Lightweight C-sandwich radome fabrication
View Patent ↗A C-sandwich radome structure includes a first core, an outer skin layer on the first core, a second core, and an inner skin layer on the second core. An intermediate skin layer is disposed between the first core and the second core and the intermediate skin layer includes a dielectric enhancer for raising the dielectric constant of the intermediate skin layer so the intermediate skin layer can be made thinner to reduce the weight and cost of the structure while maintaining the electrical transmission performance of a thicker, heavier intermediate skin layer.
1. A C-sandwich radome structure comprising:
a first core;
an outer skin layer on the first core;
a second core;
an inner skin layer on the second core; and
an intermediate skin layer between the first core and the second core, the intermediate skin layer including a resin and a dielectric enhancer for raising the dielectric constant of the resin of the intermediate skin layer so the intermediate skin layer can be made thinner to reduce the weight of the structure.
2. The C-sandwich radome structure of claim 1 in which the intermediate skin layer includes the resin and the dielectric enhancer includes high dielectric powders in the resin.
3. The C-sandwich radome structure of claim 2 in which the resin is an epoxy, cyanate ester, or bismaleimide.
4. The C-sandwich radome structure of claim 2 in which the powders are titanium dioxide, strontium titanate, or barium titanate.
5. The C-sandwich radome structure of claim 2 in which the intermediate skin layer further includes reinforcing fibers.
6. The C-sandwich radome structure of claim 5 in which the fibers are glass fibers.
7. The C-sandwich radome structure of claim 1 in which the intermediate skin layer is between 10 to 20 mils in thickness.
8. The C-sandwich radome structure of claim 1 in which the intermediate skin layer is less thick than the inner skin layer and the outer skin layer.
9. The C-sandwich radome structure of claim 8 in which the outer skin layer and the inner skin layer each have a thickness t and the intermediate skin has a thickness approximately t/2.
10. The C-sandwich radome structure of claim 1 in which the intermediate skin layer has a dielectric constant of between 8 to 14.
11. The C-sandwich radome structure of claim 10 in which the intermediate skin layer has a dielectric constant of approximately 11.
12. The C-sandwich radome structure of claim 1 in which the first and second cores comprise honeycomb material.
13. The C-sandwich radome structure of claim 1 in which the first and second cores each have a thickness of approximately ¼ the wavelength of a frequency of interest.
14. The C-sandwich radome structure of claim 1 in which the outer and inner skin layers each comprise plies of woven fabric in a resin matrix.
15. The C-sandwich radome structure of claim 14 in which there are between 2 to 4 plies.
16. The C-sandwich radome structure of claim 14 in which the resin is an epoxy, cyanate ester, bismaleimide.
17. The C-sandwich radome structure of claim 1 in which the outer and inner skin layers each have a dielectric constant of between 2 to 5.
18. The C-sandwich radome structure of claim 17 in which the outer and inner skin layers each have a dielectric constant of approximately 3.5.
19. The C-sandwich radome structure of claim 1 in which the outer and inner skin layers have a thickness of between 10 to 30 mils.
20. The C-sandwich radome structure of claim 19 in which the outer and inner skin layers each have a thickness of approximately 20 mils.
21. A C-sandwich radome structure comprising:
a first core;
an outer skin layer on the first core having a thickness t and a dielectric constant resulting in a susceptance b;
a second core;
an inner skin layer on the second core having the same thickness t and a dielectric constant resulting in the susceptance b; and
an intermediate skin layer between the first core and the second core having a susceptance of approximately twice b but a thickness less than or equal to t.
22. A C-sandwich radome structure comprising:
a first core;
an outer skin layer on the first core;
a second core;
an inner skin layer on the second core; and
a resin based intermediate skin layer between the first core and the second core and including a resin and ceramic powders therein for raising the dielectric constant of the resin of the intermediate skin layer so the intermediate skin layer can be made thinner to reduce the weight of the structure.
23. A method of making a C-sandwich radome structure, the method comprising:
forming an intermediate skin layer to include a resin and a dielectric enhancer;
placing the intermediate skin layer between a first core and a second core; and
assembling an outer skin layer onto the first core and an inner skin layer onto the second core.
24. The method of claim 23 in which the intermediate skin layer is made to have a susceptance approximately twice the susceptance of the inner skin layer and the outer skin layer but with a thickness less than or equal to the thickness of the inner skin layer and the outer skin layer.
25. The method of claim 23 in which the intermediate skin layer includes the resin and the dielectric enhancer includes high dielectric powders disposed in the resin.
26. The method of claim 25 in which the resin is an epoxy, cyanate ester, or bismaleimide.
27. The method of claim 25 in which the ceramic powders are titanium dioxide, strontium titanate, or barium titanate.
28. The method of claim 25 in which the intermediate skin layer includes reinforcing fibers.
29. The method of claim 28 in which the fibers are glass fibers.
30. The method of claim 23 in which the intermediate skin layer is between 10 to 20 mils in thickness.
31. The method of claim 23 in which the intermediate skin layer is less thick than the inner skin layer and the outer skin layer.
32. The method of claim 31 in which outer skin layer and the inner skin layer each have a thickness t and the intermediate skin layer has a thickness approximately t/2.
33. The method of claim 23 in which the intermediate skin layer has a dielectric constant of between 8 to 14.
34. The method of claim 33 in which the intermediate skin layer has a dielectric constant of approximately 11.
35. The method of claim 23 in which the first and second cores comprise honeycomb material.
36. The method of claim 23 in which the first and second cores each have a thickness of approximately ¼ the wavelength of a frequency of interest.
37. The method of claim 23 in which the outer and inner skin layers each comprise plies of woven fabric in a resin matrix.
38. The method of claim 23 in which there are between 2 to 4 plies in each of the outer and inner skin layers.
39. The method of claim 37 in which the resin is an epoxy, cyanate ester, or bismaleimide.
40. The method of claim 23 in which the outer and inner skin layers each have a dielectric constant of between 2 to 5.
41. The method of claim 40 in which the outer and inner skin layers each have a dielectric constant of approximately 3.5.
42. The method of claim 23 in which the outer and inner skin layers have a thickness of between 10 to 30 mils.
43. The method of claim 42 in which the outer and inner skin layers each have a thickness of approximately 20 mils.