IP Library Granted Patent US 7,315,479
Granted Patent B2
US 7,315,479 · App. 11/439,223 · Granted Jan 1, 2008

Redundant memory incorporating serially-connected relief information storage

Assignee: Matsushita Electric Industrial Co., Ltd.
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Quick Facts
Patent No.
US 7,315,479
App. No.
11/439,223
Granted
Jan 1, 2008
Kind
B2
Abstract

A relief processing section which performs a relief process with respect to a redundant memory comprises a plurality of defect relief sections each having shift register circuits (relief information storing section). The shift register circuits are connected in series so as to successively transfer data. A test circuit tests the redundant memory, and serially outputs relief information for relieving a defective cell. The relief processing section stores the relief information into the shift register circuits using a data transfer operation thereof.

Claims (27)

1. A semiconductor device comprising:

a redundant memory having a plurality of memory cells and a function of relieving a defective cell which is one of the memory cells which is defective;

a test circuit for performing a test on the redundant memory, and when determining that there is a defective cell, outputting a relief information for relieving the defective cell; and

a relief processing section having a plurality of defect relief sections each having a relief information storing section capable of storing the relief information, for performing a relieve process with respect to the redundant memory,

wherein the relief information storing sections are connected in series so as to successively transfer data, and

in an operation of storing the relief information, the test circuit outputs the relief information serially, and the relief processing section stores the relief information serially output from the test circuit into the relief information storing sections using a data transfer operation thereof.

2. The semiconductor device of claim 1 , wherein the device is capable of controlling whether or not to store the relief information output from the test circuit into the relief processing section, in accordance with an intake control signal supplied thereto.

3. The semiconductor device of claim 2 , further comprising an external input terminal for inputting the intake control signal from the outside of the semiconductor device.

4. The semiconductor device of claim 2 , wherein the data transfer operation of the relief information storing section is performed in accordance with a clock signal supplied thereto, and

the device further comprises:

a clock controller for controlling whether or not the clock signal is valid or invalid, in accordance with the intake control signal.

5. The semiconductor device of claim 1 , wherein each of the plurality of defect relief sections is configured to hold the relief information when the semiconductor device is powered off.

6. The semiconductor device of claim 5 , wherein each of the plurality of defect relief sections has an electric fuse element which is programmed based on the relief information stored in the relief information storing section.

7. The semiconductor device of claim 5 , wherein each of the plurality of defect relief sections has a non-volatile memory element in which memory data is set based on the relief information stored in the relief information storing section.

8. The semiconductor device of claim 1 , wherein:

the operation of the redundant memory and the test for the redundant memory by the test circuit are performed in accordance with a first clock; and

the relief information storing operation is performed in accordance with a second clock different from the first clock.

9. The semiconductor device of claim 8 , wherein:

in the relief information storing operation, the second clock is supplied to the test circuit, while an inverted-phase clock of the second clock is supplied to the relief processing section.

10. The semiconductor device of claim 1 , wherein:

the device comprises a plurality of pairs of the redundant memory and the relief processing section; and

the plurality of relief information storing sections serially connected of the respective plurality of relief processing sections are connected in series so as to successively transfer data.

11. The semiconductor device of claim 1 , further comprising:

a relief information external input terminal for inputting relief information from the outside of the semiconductor device; and

a selector for selecting and supplying one of the relief information output from the test circuit and the relief information input through the relief information external input terminal, to the relief processing section.

12. The semiconductor device of claim 1 , further comprising:

a relief information externally output terminal for outputting the relief information supplied to the relief processing section, to the outside of the semiconductor device.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 18, 2019
From: PANASONIC CORPORATION
To: NORTH PLATE SEMICONDUCTOR, LLC
Reel/Frame 048620/0757 →
CHANGE OF NAME Recorded Oct 25, 2018
From: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
To: PANASONIC CORPORATION
Reel/Frame 047322/0103 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 15, 2006
From: KUROZUMI, TOMOHIRO; AGATA, MASASHI; ICHIKAWA, OSAMU
To: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
Reel/Frame 018259/0228 →
Priority Claims (1)
JP 2005-155511 · May 27, 2005 · national
Continuity (1)
Related Publication 20060268633A1 · Nov 30, 2006