IP Library Granted Patent US 7,420,523
Granted Patent B1
US 7,420,523 · App. 11/434,485 · Granted Sep 2, 2008

B-sandwich radome fabrication

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Quick Facts
Patent No.
US 7,420,523
App. No.
11/434,485
Granted
Sep 2, 2008
Kind
B1
Abstract

A B-sandwich radome structure including a structural layer, an inside matching layer adjacent one side of the structural layer, and an outside matching layer adjacent an opposite side of the structural layer. Both matching layers are made of formable sheet material assembled with the structural layer during shaping of the radome and co-cured with the structural layer resulting in a rigid final form of the radome.

Claims (59)

1. A B-sandwich radome structure comprising:

a structural layer including plies of fibers in a resin matrix;

an inside matching layer adjacent to one side of the structural layer; and

an outside matching layer adjacent to the opposite side of the structural layer, both matching layers having a dielectric constant lower than a dielectric constant of the structural layer and made of formable sheet material assembled with the structural layer during shaping of the radome and co-cured with the structural layer resulting in a rigid final form of the radome, the matching sheet layer material during assembly including an uncured thermoset resin with a plurality of gas-filled microspheres therein to reduce the dielectric constant of the matching layers.

2. The B-sandwich radome structure of claim 1 in which the microspheres are filled with air.

3. The B-sandwich radome structure of claim 1 in which the dielectric constant of each matching layer is between 1.3 and 3.0.

4. The B-sandwich radome structure of claim 3 in which the dielectric constant of each matching layer is approximately 1.9.

5. The B-sandwich radome structure of claim 1 in which the resin is an epoxy, cyanate ester, or bismaleimide.

6. The B-sandwich radome structure of claim 1 in which each matching layer has a nominal thickness of between ¼ to ¾ wavelength for the frequency of interest.

7. The B-sandwich radome structure of claim 1 in which each matching layer has a density of between 20 to 60 lbs/ft 3 .

8. The B-sandwich radome structure of claim 7 in which each matching layer has a density of approximately 40 lbs/ft 3 .

9. The B-sandwich radome structure of claim 1 in which the structural layer includes plies of fabric impregnated with a resin.

10. The B-sandwich radome structure of claim 9 in which during assembly, the structural layer is a prepreg.

11. The B-sandwich radome structure of claim 9 in which the fabric is a woven fabric.

12. The B-sandwich radome structure of claim 9 in which there are between 10 and 30 plies at 10 GHz.

13. The B-sandwich radome structure of claim 9 in which the resin is an epoxy, cyanate ester, or bismaleimide.

14. The B-sandwich radome structure of claim 1 in which the structural layer has a minimal thickness of between ¼ to ¾ or 5/4 or more wavelength for the frequency of interest.

15. The radome structure of claim 1 further including a matching layer dividing two structural layers.

16. An uncured B-sandwich radome structure comprising:

a prepreg structural layer with a number of plies of fabric impregnated with a resin;

an inside matching layer adjacent to one side of the prepreg structural layer; and

an outside matching layer adjacent to the opposite side of the structural layer,

both matching layers having a dielectric constant lower than a dielectric constant of the structural layer and made of formable sheets of uncured resin including a dielectric constant reducing agent therein, the dielectric constant reducing agent including a plurality of gas filled microspheres.

17. The uncured B-sandwich radome structure of claim 16 in which the microspheres are filled with air.

18. The uncured B-sandwich radome structure of claim 16 in which the dielectric constant of each matching layer is between 1.3 and 3.0.

19. The uncured B-sandwich radome structure of claim 16 in which the resin of the prepreg structural layer and both matching layers is an epoxy, cyanate ester, or bismaleimide.

20. The uncured B-sandwich radome structure of claim 18 in which each matching layer has a nominal thickness of between ¼ to ¾ of a wavelength for the frequencies of interest.

21. The uncured B-sandwich radome structure of claim 16 in which each matching layer has a density of between 20 to 60 lbs/ft 3 .

22. The uncured B-sandwich radome structure of claim 21 in which each matching layer has a density of approximately 40 lbs/ft 3 .

23. The uncured B-sandwich radome structure of claim 16 in which the fabric is a woven fabric.

24. The uncured B-sandwich radome structure of claim 16 in which there are between 10 and 30 plies typically at 10 GHz.

25. The uncured B-sandwich radome structure of claim 16 in which the structural layer has a nominal thickness of between ¼ to ¾ or 5/4 or more wavelength for the frequency of interest.

26. The uncured B-sandwich radome structure of claim 16 further including a matching layer dividing two structural layers.

27. A method of manufacturing a B-sandwich radome, the method comprising:

forming a layup of a radome shape including an inside matching layer, a structural layer, and an outside matching layer;

the structural layer including plies of fabric pre-impregnated with a resin; and

the matching layers each having a dielectric constant lower than a dielectric constant of the structural layer and including uncured resin with a dielectric constant reducing agent therein, the dielectric constant reducing agent including a plurality of gas filled microspheres.

28. The method of claim 27 in further including the step of co-curing all the layers.

29. The method of claim 28 in which co-curing occurs in an autoclave or oven.

30. The method of claim 29 further including the step of placing a breather sheet adjacent one matching layer to assist in outgassing.

31. The method of claim 27 in which the microspheres are filled with air.

32. A radome structure comprising:

at least one structural layer including plies of fibers in a resin matrix; and

a matching layer having a dielectric constant lower than a dielectric constant of the structural layer and made of a formable sheet material assembled with the structural layer during shaping of the radome structure and co-cured with the structural layer resulting in a rigid final form of the radome, the matching layer including a dielectric constant reducing agent therein, the dielectric constant reducing agent including a plurality of gas filled microspheres.

33. The radome structure of claim 32 in which there is a single structural layer, an inside matching layer adjacent one side of the structural layer, and an outside matching layer adjacent an opposite side of the structural layer.

34. The radome structure of claim 32 in which there are two structural layers and a matching layer between the two structural layers.

35. The radome structure of claim 34 further including an inside matching layer adjacent one side of one structural layer and an outside matching layer adjacent one side of the other structural layer.

36. A B-sandwich radome structure comprising:

a structural layer;

an inside matching layer adjacent to one side of the structural layer; and

an outside matching layer adjacent to the opposite side of the structural layer, both matching layers made of formable sheet material assembled with the structural layer during shaping of the radome and co-cured with the structural layer resulting in a rigid final form of the radome, the matching sheet layer material during assembly including an uncured thermoset resin with a plurality of gas-filled microspheres therein to reduce the dielectric constant of the matching layers.

37. An uncured B-sandwich radome structure comprising:

a prepreg structural layer with a number of plies of fabric impregnated with a resin;

an inside matching layer adjacent to one side of the prepreg structural layer; and

an outside matching layer adjacent to the opposite side of the structural layer, both matching layers made of formable sheets of uncured resin including a dielectric constant reducing agent therein, the dielectric constant reducing agent including a plurality of gas filled microspheres.

38. A method of manufacturing a B-sandwich radome, the method comprising:

forming a layup of a radome shape including an inside matching layer, a structural layer, and an outside matching layer;

the structural layer including plies of fabric pre-impregnated with a resin; and

the matching layers each including uncured resin with a dielectric constant reducing agent therein, the dielectric constant reducing agent including a plurality of gas filled microspheres.

Assignments (17)
RELEASE OF SECURITY INTEREST Recorded Jun 10, 2024
From: ALTER DOMUS (US) LLC
To: COMMUNICATIONS & POWER INDUSTRIES LLC; CPI SATCOM & ANTENNA TECHNOLOGIES INC.; CPI RADANT TECHNOLOGIES DIVISION INC.; CPI ESSCO INC.
Reel/Frame 067678/0059 →
RELEASE OF FIRST LIEN SECURITY INTEREST (REEL 043349 / FRAME 0881) Recorded Oct 10, 2022
From: UBS AG, STAMFORD BRANCH
To: COMMUNICATIONS & POWER INDUSTRIES LLC; CPI RADANT TECHNOLOGIES DIVISION INC.; ASC SIGNAL CORPORATION; CPI MALIBU DIVISION
Reel/Frame 061639/0044 →
RELEASE OF SECOND LIEN SECURITY INTEREST (REEL 043349 / FRAME 0916) Recorded Oct 10, 2022
From: UBS AG, STAMFORD BRANCH
To: COMMUNICATIONS & POWER INDUSTRIES LLC; CPI RADANT TECHNOLOGIES DIVISION INC.; ASC SIGNAL CORPORATION; CPI MALIBU DIVISION
Reel/Frame 061639/0054 →
SECURITY AGREEMENT Recorded Oct 7, 2022
From: COMMUNICATIONS & POWER INDUSTRIES LLC; CPI SATCOM & ANTENNA TECHNOLOGIES, INC.; CPI RADANT TECHNOLOGIES DIVISION INC.; CPI ESSCO INC.
To: ALTER DOMUS (US) LLC, AS COLLATERAL AGENT
Reel/Frame 061623/0543 →
SECOND LIEN PATENT SECURITY AGREEMENT Recorded Jul 26, 2017
From: COMMUNICATIONS & POWER INDUSTRIES LLC; CPI RADIANT TECHNOLOGIES DIVISION INC.; ASC SIGNAL CORPORATION; CPI MALIBU DIVISION
To: UBS AG, STAMFORD BRANCH
Reel/Frame 043349/0916 →
RELEASE OF SECURITY INTEREST Recorded Jul 26, 2017
From: UBS AG, STAMFORD BRANCH
To: COMMUNICATIONS & POWER INDUSTRIES LLC; ASC SIGNAL CORPORATION; CPI MALIBU DIVISION; CPI RADIANT TECHNOLOGIES DIVISION INC.
Reel/Frame 043349/0649 →
FIRST LIEN PATENT SECURITY AGREEMENT Recorded Jul 26, 2017
From: COMMUNICATIONS & POWER INDUSTRIES LLC; CPI RADIANT TECHNOLOGIES DIVISION INC.; ASC SIGNAL CORPORATION; CPI MALIBU DIVISION
To: UBS AG, STAMFORD BRANCH
Reel/Frame 043349/0881 →
RELEASE OF SECURITY INTEREST Recorded Jul 26, 2017
From: UBS AG, STAMFORD BRANCH
To: COMMUNICATIONS & POWER INDUSTRIES LLC; CPI MALIBU DIVISION; CPI LOCUS MICROWAVE, INC.; CPI RADIANT TECHNOLOGIES DIVISION INC.; ASC SIGNAL CORPORATION
Reel/Frame 043358/0573 →
SECOND LIEN SECURITY AGREEMENT Recorded Mar 21, 2017
From: COMMUNICATIONS & POWER INDUSTRIES LLC; CPI MALIBU DIVISION; CPI LOCUS MICROWAVE, INC.; CPI RADANT TECHNOLOGIES DIVISION, INC.; ASC SIGNAL CORPORATION
To: UBS AG, STAMFORD BRANCH, AS COLLATERAL AGENT
Reel/Frame 042050/0862 →
RELEASE OF 2ND LIEN SECURITY INTEREST Recorded Mar 21, 2017
From: CORTLAND CAPITAL MARKET SERVICES LLC
To: COMMUNICATIONS & POWER INDUSTRIES LLC; CPI MALIBU DIVISION; CPI RADANT TECHNOLOGIES DIVISION, INC.
Reel/Frame 042045/0348 →
SECOND LIEN PATENT SECURITY AGREEMENT Recorded Sep 25, 2015
From: COMMUNICATIONS & POWER INDUSTRIES LLC; CPI MALIBU DIVISION; CPI RADANT TECHNOLOGIES DIVISION, INC.
To: CORTLAND CAPITAL MARKET SERVICES LLC, AS COLLATERAL AGENT
Reel/Frame 036687/0467 →
SECURITY INTEREST Recorded Apr 11, 2014
From: COMMUNICATIONS & POWER INDUSTRIES LLC, AS PLEDGOR; CPI MALIBU DIVISION, AS PLEDGOR; CPI RADANT TECHNOLOGIES DIVISION INC., AS PLEDGOR
To: UBS AG, STAMFORD BRANCH, AS COLLATERAL AGENT
Reel/Frame 032657/0219 →
RELEASE OF SECURITY INTEREST Recorded Apr 9, 2014
From: UBS AG, STAMFORD BRANCH, AS COLLATERAL AGENT
To: CPI RADANT TECHNOLOGIES DIVISION, INC., AS PLEDGOR
Reel/Frame 032635/0973 →
CHANGE OF NAME Recorded Mar 31, 2014
From: RADANT TECHNOLOGIES, INC.
To: CPI RADANT TECHNOLOGIES DIVISION INC.
Reel/Frame 032578/0145 →
SECURITY AGREEMENT Recorded Nov 18, 2013
From: CPI RADANT TECHNOLOGIES DIVISION INC.
To: UBS AG, STAMFORD BRANCH, AS COLLATERAL AGENT
Reel/Frame 031664/0776 →
RELEASE OF SECURITY INTEREST IN PATENTS Recorded Oct 1, 2013
From: MASSACHUSETTS GROWTH CAPITAL CORPORATION
To: RADANT TECHNOLOGIES, INC.
Reel/Frame 031324/0683 →
SECURITY AGREEMENT Recorded Apr 26, 2010
From: RADANT TECHNOLOGIES, INC.
To: ECONOMIC STABILIZATION TRUST
Reel/Frame 024286/0073 →