IP Library Granted Patent US 7,287,829
Granted Patent B2
US 7,287,829 · App. 11/442,413 · Granted Oct 30, 2007

Printhead assembly configured for relative movement between the printhead IC and its carrier

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 7,287,829
App. No.
11/442,413
Granted
Oct 30, 2007
Kind
B2
Abstract

A printhead assembly for an inkjet printer that has an elongate printhead integrated circuit (IC) defining an array of ejection nozzles fabrication using semiconductor etching and deposition techniques. The printhead IC is mounted in the printer with a chip carrier that has a channel for enclosing the printhead IC on three of its four longitudinal sides. Resiliently deformable material is positioned between the three longitudinal sides of the printhead IC and the channel to accommodate relative movement of the printhead IC and the chip carrier during normal handling of the print head assembly.

Claims (8)

1. A printhead assembly for an inkjet printer comprising:

an elongate printhead integrated circuit (IC) defining an array of ejection nozzles fabrication using semiconductor etching and deposition techniques;

a integrated circuit carrier for mounting the printhead IC in the printer, the integrated circuit carrier defining a channel for enclosing the printhead IC on three of its four longitudinal sides; and,

resiliently deformable material positioned between the three longitudinal sides of the printhead IC and the channel to accommodate relative movement of the printhead IC and the integrated circuit carrier during normal handling of the print head assembly.

2. A printhead assembly according to claim 1 further comprising an ink distribution manifold wherein the integrated circuit carrier is mounted to the ink distribution manifold.

3. A printhead assembly according to claim 2 wherein the integrated circuit carrier and the printhead IC are incorporated into a removable module, and the printhead assembly further comprising a retaining structure for mounting a number of the modules.

4. A printhead assembly according to claim 1 wherein the resiliently deformable material is an elastomeric material.

5. A printhead assembly according to claim 4 wherein the elastomeric material is in the form of a silicon based material.

Assignments (2)
CHANGE OF NAME Recorded Jun 25, 2014
From: ZAMTEC LIMITED
To: MEMJET TECHNOLOGY LIMITED
Reel/Frame 033244/0276 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 16, 2012
From: SILVERBROOK RESEARCH PTY. LIMITED AND CLAMATE PTY LIMITED
To: ZAMTEC LIMITED
Reel/Frame 028559/0239 →