Soft mold having back-plane attached thereto and method for fabricating the soft mold
View Patent ↗A soft mold includes a polymer layer having a printing pattern on at least a first surface thereof; and a back-plane attached to a second surface of the polymer layer.
1. A method for fabricating a soft mold comprising:
preparing master mold having a predetermined pattern;
positioning the master mold in a jig for performing the processes of forming a polymer layer;
forming a pre-polymer layer on the master mold in the jig and curing the prepolymer to form a polymer;
applying an oxygen plasma treatment to a surface of the polymer layer, wherein the surface of the polymer layer is not a surface facing the predetermined pattern of the master mold;
applying a coupling agent treatment to the surface of the polymer layer;
positioning the polymer layer in a vacuum chamber to perform attaching a back-plane to the surface of the polymer layer by moving a stage driver of the vacuum chamber up so as to attach the back-plane to the surface of the polymer layer; and
separating the polymer layer having the back-plane attached thereto from the master mold.
2. The method of claim 1 , wherein the prepolymer layer includes an elastic polymer material.
3. The method of claim 1 , wherein the prepolymer layer is selected from the group consisting of polydimethylsiloxane, polyurethane, polyimide, epoxy and novolac.
4. The method of claim 1 , wherein the prepolymer layer includes at least one of polydimethylsiloxane, polyurethane, polyimide, epoxy and novolac.
5. The method of claim 1 , wherein the applying the oxygen plasma treatment to the surface of the polymer layer includes substituting compounds from the surface of the polymer layer with ‘—OH’ groups.
6. The method of claim 1 , wherein the applying the coupling agent treatment includes applying a silane coupling agent.
7. The method of claim 1 , wherein the vacuum chamber is provided with a jig supporter for supporting the jig, a stage on which the back-plane is loaded, and the stage driver for moving the stage up and down.
8. The method of claim 1 , wherein the attaching the back-plane to the polymer layer is performed in a vacuum.
9. The method of claim 1 , further comprising a venting process after attaching the back-plane to the surface of the polymer layer.
10. The method of claim 1 , wherein the preparing the master mold includes depositing an insulating material layer on an insulating substrate and patterning the deposited insulating material layer by photolithography to form the predetermined pattern on the insulating substrate.
11. The method of claim 1 , wherein the forming the pre-polymer layer on the master mold includes:
forming a first prepolymer layer on the master mold in the jig;
positioning a film on a surface of the first prepolymer layer;
forming a second prepolymer layer on the first prepolymer layer including the film in the jig.
12. The method of claim 11 , wherein the first and second prepolymer layers are concurrently cured after forming the second prepolymer layer.
13. The method of claim 11 , wherein the first prepolymer layer is cured before the positioning of the film.
14. The method of claim 11 , wherein the film includes a magnetic material.