Method of manufacturing liquid crystal display

1. A method of manufacturing liquid crystal displays, said method comprising the steps of:

providing a panel assembly structure comprising

a first substrate, a second substrate and a plurality of sealants,

the first substrate and the second substrate being disposed parallel to each other,

the sealants connecting inner surfaces of the first substrate and the second substrate,

the first substrate comprising a plurality of first regions,

the second substrate comprising a plurality of second regions corresponding to the first regions, respectively,

each first region of the first substrate, the corresponding second region of the second substrate and the corresponding sealant together forming an LCD panel, and

the second substrate further comprising, on the inner surface thereof and in each second region, outer leads of the corresponding LCD panel;

adhering a first polarizer on an outer surface of the first substrate, the first polarizer comprising a plurality of third regions corresponding to the first regions of the first substrate, respectively;

cutting the first polarizer to separate the third regions of the first polarizer into separated second polarizers each for a respective one of the LCD panels;

cutting the first substrate, without cutting at the same time the second substrate, to separate the first regions of the first substrate into separated third substrates each for a respective one of the LCD panels, wherein the step of cutting the first substrate exposes the outer leads on the inner surface of the second substrate;

adhering a third polarizer on an outer surface of the second substrate, the third polarizer comprising a plurality of fourth regions corresponding to the second regions of the second substrate, respectively;

cutting the third polarizer to separate the fourth regions of the third polarizer into separated fourth polarizers each for a respective one of the LCD panels; and

after the steps of cutting the first substrate and the third polarizer, cutting the second substrate to separate the second regions of the second substrate into separated fourth substrates each for a respective one of the LCD panels, so that the LCD panels are separated from each other.

2. The method according to claim 1 , wherein the steps of cutting the first and third polarizers are performed by using excimer lasers or carbon dioxide lasers.

3. The method according to claim 1 , wherein the steps of cutting the first and second substrates are performed by using carbon dioxide lasers.

4. The method according to claim 1 , wherein

each third substrate and the corresponding fourth substrate are a color filter substrate and a thin film transistor substrates, respectively,

each thin film transistor substrate is larger than the corresponding color filter substrate,

the outer leads on the inner surface of each thin film transistor substrate are positioned adjacent and beyond a lateral side of the corresponding color filter substrate, and

wherein before the step of cutting the second substrate, the method further comprises the step of:

disposing a chip on each thin film transistor substrate through a chip on glass (COG) process, the chip being electrically connected to the outer leads of the corresponding LCD panel.

5. The method according to claim 1 , wherein

each third substrate and the corresponding fourth substrate are a color filter substrates and a thin film transistor substrates, respectively,

each thin film transistor substrate is larger than the corresponding color filter substrate,

the outer leads on the inner surface of each thin film transistor substrate are positioned adjacent and beyond a lateral side of the corresponding color filter substrate, and

wherein before the step of cutting the second substrate, the method further comprises the steps of:

grinding the edges of the thin film transistor substrates and beveling the corners of the thin film transistor substrates; and

disposing a package on each ground and beveled thin film transistor substrate through a tape automatic bonding (TAB) process, the package being electrically connected to the outer leads of the corresponding LCD panel.

6. The method according to claim 1 , wherein, between the step of adhering the third polarizer and the step of cutting the second substrate, the method further comprises the steps of:

electrically connecting a plurality of test cards to the LCD panels, respectively, via the outer leads which have been exposed by the step of cutting the first substrate;

correspondingly inputting a plurality of testing signals to the LCD panels by the respective test cards, and

observing the image quality of the LCD panels under light-emission.

7. The method according to claim 1 , wherein, between the step of adhering the third polarizer and the step of cutting the second substrate, the method further comprises the steps of:

while moving a test card relatively to the LCD panels, electrically connecting the test card to one LCD panel at a time, via the outer leads which have been exposed by the step of cutting the first substrate;

inputting a testing signal to the LCD panels one by one by the test card, and

observing the image quality of each LCD panel under light-emission.

8. The method according to claim 1 , wherein before the step of cutting the first substrate, the method further comprises the step of:

filling a liquid crystal material in each LCD panel, between the corresponding first region of the first substrate and the corresponding second region of the second substrate, and to be surrounded by the corresponding sealant.

9. The method according to claim 1 , wherein the steps of cutting the first polarizer and first substrate are performed before the step of adhering the third polarizer on the outer surface of the second substrate.

10. The method according to claim 1 , wherein the steps of cutting the first polarizer and first substrate are performed after the step of adhering the third polarizer on the outer surface of the second substrate.

11. The method according to claim 1 , further comprising, after the step of cutting the first substrate and before the step of cutting the second substrate,

the step of testing the LCD panels by inputting testing signals to the LCD panels via the outer leads which have been exposed by the step of cutting the first substrate.