IP Library Granted Patent US 8,121,283
Granted Patent B2
US 8,121,283 · App. 11/437,507 · Granted Feb 21, 2012

Tapered capacitive sensing structure

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Quick Facts
Patent No.
US 8,121,283
App. No.
11/437,507
Granted
Feb 21, 2012
Kind
B2
Abstract

A touchpad has interleaved conductive traces across a touchpad surface. Each conductive trace has a first end and a second end. The width of the first end is larger than the width of the second end. The interleaved conductive traces have a first group of conductive traces alternated with a second group of conductive traces.

Claims (42)

1. An apparatus, comprising:

a first plurality of interleaved conductive traces of a touchpad disposed along a first axis,

wherein each conductive trace has a first end and a second end, the width of the first end being larger than the width of the second end,

wherein each of the first plurality of conductive traces is coupled to a corresponding capacitive sensing input, and

wherein the first plurality of conductive traces comprises a second plurality of conductive traces and a third plurality of conductive traces arranged alternately along a second axis.

2. The apparatus of claim 1 , wherein the first end of the second plurality of conductive traces is adjacent to the second end of the third plurality of conductive traces.

3. The apparatus of claim 2 , wherein the width of each conductive trace of the second plurality of conductive traces at the first end is larger than the width of each conductive trace of the third plurality of conductive traces at the second end.

4. The apparatus of claim 3 , wherein the width of each conductive trace of the second plurality of conductive traces decreases gradually from the first end of the second plurality of conductive traces to the second end of the second plurality of conductive traces.

5. The apparatus of claim 4 , wherein the width of each conductive trace of the third plurality of conductive traces decreases gradually from the first end of the third plurality of conductive traces to the second end of the third plurality of conductive traces.

6. The apparatus of claim 1 , wherein one or more conductive trace of the second plurality of conductive traces is in the shape of a triangle, and one or more conductive trace of the third plurality of conductive traces is in the shape of a triangle.

7. The apparatus of claim 1 , wherein the first plurality of interleaved conductive traces are on a same layer.

8. The apparatus of claim 1 , wherein the second plurality of conductive traces is on a first plane, wherein the third plurality of conductive traces is on a second plane parallel to the first plane.

9. The apparatus of claim 1 , comprising:

a circuit board having a first side and a second side, the first plurality of interleaved conductive traces formed on the first side; and

a processing device coupled to the second side of the circuit board.

10. The apparatus of claim 9 , wherein the processing device is configured to measure capacitance on each of the corresponding capacitive sensing inputs.

11. The apparatus of claim 9 , wherein the first plurality of interleaved conductive traces form a single layer on the first side of the circuit board.

12. The apparatus of claim 9 , comprising:

an overlay adhered to the first side of the circuit board with a non-conductive adhesive layer.

13. A method for manufacturing a touchpad, comprising:

providing a circuit board having a first side and a second side;

forming on a plane, a plurality of interleaved pairs of conductive traces of a touchpad on the first side of the circuit board,

wherein each conductive trace has a first end and a second end, the width of the first end being larger than the width of the second end,

wherein each conductive trace is formed along a first axis,

wherein the plurality of interleaved pairs is arranged along a second axis, the second axis substantially orthogonal to the first axis, and

wherein each of the plurality of conductive traces is coupled to a corresponding capacitive sensing input.

14. A method for operating a touchpad, comprising:

providing a single layer of a plurality of interleaved pairs of conductive traces of a touchpad, each pair of conductive traces comprising a first conductive trace and a second conductive trace, each conductive trace having a first end and a second end, the width of the first end being larger than the width of the second end,

wherein the first end of the first conductive trace is adjacent to the second end of the second conductive trace and the second end of the first conductive trace is adjacent to the first end of the second conductive trace, and

wherein each of the conductive trace of the plurality of interleaved pairs of conductive traces is coupled to a corresponding capacitive sensing input;

measuring a capacitance variation of a conductive trace;

comparing a capacitance variation of at least one adjacent conductive trace to the conductive trace; and

determining a two-dimensional coordinate position on the touchpad based on the comparison.

15. The method of claim 14 , wherein determining a two-dimensional coordinate position comprises:

determining a first axis position of the touchpad based on the measurement; and

determining a second axis position of the touchpad using the comparison.

16. An apparatus, comprising:

a circuit board; and

means for measuring a two-dimensional coordinate position on a touchpad comprising the circuit board,

wherein the means for measuring are in a same layer and comprise a plurality of interleaved conductive traces, wherein each conductive trace has a first end and a second end, the width of the first end being larger than the width of the second end, and

wherein each of the plurality of conductive traces is coupled to a corresponding capacitive sensing input.

17. The apparatus of claim 16 , wherein the plurality of interleaved conductive traces comprises a first group of conductive traces alternated with a second group of conductive traces.

Assignments (7)
RELEASE OF SECURITY INTEREST Recorded Mar 16, 2022
From: MUFG UNION BANK, N.A.
To: CYPRESS SEMICONDUCTOR CORPORATION; SPANSION LLC
Reel/Frame 059410/0438 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 6, 2021
From: CREATOR TECHNOLOGY B.V.
To: WISTRON CORPORATION
Reel/Frame 055829/0838 →
CORRECTIVE ASSIGNMENT TO CORRECT THE 8647899 PREVIOUSLY RECORDED ON REEL 035240 FRAME 0429. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTERST. Recorded Nov 3, 2020
From: CYPRESS SEMICONDUCTOR CORPORATION; SPANSION LLC
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 058002/0470 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 13, 2016
From: CYPRESS SEMICONDUCTOR CORPORATION
To: CREATOR TECHNOLOGY B.V.
Reel/Frame 038259/0864 →
SECURITY INTEREST Recorded Mar 21, 2015
From: CYPRESS SEMICONDUCTOR CORPORATION; SPANSION LLC
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 035240/0429 →
PATENT SECURITY AGREEMENT Recorded Aug 28, 2012
From: CYPRESS SEMICONDUCTOR CORPORATION
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 028863/0870 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 18, 2006
From: PENG, TAO; QIN, ZHENG
To: CYPRESS SEMICONDUCTOR CORPORATION
Reel/Frame 017920/0202 →