IP Library Granted Patent US 7,861,408
Granted Patent B2
US 7,861,408 · App. 11/447,327 · Granted Jan 4, 2011

Heat transfer surface for electronic cooling

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Quick Facts
Patent No.
US 7,861,408
App. No.
11/447,327
Granted
Jan 4, 2011
Kind
B2
Abstract

A cooling surface for cooling an electronic component, the surface having two sets of fins, each set of fins defining a set of channels, and a number of passageways connecting the sets of channels. The cooling surface can be attached to an electronic component, such as a chip, and refrigerant supplied to at least one of the sets of channels. When the temperature of the electronic component rises, the heat is transferred to the refrigerant in the cooling surface, at least some of which vaporizes to carry heat away from, and facilitate cooling of, the component.

Claims (10)

1. A method of forming a cooling system for transferring heat from an electronic component comprising:

a. providing a blank comprising a first side and a second side opposite to the first side;

b. forming a first set of fins extending from the first side of the blank and defining a first set of channels;

c. forming a second set of fins extending from the second side of the blank and at an acute angle to the first set of fins, the second set of fins defining a second set of channels;

d. creating a plurality of passageways extending through the blank and connecting the first and second sets of channels;

e. stretching the blank after at least some of the fins are formed; and

f. attaching the blank to an electronic component.

2. The method of claim 1 , wherein the blank comprises a thickness and at least some of the channels of the first or second set of channels extend more than halfway through the blank thickness to create a plurality of passageways that extend through the blank and connect the first and second sets of channels.

3. The method of claim 1 , wherein forming the first and second sets of fins comprises cutting layers into the blank and lifting the layers to form the fins.

4. The method of claim 1 , wherein the fins of the first set of fins and the second set of fins comprise tips and wherein the method further comprises flattening the tips of at least some of the fins of either the first or second set of fins.

Assignments (6)
RELEASE OF SECURITY INTEREST Recorded Nov 6, 2013
From: JPMORGAN CHASE BANK, N.A.
To: WOLVERINE TUBE, INC.; WOLVERINE JOINING TECHNOLOGIES, LLC
Reel/Frame 031554/0920 →
SECURITY AGREEMENT Recorded Oct 24, 2013
From: WOLVERINE TUBE, INC.
To: PNC BANK, NATIONAL ASSOCIATION
Reel/Frame 031485/0767 →
TERMINATION AND RELEASE Recorded May 23, 2013
From: U.S. BANK NATIONAL ASSOCIATION
To: WOLVERINE TUBE, INC.; TUBE FORMING, L.P.; WT HOLDING COMPANY INC.; WOLVERINE JOINING TECHNOLOGIES, LLC
Reel/Frame 030487/0555 →
SECURITY AGREEMENT Recorded Nov 15, 2011
From: WOLVERINE TUBE, INC.; WOLVERINE JOINING TECHNOLOGIES, LLC
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 027232/0423 →
SECURITY AGREEMENT Recorded Jul 8, 2011
From: WOLVERINE TUBE, INC.
To: U.S. BANK NATIONAL ASSOCIATION
Reel/Frame 026562/0557 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 27, 2006
From: THORS, PETUR
To: WOLVERINE TUBE, INC.
Reel/Frame 018314/0432 →