Integrated, closely spaced, high isolation, printed dipoles
View Patent ↗An antenna configuration includes two closely spaced antennas each positioned so as to be orthogonally polarized with respect to the other. The antenna configuration increases antenna isolation and reduces electromagnetic coupling between donor side antenna and repeat side antenna. The antennas include printed dipoles connected to respective transceivers through respective baluns to balance the non-symmetrical portions of the antenna feed paths to reduce unwanted radiation therein. Printed features such as chokes and non-symmetrical and non-parallel structures are preferably included in the ground plane of a multi-layer circuit board to reduce or eliminate circulating ground currents.
1. An antenna configuration for a repeater receiving and re-transmitting a signal, the antenna configuration comprising:
a generally planar shaped multi-layer circuit board;
a first planar antenna printed on at least a first layer of the generally planar multi-layer circuit board, the first planar antenna capable of transmitting and receiving energy associated with a predetermined frequency; and
a second planar antenna printed on at least the first layer of the multi-layer circuit board, the second planar antenna capable of transmitting and receiving energy associated with a predetermined frequency,
wherein
at least the first layer includes a ground plane having a non-symmetrical structure configured to reduce current, and
the first planar antenna and the second planar antenna are arranged in a co-planar orthogonal relation to each other.
2. The antenna configuration according to claim 1 , wherein the first planar antenna and the second planar antenna include two or more layers of the multi-layer circuit board.
3. The antenna configuration according to claim 1 , wherein the first planar antenna and the second planar antenna respectively include a first planar dipole and a second planar dipole.
4. The antenna configuration according to claim 1 , further comprising:
a first balun printed on the multi-layer circuit board; and
a second balun printed on the multi-layer circuit board;
wherein the first planar antenna and the second planar antenna are coupled to a first transceiver and a second transceiver respectively through the first balun and the second balun.
5. The antenna configuration according to claim 4 , further comprising a rotatable packaging structure having an indicator,
wherein
one of the first and the second transceivers includes a sounding signal transmitter,
an other of the first and the second transceivers is capable of receiving the sounding signal and activating the indicator,
the rotatable packaging structure is capable of facilitating rotation of the antenna configuration during a transmission of the sounding signal, and
the other of the first and the second transceivers is configured to activate the indicator when receiving the sounding signal so as to provide feedback relative to a parameter associated with the sounding signal to enable spatial repositioning of the antenna configuration based on the parameter.
6. The antenna configuration according to claim 1 , wherein the non-symmetrical structure configured to reduce current includes a ground structure having non-parallel shapes configured to reduce circulating ground currents in the ground plane.
7. The antenna configuration according to claim 1 , wherein the ground plane further includes a printed choke structure including a void, the printed choke structure configured to choke circulating ground currents.
8. The antenna configuration according to claim 1 , wherein the repeater includes a time division duplex (TDD) repeater.
9. A time division duplex (TDD) repeater receiving and re-transmitting a signal, the TDD repeater comprising: a generally planar shaped multi-layer circuit board arranged in a plane;
a first transceiver associated with the multi-layer circuit board;
a second transceiver associated with the multi-layer circuit board;
a first planar antenna printed on at least a first layer of the multi-layer circuit board in the plane, the first planar antenna coupled to the first transceiver and capable of radiating and receiving electromagnetic energy associated with a frequency; and
a second planar antenna printed on at least the first layer of the multi-layer circuit board in the plane, the second planar antenna coupled to the second transceiver and capable of radiating and receiving energy associated with a frequency,
wherein the first planar antenna and the second planar antenna are arranged in co-planar orthogonal relation to each other, and further wherein
at least the first layer includes a ground plane having a non-symmetrical structure configured to reduce current.
10. The TDD repeater according to claim 9 , wherein the first planar antenna and the second planar antenna include two or more layers of the multi-layer circuit board.
11. The TDD repeater according to claim 9 , wherein the first planar antenna and the second planar antenna respectively include a first planar dipole and a second planar dipole.
12. The TDD repeater according to claim 9 , further comprising:
a first balun; and
a second balun, wherein the first planar antenna and the second planar antenna are coupled to the first transceiver and the second transceiver respectively through the first balun and the second balun.
13. The TDD repeater according to claim 9 , wherein the frequency associated with the first transceiver is based upon an 802.11 station (STA) operating on a first frequency channel, and the frequency associated with the second transceiver is based upon an 802.11 STA operating on a second frequency channel.
14. The TDD repeater according to claim 9 , wherein the frequency associated with the first transceiver is based upon an 802.16 station (STA) operating on a first frequency channel, and the frequency associated with the second transceiver is based upon an 802.16 STA operating on a second frequency channel.
15. The TDD repeater according to claim 9 , wherein the non-symmetrical structure configured to reduce current includes a ground structure having non-parallel shapes configured to reduce circulating ground currents in the ground plane.
16. The TDD repeater according to claim 9 , wherein the ground plane further includes a printed choke structure including a void, the printed choke structure configured to choke circulating ground currents.
17. A time division duplex (TDD) repeater receiving and re-transmitting a signal, the TDD repeater comprising:
a generally planar shaped multi-layer circuit board arranged in a plane;
a first transceiver associated with the multi-layer circuit board;
a second transceiver associated with the multi-layer circuit board;
a first planar antenna printed on at least a first layer of the multi-layer circuit board in the plane, the first planar antenna coupled to the first transceiver and capable of radiating and receiving electromagnetic energy associated with a frequency; and
a second planar antenna printed on at least the first layer of the multi-layer circuit board in the plane, the second planar antenna coupled to the second transceiver and capable of radiating and receiving energy associated with a frequency,
wherein the first planar antenna and the second planar antenna are arranged in co-planar orthogonal relation to each other, and further comprising a rotatable packaging structure having an indicator, wherein:
one of the first and the second transceivers includes a sounding signal transmitter;
an other of the first and the second transceivers is capable of receiving a sounding signal and activating the indicator, the rotatable packaging structure is capable of facilitating rotation of the antenna configuration during a transmission of the sounding signal, and the other of the first and the second transceivers is configured to activate the indicator when receiving the sounding signal so as to provide feedback to a user relative to a parameter associated with the sounding signal to enable spatial repositioning of the antenna configuration based on the parameter.
18. A multi-layer circuit board arrangement in a time division duplex (TDD) repeater capable of receiving and re-transmitting a signal, the multi-layer circuit board arrangement comprising:
a multi-layer circuit board having a ground plane;
a first planar antenna printed on at least a first layer of the multi-layer circuit board in the plane, the first planar antenna capable of radiating and receiving electromagnetic energy associated with a frequency according to a first planar polarization direction; and
a second planar antenna printed on at least the first layer of the multi-layer circuit board in the plane, the second planar antenna capable of radiating and receiving energy associated with a frequency according to a second planar polarization direction different from the first planar polarization direction,
wherein the first planar polarization direction and the second planar polarization direction are orthogonal to each other, and
further wherein at least the first layer includes a ground plane having a non-symmetrical structure configured to reduce current coupled to the ground plane.
19. The multi-layer circuit board arrangement according to claim 18 , wherein the first planar antenna and the second planar antenna are closely spaced.
20. The multi-layer circuit board arrangement according to claim 18 , wherein the first planar antenna and the second planar antenna include a first planar dipole and a second planar dipole.
21. The multi-layer circuit board arrangement according to claim 18 , further comprising:
a first balun printed on the multi-layer circuit board; and
a second balun printed on the multi-layer circuit board, wherein the first planar antenna and the second planar antenna are coupled to a first transceiver and a second transceiver respectively through the first balun and the second balun.
22. The multi-layer circuit board arrangement according to claim 21 , wherein the first balun and the second balun are printed on at least one layer of the multi-layer circuit board.
23. The multi-layer circuit board arrangement according to claim 18 , wherein the non-symmetrical structure configured to reduce current includes a ground structure having non-parallel shapes configured to reduce circulating ground currents in the ground plane.
24. The multi-layer circuit board arrangement according to claim 18 , wherein the ground plane further includes a printed choke structure including a void, the printed choke structure configured to choke circulating ground currents.