulant defines a detector lens adapted to direct reflected light toward said detector.
19 . A method of manufacturing an apparatus, said method comprising:
providing a substrate;
fabricating a cavity in the substrate, the cavity defining surfaces;
mounting an emitter on a first surface of the cavity; and
mounting a detector on a second surface of the cavity.
20 . The method recited in claim 19 wherein said substrate is Silicon substrate.
21 . The method recited in claim 19 wherein said emitter is positioned such that emitted light is generally directed up and toward the center of the cavity.
22 . The method recited in claim 19 wherein said detector is positioned generally facing up and center of the cavity.